Epoxy Base Electronic Material Corp. Ltd.SSE: 603002

(603002)"Epoxy Base Electronic Material Corporation Limited"Announcement on Proposed Signing of Project Investment Agreement by Wholly-owned Sub-subsidiary with the Administrative Committee of Zhuhai Economic and Technological Development Zone for the "Zhuhai Hongren High-end Copper Clad Laminate and Prepreg Construction Project"

· Issued by Epoxy Base Electronic Material Corp. Ltd. via Shanghai Stock Exchange

Filed with SSE · Stock code 603002 ·

Announcement on Proposed Signing of Project Investment Agreement by Wholly-owned Sub-subsidiary with the Administrative Committee of Zhuhai Economic and Technological Development Zone for the "Zhuhai Hongren High-end Copper Clad Laminate and Prepreg Construction Project"

The abstract is for reference only. Please refer to the full text of the announcement on the very day.

6ix is reading this filing.

View original source (Shanghai Stock Exchange)Epoxy Base Electronic Material Corp. Ltd. on 6ix

Story so far

Earlier from Epoxy Base Electronic Material

All Epoxy Base Electronic Material news releases