Nano Electronics And Micro System Technologies Inc · TWSE:7730

Nano Electronics And Micro System Technologies — IPO Roadshow (March 2024)

33 slides from Nano Electronics And Micro System Technologies's IPO roadshow presentation, Mar 12, 2024

1. Slide 1: Pre-IPO Institutional Investor Briefing

   Pre-IPO Institutional Investor Briefing 2024.03.12 1

2. Slide 2: Disclaimer

   Disclaimer  This presentation contains forward-looking statements, which involve estimates and assumptions, and are subject to significant risks and uncertainties. Certain factors beyond the control of the company and difficult to predict may cause actual results to differ materially from the conte

3. Slide 3: Outline

   Outline Company Profile Semiconductor-Upstream Milestones Semiconductor-Midstream Management Team Semiconductor-Downstream Global Sales Territories CORE ABOUT NEMS PRODUCTS FUTURE COMPETITIVE Expand Production PROSPECTS ADVANTAGE Lines Innovative Business Model Future Products Create Mark

4. Slide 4: ABOUT NEMS

   © Vins, tek GLOW THE FUTURE ABOUT NEMS

5. Slide 5: Company Profile

   Company Profile 暉盛科技股份有限公司 Stock Symbol：7730 Nano Electronics and Micro System Technologies, Inc. Founded：2002 Headquarter Location：Tainan City, Taiwan Capital：NTD 288.6 Million President ：Sung, Jun-I Major Business : Our main focus is on research and development of advanced plasma technology, with

6. Slide 6: «cal Vins,

   «cal Vins, - chemic® GLOow M S wt

7. Slide 7: Realizing Physical Limits

   Realizing Physical Limits

8. Slide 8: Management Team

   Management Team Jun-I Sung Winson Hsu Alan Tsai President General Manager Manager, Finance and Accounting Bachelor’s Degree, Department Ph.D., Department of Chemical Department. of Electronics, National Taiwan Engineering, National Cheng Master’s Degree, Department of University of Science and Kung

9. Slide 9: Management Team

   Management Team Kelvin Chiu Yong-Hau Foo Gary Liang Department Manager, Marketing Department Manager, Production Senior Manager, R&D Department. & Sales Department. Department. Ph.D., Department of Chemical Master’s Degree, Department of Master’s Degree, Department of Engineering, National Cheng Kun

10. Slide 10: Milestones

    Milestones 2003 2006 2012 2018 2030 Cross Industry 5G Certifications Milestone Equipment Development Equipment Obtained certification for plasma equipment Upgrade from the leading US semiconductor company , Selling Introducing plasma technology and successfully selling plasma polarization Selling va

11. Slide 11: Global Sales Territories

    Global Sales Territories Germany Austria Romania Japan US China Taiwan India Vietnam Thailand Philippines Singapore  Steady and Stable Progress Over 22 Years. Malaysia  Operate with Integrity to Serve Customers.  Become One of the Leading Global Plasma Equipment Manufacturers. 11

12. Slide 12: CORE PRODUCTS

    © Vins, tek GLOW THE FUTURE CORE PRODUCTS

13. Slide 13: Core Products - Semiconductor Applications

    Core Products-Semiconductor Applications NEMS Products on Semiconductor Applications Industry Upstream Midstream Downstream Chain Fingerprint Applications Wafer Wafer Advanced Flip-Chip Identification Manufacturing Reclaim Packaging Substrate Sensor FOWLP Grinding PVDF、PZT Wafer FOPLP ABF、BT & Key T

14. Slide 14: Semiconductor Upstream - Fingerprint Identification

    Core Products-Semiconductor Upstream- Fingerprint Identification Fingerprint Identification of Mobile Devices PLATEN RECEIVER 1 SENSOR SUBSTRATE TRANSMITTER SENSOR CIRCUIT Fingertip Pillar is not dampened 1 ：Plasma polarization ridge Energy leaving Fingertip pillar valley 14

15. Slide 15: Upstream - Fingerprint Recognition

    Core Products-Semiconductor Upstream- Fingerprint Recognition Global fingerprint recognition chip growth quantity forecast  2022 Demand: 26 million pieces. (unit: ten thousand pieces) (Primarily from Korean smartphones, followed 7000 CAAGR: 25% 6500 by Chinese smartphones, with a small amount from

16. Slide 16: Semiconductor Midstream - CoWoS

    Core Products-Semiconductor Midstream- -CoWoS 1 2 1 3 1 ：Underfill_Plasma cleaning 2 ：TSV_Plasma etching 3 ：Substrate_Plasma cleaning 16

17. Slide 17: Semiconductor Midstream - FOPLP

    Core Products-Semiconductor Midstream- FOPLP 3 1 1 ：Underfill_Plasma cleaning 4 2 2 ：De-bond_Plasma cleaning 3 ：Before sputter_Plasma descum 資料來源:manz 4 ：Glass recycle_Plasma cleaning 17

18. Slide 18: Midstream - CoWoS AI Chip Market

    Core Products-Semiconductor Midstream- -CoWoS AI Chip Market (Unit: 10 billion US Dollars) 1000 900 CAAGR: 42% 900  With various conditions such as data, 800 computing power, etc., in place, the 700 development and application of 640 600 technologies such as Machine Learning have propelled the adva

19. Slide 19: Midstream - Wafer Reclaim

    Core Products-Semiconductor Midstream- Wafer Reclaim  ICP RIE Etching the film on the surface of the wafer replaces the wet chemical cleaning and film removal process, reducing the cost of chemical agents/pure water usage and wastewater treatment.  Can remove film of Nitride, Poly-Si, SiC, SiO2, L

20. Slide 20: Midstream - Wafer Reclaim

    Core Products-Semiconductor Midstream- Wafer Reclaim Wafer reclaim IC Fab Factory Control wafer Inspection retrieve Control Plasma 2 wafer use Etch 1 Plasma Etch CMP 1 2 ：Wafer plasma etching CMP Particle OK Special film Inspection Parking & Ship out Inspection 20

21. Slide 21: Midstream - Wafer Reclaim

    Core Products-Semiconductor Midstream- Wafer Reclaim  Each 300mm Fab is estimated to have a CAAGR 15% monthly capacity of 40,000 wafers.  The demand for wafer recycling exceeds 20,000 wafers per month.  By 2024, there will be 181 300mm fabs in the global market.  Global demand for wafer recyclin

22. Slide 22: Midstream - SiC Process

    Core Products-Semiconductor Midstream- SiC Process 1 Slicing/ ICP Plasma grinding 圖片來源:漢民 1 ：SiC Plasma etching 22

23. Slide 23: Midstream - SiC Process

    Core Products-Semiconductor Midstream- SiC Process The global silicon carbide (SiC) power module SiC module output value (unit: million US dollars) 7000 market is growing beyond expectations. CAAGR 34%  The widespread use of SiC power modules in 6000 electric vehicles will lead to faster charging s

24. Slide 24: Downstream - Substrate (ABF/BT)

    Core Products-Semiconductor Downstream- Substrate（ABF/BT） 3 1 2 2 2 2 ：Plasma cleaning 4 1 ：Plasma desmear 4 4 ：Plasma cleaning 3 ：Plasma driling 24

25. Slide 25: Downstream - Substrate (ABF/BT) Output Forecast

    Core Products-Semiconductor Downstream- Substrate（ABF/BT） 2022-2027 IC substrate output value forecast (unit: hundred million US dollars) 300 CAAGR 5.1% 250 222.86 205.38 200 189.26 174.15 174.41 160.73 150 100 50 0 2022 2023 2024 2025 2026 2027 Source: Prismark 25

26. Slide 26: Downstream - Substrate (COF)

    Core Products-Semiconductor Downstream- Substrate （COF） 1 Cutting Drilling Copper Plating D/F Lamination & Exposure Development/ Electrical Inspection CVL Lay Up CVL Lamination Etching/Stripping / Visual Inspection Plating/Immersion Electrical Inspection 1 ：Plasma desmear Hole Punching Screen Printi

27. Slide 27: COMPETITIVE ADVANTAGE

    © Vins, tek GLOW THE FUTURE COMPETITIVE ADVANTAGE

28. Slide 28: Revenue and Profit

    Revenue and Profit 900 7 800 6 700  Deep collaboration with 5 600 global semiconductor Unit: Million NTD 500 4 brand giants. EPS  Actively expanding 400 3 presence domestically 300 2 and internationally. 200  Embracing the trend of 1 100 energy conservation, 0 0 carbon reduction, 2020 2021 2022 2

29. Slide 29: Competitive Advantage - Business Model

    Competitive Advantage-Business Model Key Collaborative Key Activities: Value Propositions: Customer Relationships: - Continuous technical - Providing customized Target Customers: Partners: - To become a leader in research and innovation. plasma technology in the solutions and consulting - Semiconduc

30. Slide 30: Competitive Advantage - Create Customer Values

    Competitive Advantage-Create Customer Values Creating Customer Value Enhancing Market Opportunities. Optimizing Production Efficiency Enhancing R&D Capabilities Improving Product Quality Establish Analysis Laboratory 30

31. Slide 31: FUTURE PROSPECTS

    © Vins, tek GLOW THE FUTURE FUTURE PROSPECTS

32. Slide 32: Future Prospects

    Future Prospects ~ ~ ~  Semiconductor- Advanced Packaging, Wafer  Semiconductor- Reclaim (continued  Semiconductor- Packaging from 2024) Packaging,  PCB-Rigid/Flexible  PCB- IC Substrates, Boards Fingerprint  Semiconductor- Recognition Flexible Boards  Optoelectronics- Advanced  PCB-Rigid Bo

33. Slide 33: Thanks for your attention

    -o Vins tek GLOW THE FUTURE Thanks for your attention

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