More China Wafer Level Csp Co., Ltd. Class A news
China Wafer Level Csp Co., Ltd. Class ASSE: 603005

Announcement on Implementation of Dividend Distribution for 2023

May 18, 2024 · Issued by China Wafer Level Csp Co., Ltd. Class A via Shanghai Stock Exchange

Announcement on Implementation of Dividend Distribution for 2023

The abstract is for reference only. Please refer to the full text of the announcement on the very day.

Link of Full Text for Reference:
View Attachment