Ample Electronic Technology Co., Ltd. · TPEX:4760
Ample Electronic Technology — 2021 Investor Conference
31 slides from Ample Electronic Technology's conference presentation, Mar 19, 2021
Slide 1: 2021 Investor Conference
AMPLE Electronic Technology CO., LTD Stock code:4760 AMPLE Electronic Technology Co., LTD 2021 Investor Conference 2021.03.19 www.ampletec.com.tw
Slide 2: Disclaimer
Disclaimer ‧This presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. ‧ Except as required
Slide 3: Outline
Outline Company Overview Market Outlook Financial Review & Guidance Core Technology & Advanced Technology Development Q&A 3
Slide 4: Company Overview
ME em. Outline [oo >Company Overview
Slide 5: Introduction
Introduction Established: June 8, 2007 Capital: NTD 308,154,200 Main Products：Conductive Paste (Cu paste & Ag paste ) Location： No.32, Dayou 3rd St., Daliao Dist, Kaohsiung City, Taiwan 5
Slide 6: Market Outlook
ME em. Outline [oo >Market Outlook
Slide 7: Industry Overview
Industry Overview The star industry in 2021 will focus on semiconductors and automotive themes Looking forward to 2021, star industries such as semiconductors, electric vehicles, price increases, 5G, and long-distance demand, which will drive foundry, IC design, Wi-Fi 6, silicon wafers, equipment ma
Slide 8: Growth Momentum
Growth Momentum 2022 EMI Shielding Graphene Thermal Conductor 2021 Lithography Ag paste LED package paste 2020 Ag paste for Resistor Rear Ag paste for Solar Cell 8
Slide 9: Financial Review & Guidance
Outline Financial Review & Guidance 9
Slide 10: Business Performance in 2020
Business Performance in 2000 Penetrate into Korea Market Hit the record high of Revenue Shipments of Ag paste (Resistors, Solar Cell) increase by 5 times 10
Slide 11: Product Mix
Product Mix 2019 2020 Solar Cell 3% Solar Cell 8% Passive Passive component component 97% 92% Solar Cell Resistor MLCC & MLCI 107% 464% 637% 8,000 150,000 8000 6,000 6000 100,000 4000 4,000 50,000 2000 2,000 0 0 0 2019 2020 2019 2020 2019 2020 11
Slide 12: Earnings Trend
Earnings Trend Net profie, 4Q20=NT$43,292k, QoQ 40%, YoY 262% EPS 4Q20=1.51, 3Q20=1.08 Earnings & growth trend NT$ EPS 60,000 900.00% 1.60 800.00% 50,000 1.40 700.00% 600.00% 1.20 40,000 500.00% 400.00% 1.00 30,000 300.00% 200.00% 0.80 20,000 100.00% 0.60 10,000 0.00% -100.00% 0.40 0 -200.00% 0.
Slide 13: Statements of Comprehensive Income
Statements of Comprehensive Income (Unit: NT Thousand ) 2020Y 2019Y YoY 2018Y Net revenue 1,213,542 589,199 106% 713,249 Gross profit 255,887 123,650 107% 166,951 Gross margin(%) 21.09% 20.99% 23.41% Operating expenses (90,721) (84,351) 8% (99,061) Operating expenses rate(%) -7.48% -14.32% -13.89% O
Slide 14: Balance Sheets
Balance Sheets 2020/12/31 2019/12/31 (Unit: NT Thousand ) $ % $ % Cash and cash equivalents 84,870 8% 87,164 11% Accounts receivable, net 483,680 43% 227,081 29% Inventories 245,619 22% 195,433 25% Other current assets 58,890 5% 28,283 4% Total current assets 873,059 78% 537,961 69% Property, plant
Slide 15: Non-operating income and expenses
Non-operating income and expenses (Unit: NT Thousand ) 2020Y 2019Y Foreign exchange gains 755 476 Net gains on disposal of financial assets / liabilities at fair value through profit or loss 5,930 (1,113) Gains on call options / put options of Convertible bonds payable ,net 487 - Gains on disposal o
Slide 16: 2020-2021 Monthly Revenue YoY
2020〜2021 Monthly Revenue YoY Jan Feb Mar Apr May June July Aug Sep Oct Nov Dec Accumulated 2019 51,004 50,479 43,168 43,637 47,232 46,889 37,171 40,068 40,337 50,044 65,917 73,253 589,199 2020 80,640 82,699 85,892 101,307 104,752 101,221 90,835 91,257 108,755 118,460 123,589 124,137 1,213,542 2121
Slide 17: 2021 Guidance
2021 Guidance Revenue of 1Q21 is expected to increase by more than 10% QoQ. The gross margin of 1Q21 is expected to be flat. 17
Slide 18: Dividend Policy
Dividend Policy Year 2017 2018 2019 2020 EPS (NT$) 1.56 2.20 1.03 4.74 Dividends (NT$) 0.90 1.40 1.20 3.20 Dividend Payout Ratio(%) 57.69% 63.64% 116.50% 67.51% 18
Slide 19: Core Technology & Advanced Technology Development
Outline Core Technology & Advanced Technology Development 19
Slide 20: Applications of Conductive Paste
Applications of Conductive paste B A C Paste E D 20
Slide 21: Printable internal electrodes for multi-layer ceramic chip
The technical trend and core of printable internal electrodes for multi-layer ceramic chip Industrial trend: Performance requirements of Core Technique terminals-Light、Thinner、Short、smaller Surface modification of Organic material control silver powder Chip size(mm) ~4532 0402 0201 01005 and adj
Slide 22: Lithography Metal Paste
Lithography Metal Paste Product Features: Application in Fine pitch Inner layer electrode for smaller size component (01005). • Negative tone silver paste • Design for alkaline developer • Vertical sidewalls • Near UV(350-405nm) Processing • Application for High-Q Chip Production apacity shift t
Slide 23: Lithography Metal Paste
ample ELECTRONIC TECHNOLOGY gion wo 2 esp, BK | ho 2020 F LESH SEH Se IRIE Sig Me ee ee ed oR We Y#R@ 109 #12 R128 PRLEe A PIE ¥ Certificate of Merit _ by the Kaohsiung Branch, Chemical Society Located in Taipei for * Poster Competition; Excellent Achievement Award. oy Aw Professot Ming-Jung Wu Pres
Slide 24: High-Temperature Sintered Copper Paste for MLCC Outer Electrode
High-Temperature Sintered Copper Paste for MLCC Outer Electrode Industry Trends : Core Technology : Organic Compounds Formula Copper Paste Technical Achievements : Lead-free zinc oxide glass frit diffusion control technology Glass Frit Manufacturing prevents vertical cracking issues Formula
Slide 25: Low temperature cure Pastes for Terminal Electrodes
Low temperature cure Pastes for Terminal Electrodes Application Trend : Industrial Electronics Consumer Electronics Wearable Devices Automotive Electronics *Reference from AVX Company :Flexisafe MLCC Termination Device Analysis Report Product Features : Used for terminal electrodes of passive co
Slide 26: Semiconductor packaging die-attach Ag adhesive
Semiconductor packaging die-attach Ag adhesive Applied on LED thermal conductive die-attach adhesive and power semiconductor packaging 5 4.7 4.5 Thermal conductivity (W/mK) 4 3.5 3 Curing condition: 2.5 180℃, 60 min 2 1.5 1 0.8 0.5 0 0 wt% 7 wt% Conventional Ag paste MO paste Addition amount of MO
Slide 27: Development of New Technologies
Development of New Technologies 27
Slide 28: Mini-LED Opportunity and Application for Die Attach Ag Glue
Mini-LED Opportunity and Application for Die Attach Ag Glue • For smaller LED chips die attach shall apply the Core- smaller needle for speeding up dispensing Ag Technology : glue to substrate to reach UPH higher than 0.4 10,000. 100 200C 0.3 AI-8500DFN 185C By using Rheological analysis technolog
Slide 29: Heat-conducting of graphene
Heat-conducting of graphene Schematic diagram of heat conduction path Schematic diagram of structure Ineffective heat- Effective heat- conducting of z-axis conducting of z-axis treatment Two-dimensional Three-dimensional Two-dimensional Diagram of three-dimensional stacked graphene creased graphene
Slide 30: Resistor BME Process Trend and Copper Positive Conduction Technology
Resistor BME Process Trend and Core of Copper Positive Conduction Technology Industry Trend: Reliability performance in high temperature Glass modification Temperature coefficient control and high humidity environment Core (Chemical resistance) (Directivity) Technology : 添加物區域代稱 添加物種類 電阻率 TCR 移動
Slide 31: 願景
願景 凱 勤 歌 奮 長 開 奏 拓 盛 質 名 優 揚 良 31
Ample Electronic Technology — 2021 Investor Conference on 6ix