Enablence Technologies Inc. · TSXV:ENA
Enablence Technologies — Investor Presentation (September 2026)
25 slides from Enablence Technologies's investor presentation, September 2026
Slide 1: Enablence Technologies Inc.
Enablence Technologies Inc. At the heart of the Optical Future TSXV: ENA September, 2026
Slide 2: Disclaimer
Disclaimer CAUTIONARY NOTE REGARDING FORWARD-LOOKING INFORMATION: The information contained in this presentation has been prepared by Enablence Technologies Inc. ("Enablence" or the "Company"). This presentation includes information, statements, beliefs and opinions which are forward-looking, and wh
Slide 3: Vision and Mission
Vision The world's CPUs, GPUs and robotic sensors are optical – faster, cooler, and sustainable at any scale Mission Deliver the Optical Solutions that power the future of AI and Robotics Enablence 3
Slide 4: $7T AI buildout
Enablence manufactures the Optical Chips foundational to the 1 $7T AI buildout … Optical chips are the core of networking, sensing and compute Datacenter Interconnect Robotics & Automation Non-Invasive Medical Imaging 5G/6G Telecom Autonomous Vehicles Aerospace & Defense 1 Source: $7 Trillion Projec
Slide 5: Network Upgrade Cycles Accelerating to Meet AI Demands
Network Upgrade Cycles Accelerating to Meet AI Demands Interconnect is the #2 Spending Category in Datacenter Buildouts 2026 Datacenter % of Spend 63% 11% 7% 15% 4% 6% 15% Increased interconnect spend: Historical Datacenter % of Spend 60% 18% 12% 6% 4% result of shorter upgrade cycles and accelerate
Slide 6: Global Optical Spend: Wafers/Components/Optical Engines
Global Optical Spend: Wafers/Components/Optical Engines TAM Growth 2026 - 2030 22% CAGR 50 2030: 40 $46B 30 Today: 20 $20B 10 0 2026 2027 2028 2029 2030 Total PLC Wafers Total Fiber Components Total Optical Engines Vertical expansion from PLC wafers to components and optical engines increases Enable
Slide 7: Over 15 million Enablence Chips Deployed Worldwide to date
Over 15 million Enablence Chips Deployed Worldwide to date AI Communications AI Sensing AI Compute Traditional fibre optics data transmission Range of applications from medical to manufacturing to Leveraging optics to 7 LiDAR increase AI compute
Slide 8: We're winning against the Chip Fabrication Competition
We’re winning against the Chip Fabrication Competition China Ex-China Silicon Photonics Enablence 8
Slide 9: Enablence is expanding up the value chain
Enablence is expanding up the value chain Increase revenue & TAM Diversify product portfolio Meet our customer demand Wafers* & Chips Assemblies** Modules OCS Systems Since 2003 FY26 & 27 FY27 & 28 FY27 & 28 *Each 150mm wafer generates ~$625 in revenue at over 600 chips/wafer **Each assembly consume
Slide 10: Enablence Manufactures 100% outside of China
Enablence Manufactures 100% outside of China Research & Design: Ontario, Canada Wafer Fabrication*: China Sales Fremont, CA Suzhou *The only non-captive volume PLC fabrication facility in North America Optical Component Assembly: Vietnam Sovereign Gap 60% Sovereign Gap Share 60% 50% Share $11B 50% 4
Slide 11: Enablence Inflection Point
Enablence Inflection Point Revenues ($000s) Gross Margins 35000 100% 30000 50% 25000 0% 20000 -50% 15000 -100% 10000 5000 -150% 0 -200% FY22 FY23 FY24 FY25 FY26 FY27 FY22 FY23 FY24 FY25 FY26 FY27 Enablence invested in tooling to grow capacity in FY23 & 24 creating margin Over 271% revenue growth FY2
Slide 12: Capacity growing with 5yr CAGR of 144%
Capacity growing with 5yr CAGR of 144% …leading to 1000 150mm wafers per week in CY2026 SOLD OUT. Current 600+ wafer/wk production and future 1000 wafer capacity is fully committed to existing customer orders Enablence 11
Slide 13: Transformation to AI Scale
Transformation to AI Scale Scaling/Diversification – 1,000 w/w at 95%+ yield FY 27 - Today Execution – Build Team, add product lines Milestone – Targeting operational profitability Scaling – 1,000 w/w at 95%+ yield FY 26 - Year 5 Execution – Completed equipment installation and qualification Milesto
Slide 14: Key FY26 Accomplishments
Key FY26 Accomplishments Installation qualified* capital equipment to enable 1,000 $8M wafers / week by November 2026 (+150% YoY) supporting an expected >$2M monthly run rate (+35% YoY) Significantly limited by Installation qualified* assembly plant in Hanoi to 30,000 capacity constraints assemblies
Slide 15: The Enablence IP Advantage
The Enablence IP Advantage The Optical Chip Industry’s BEST device performance (Networking CWDM): 0.01dB loss per cm 1dB insertion loss 25dB cross talk 0.2dB PDL Proprietary AI models driving accurate, efficient design, production, and test of Enablence Optical systems 17 key patents covering optica
Slide 16: Near Term Roadmap
Near Term Roadmap FY27 July 2026 October 2026 January 2027 April 2027 June 2027 Launch Production of Profitability at ~800 Ramp 2nd facility Begin transition to 200mm higher margin 150mm wafers/week wafer production wafer production (25% assemblies and production levels margin increase) engines util
Slide 17: Leadership
Leadership Todd Haugen Zheng Chen CEO VP of Sales & Marketing, President EMEA Todd has 30 years of experience across consulting, startups, and large-scale Zheng has over two decades of experience in semiconductor and systems engineering. He led teams at Accenture and Interworld and spent two decades
Slide 18: Board
Board Derek Burney Chairman Mr. Burney was a member of the Microsoft Corporation Executive Team from 2004 – 2020, having served most recently as Corporate Vice President/ Distinguished Evangelist. In this role Mr. Burney led industry technical engagements within the Commercial Software Engineering (
Slide 19: Thank You
Thank You Contact Media & Investor Relations: Mark Roberts, Blueshirt Capital Advisors LLC mark@blueshirtgroup.com Management: Todd Haugen, CEO Bob Piper, Chief of Staff Steve Cohn, CFO todd.Haugen@enablence.com bob.piper@enablence.com steve.cohn@enablence.com Enablence 19
Slide 20: Why Own Enablence Now
I N V E S T M E N T C A S E · T S X V: E N A Why Own Enablence Now US$8M 1,000 US$46B ~US$42M FY26 revenue (unaudited), +35% YoY wafers/week capacity by Nov 2026 2030 PLC TAM at 22.8% CAGR total debt ex-converts — no bank debt THE THESIS Structural demand shift to optics U P C O M I N G C ATA LY S T
Slide 21: Capitalization Summary
Capitalization Summary Enablence Technologies Inc. (TSXV:ENA) Basic Fully Diluted Shares Outstanding 21,072,195 44,596,599 Market Capitalization C$ 131,701,219 C$278,728,743 Net Debt C$ 101,346,616 C$60,487,367 Enterprise Value C$ 233,047,835 C$339,216,111 Enablence 21
Slide 22: Debt Structure
Debt Structure Vehicle Principal Rate Maturity Term Loans (CAD$) Vortex (senior) 19,693,545 7.5% March 31, 2028 Pinnacle Island Term A 25,000,000 17.0% June 30, 2029 Pinnacle Island Term B 20,000,000 14.0% June 30, 2029 Total/Total US 64,693,545/$45,932,417 Principal Rate Convert/Shares Convertible
Slide 23: Competitors
Competitors CWDM DWDM Sensing Henan Shijia Photons (China): Mkt cap $9.5B (+370% YoY). Accelink (China): $10.9B mkt cap (+330% YoY) While they LIGENTEC (Switzerland/France): Private. Valuation estimate Currently the world leader by volume for PLC splitter chips make finished modules, they are a mass
Slide 24: Strategic Roadmap
Strategic Roadmap Continuous manufacturing improvement to Support Growth Grow to profitability by leveraging Optical Communications Capture datacenter expansion providing Accelerate into Optical Compute leading performance 1.6T and 3.2T solutions Highspeed optical interconnects and Capitalize on LiD
Slide 25: Datacenter Announcements since 2025
Datacenter Announcements since 2025 23 New US DC announcements since McKinsey report 79 Gigawatts= ~26M GPUs= ~83M Tranceivers additional demand Project Operator State Capacity MW basis Status Target yr Implied GPUs Xcvr demand Notes / source (MW) Colossus 2 (Macrohard) xAI TN 946 IT Underconstr. 20
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