Nano Electronics And Micro System Technologies Inc · TWSE:7730
Nano Electronics And Micro System Technologies — 2026 Investor Conference
16 slides from Nano Electronics And Micro System Technologies's conference presentation, Jun 22, 2026
Slide 1: 2026 Investor Conference
Nano Electronics and Micro System Technologies, Inc. 2026 Investor Conference First Half 2026 Operating Results and Advanced Packaging Plasma Process Technology Strategy Date: June 22, 2026 Investor Conference / Taipei Classification: Non -Public Investment Material © 2026 Nano Electronics and Micro
Slide 2: Agenda
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Agenda 01 05 Company Overview & Core Competencies Order Status & Market Structure 02 06 Advanced Packaging Industry Trends & Plasma Future Outlook & Investment Process Technology Value 03 07 Technology Capability Matrix & Import
Slide 3: Company Overview & Core Competencies
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Company Overview & Core Competencies For over 20 years, NEMS has specialized in plasma dry -process equipment, focusing on advanced semiconductor packaging and committed to delivering efficient, eco -friendly, and precise proces
Slide 4: Company Overview & Core Competencies
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Company Overview & Core Competencies 01 Precise Market Entry: Positioned at the Core of the AI Value Chain AI Servers High -End FCBGA/ABF Heterogeneous Integration Glass Substrate Precisely positioned along the semiconductor ind
Slide 5: Advanced Packaging Industry Trends & Plasma Process Technology
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Advanced Packaging Industry Trends & Plasma Process Technology Surge in AI/HPC Heterogeneous Line -Width Scaling Rise of New Substrates FOPLP Expansion Demand Integration Challenges AI servers and HPC chips Glass substrates (TGV
Slide 6: Advanced Packaging Industry Trends & Plasma Process Technology
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Advanced Packaging Industry Trends & Plasma Process Technology Advanced packaging faces challenges of line -width scaling and large -area uniformity, and traditional wet chemical processes have reached physical limits. With "nan
Slide 7: Technology Capability Matrix & Development Roadmap
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Technology Capability Matrix & Development Roadmap IC Substrate (ABF/BT) Process Technology Type FOPLP Panel -Level FOWLP Wafer -Level Glass / TGV Advanced Packaging Desmear ★ — — ★ RIE Precision Thin -Film Etching ★ ★ ★ ★ Surfa
Slide 8: Q1 2026 Financial Results
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Q1 2026 Financial Results Operating Revenue (NT$ K) Q1 2026 Operating Gross Margin 92,232 +10.9% YoY 46 % Operating Income (NT$ K) 11,150 Turnaround Basic Earnings Per Share (EPS) Up 4 percentage points vs. the prior -year perio
Slide 9: Q1 2026 Financial Results
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Q1 2026 Financial Results Steady Revenue Growth Significant Gross Margin Improvement 92,232 +10.9% YoY 46% +4.0 pts Reflecting continued expansion in demand for advanced - Product mix optimization, with a higher share of high -p
Slide 10: Q1 2026 Financial Results
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Q1 2026 Financial Results Financial Metrics (Q1) Q1 2025 Q1 2026 Q1 Key Financial Metrics — YoY (NT$ thousand) Operating Revenue (NT$ 83,131 92,232 Q1 2025 Q1 2026 thousand) 92,232 Gross Margin 42% 46% ▲ 83,131 Operating Margin
Slide 11: Order Status & Market Structure
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Order Status & Market Structure 2026 Order Momentum (Confirmed + LOI) 49 deals Confirmed 35 / LOI 14 Amount Share Analysis Booked (Confirmed Orders) LOI (Letters of Intent) 35 deals 14 deals Total 71.4% of deals — solid order 28
Slide 12: Order Status & Market Structure
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Order Status & Market Structure IC Substrate (ABF/BT) 2026 Order Mix by Industry (%) / Advanced Packaging Share 88.5% Cumulative 38 validation cases Key insight: Reflecting NEMS's strong competitiveness in the high -end substrat
Slide 13: Order Status & Market Structure
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Order Status & Market Structure High -Value Strategic Markets: Indicator Mature Scale Markets: Foundation of of Technology Leadership Operating Volume Japan 31.5 % Mainland China 49.0 % Cases: 30. Cases: 3. Taiwan 16.1 % RIE Fla
Slide 14: Order Status & Market Structure
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Order Status & Market Structure Maintenance Service Growth Momentum Core Equipment Model Mix Analysis Order Mix by Equipment Model (%) +60.4% YoY Revenue Growth Reactive Ion Plasma Etcher 46.6% As the global installed base conti
Slide 15: Future Outlook & Investment Value
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Future Outlook & Investment Value Leading the plasma dry -process revolution and precisely positioning within the global core value chain of AI computing and next -generation glass -substrate packaging. AI/HPC CORE DRY ONLY GLAS
Slide 16: Important Disclaimer
INVESTOR CONFERENCE 2026 | Nano Electronics & Micro System Technologies Important Disclaimer Source & Nature of Information Technology & Validation Notes The materials in this presentation are compiled from technical The application cases listed are current technical -collaboration and documents and
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