Ample Electronic Technology Co., Ltd. · TPEX:4760

Ample Electronic Technology — 2020 Investor Conference

21 slides from Ample Electronic Technology's conference presentation, Nov 18, 2020

  1. Slide 1: AMPLE Electronic Technology 2020 Investor Conference

    AMPLE Electronic Technology CO., LTD Stock code:4760 AMPLE Electronic Technology Co., LTD 2020 Investor Conference 2020.11.18 www.ampletec.com.tw

  2. Slide 2: Disclaimer

    Disclaimer ‧This presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. ‧ Except as required

  3. Slide 3: Outline

    Outline 01.Company Overview 02.Core Technology and Competitive Advantage 03.Business Performance 3

  4. Slide 4: Introduction

    Introduction Established: June 8, 2007 Capital: NTD 306,000,000 Main Products：Conductive Paste Location： No.32, Dayou 3rd St., Daliao Dist, Kaohsiung City, Taiwan 4

  5. Slide 5: Milestones

    Milestones •Established “Ample Electronic Technology Co., Ltd.” Obtained authentication of ISO 9001, successfully developed conductive Ag paste applied to passive components 2007 •Marketing the world under our own brand "ample" • Developed silver paste for Patch Antenna、high-temperature conductive C

  6. Slide 6: Outline

    Outline 01.Company Overview 02.Core Technology and Competitive Advantage 03.Business Performance 6

  7. Slide 7: Applications of Conductive paste

    Applications of Conductive paste B A C Paste E D 7

  8. Slide 8: Lithography Metal Paste

    Lithography Metal Paste  Product Features: Application in Fine pitch Inner layer electrode for smaller size component (01005). • Negative tone silver paste • Design for alkaline developer • Vertical sidewalls • Near UV(350-405nm) Processing • Application for High-Q Chip  Production apacity shift t

  9. Slide 9: Technical trend and core of printable internal electrodes for MLCC

    The technical trend and core of printable internal electrodes for multi-layer ceramic chip  Industrial trend: Performance requirements of  Core Technique terminals-Light、Thinner、Short、smaller Surface modification of Organic material control silver powder Chip size(mm) ~4532 0402 0201 01005 and adj

  10. Slide 10: High-Temperature Sintered Copper Paste for MLCC Outer Electrode

    High-Temperature Sintered Copper Paste for MLCC Outer Electrode  Industry Trends :  Core Technology : Organic Compounds Formula Copper Paste  Technical Achievements :  Lead-free zinc oxide glass frit diffusion control technology Glass Frit Manufacturing prevents vertical cracking issues Formula

  11. Slide 11: Low temperature cure Pastes for Terminal Electrodes

    Low temperature cure Pastes for Terminal Electrodes  Application Trend : Industrial Electronics Consumer Electronics Wearable Devices Automotive Electronics *Reference from AVX Company :Flexisafe MLCC Termination Device Analysis Report  Product Features : Used for terminal electrodes of passive co

  12. Slide 12: Technical trend and core of silver paste for IC packaging

    The technical trend and core of silver paste for IC packaging  Industrial trend: IC packaging leads to miniaturization,  Core Technique high-power, and high-density packaging, resulting in a relatively increase in the heat generated by the operation Surface modification of of the chip. Above it is

  13. Slide 13: R&D expenses invested

    R&D expenses invested 2020 Year 2017 2018 2019 Q1〜Q3 R&D expenses accounted for revenue ratio 4% 5% 5% 3% Revenue 612,787 713,249 589,199 849,660 13

  14. Slide 14: Outline

    Outline 01.Company Overview 02.Core Technology and Competitive Advantage 03.Business performance 14

  15. Slide 15: Balance Sheets 2017-2020Q3

    Balance Sheets 2017〜2020Q3 In Thousands of New Taiwan Dollars 2017 2018 2019 2020.Q3 Year Amount % Amount % Amount % Amount % Cash and cash equivalents 110,633 16 96,170 12 87,164 11 95,643 9 Other current assets 372,761 53 445,222 56 450,797 58 705,445 68 Non-current assets 214,634 31 254,555 32 25

  16. Slide 16: Statements of Comprehensive Income 2017-2020Q3

    Statements of Comprehensive Income -2017〜2020Q3 In Thousands of New Taiwan Dollars 2017 2018 2019 2020Q1〜Q3 Year Amount % Amount % Amount % Amount % Revenue 612,787 100% 713,249 100% 589,199 100% 849,660 100% Gross 119,524 20% 166,951 24% 123,650 21% 184,046 22% Profit Operating 41,954 7% 67,890 10%

  17. Slide 17: Operating Results - Income Statement

    Operating Results- Income Statement 900,000 3.23 3.50 800,000 3.00 700,000 2.20 2.50 600,000 500,000 1.58 2.00 400,000 1.50 1.03 300,000 1.00 200,000 0.50 100,000 0 0.00 2017 2018 2019 2020.Q1-Q3 Revenue Gross Profit 單位：新台幣仟元 Year 2017 2018 2019 2020.Q1〜Q3 Item Revenue 612,787 713,249 589,199 849,66

  18. Slide 18: Statements of Comprehensive Income - YoY

    Statements of Comprehensive Income -YoY Year 2020.Q3 2020.Q2 2020.Q1 2020.Q1〜Q3 2019.Q1〜Q3 YoY Revenue 293,151 307,279 249,230 849,660 399,984 112.42% Gross Profit 60,663 71,554 51,829 184,046 83,899 119.37% Operating Incomes 40,202 46,971 28,426 115,599 20,777 456.38% EBIT 38,186 44,052 33,018 115,

  19. Slide 19: 3Q20 Revenue YoY 149.33%

    3Q20 Revenue YoY 149.33% 2018-2020 Q Revenue 2018 2019 2020 350,000 307,279 300,000 293,151 249,230 250,000 213,110 200,000 189,215 165,082 167,811 167,246 144,651 137,758 150,000 117,575 100,000 50,000 0 1Q 2Q 3Q 4Q 19

  20. Slide 20: Dividend Policy

    Dividend Policy Year 2016 2017 2018 2019 EPS 1.34 1.58 2.20 1.03 (NT$) Dividends 0.80 0.90 1.40 1.20 (NT$) Dividend Payout Ratio(%) 59.70% 56.96% 63.64% 116.50% 20

  21. Slide 21: Vision

    Vision 凱 勤 歌 奮 長 開 奏 拓 盛 質 名 優 揚 良 21

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