Nxp Semiconductors N.v. · NASDAQ:NXPI
Nxp Semiconductors — Technical Presentation (July 2018)
31 slides from Nxp Semiconductors's technical presentation, July 2018
Slide 1: i.MX RT 'Crossover' Processor Overview
I.MX RT ‘CROSSOVER’ PROCESSOR OVERVIEW JEAN-PAUL DAVI DIRECTOR, EMEA CUSTOMER APPLICATIONS SUPPORT HIGH-END MICROPROCESSORS JULY 2018 PUBLIC
Slide 2: Best of Both Worlds
i.MX APPLICATIONS PROCESSORS • ARM® Cortex® -A class and Cortex® -M cores • 600 MHz to 2 GHz performance • Thousands of applications • Full open-source OS platforms • ARM® Cortex® -M cores • Performance up to 300 MHz • Embedded memory • Easy to use tools • RTOS support Best Of KINETIS & LPC Both Wor
Slide 3: i.MX RT Crossover Processors
i.MX RT CROSSOVER PROCESSORS • ARM ® Cortex-M cores • Over 600 MHz performance • Deterministic instructions • Short latency • Easy to use tools • RTOS support PUBLIC 2
Slide 4: ARM Cortex-M7 Key Features
ARM® Cortex® -M7 Key Features • High-performance processor with DSP capabilities. − 6-stage, superscalar pipeline − Dual issue execution for most instructions − Powerful DSP instructions & DP floating point (in new ARM® VPFv5 module) • Flexible Memory system − Tightly coupled memories for real-time
Slide 5: Cortex-M7 CPU Platform Architecture
Cortex® -M7 CPU Platform CorePlatform • 32 KB L1 Instruction Cache • 32 KB L1 Data Cache Core CoreSight • 512KB TCM and OCRAM shared SRAM AHBD CTI TPIU CTM DAP • Floating Point Unit (FPU) with support of the Cortex M7 VFPv5 architecture for Double Precision FlexRAM ITCM • Integrated Nested Vector In
Slide 6: Highest Performance Microcontroller
Cortex® -M7 Highest Performance Microcontroller http://www.arm.com/-/media/arm-com/products/processors/Cortex-M-series-performance-graph.jpg?la=en PUBLIC 6
Slide 7: Measured CoreMark
Measured CoreMark CoreMark "| COM29 - Tera Term VI. File Edit Setup Control Window Help iCcoreMark starting with CACHES... F 2K performance run parameters for coremark. CoreMark CoreMark Size : 666 3500 i : 198812148 13.254143 | . 3036.5 Iterations /Sec 3017 .924237 3000 iterations 40000 i i i IAR 7
Slide 8: i.MX RT1050 – Launch Device, Key Highlights
i.MX RT1050 – Launch Device, Key Highlights High Performance Low BOM Cost Real-Time Processing - Competitive Pricing - Fully integrated PMIC with DC-DC - Cortex ® -M7 up to 600MHz (50% faster - Low cost package, 10x10 BGA, enabling 4 than current existing M7 products) Layer PCB design - 20ns interru
Slide 9: Reduced Systems-level Costs for Customers with i.MX RT Series
Reduced Systems-level Costs for Customers with i.MX RT Series Lower Bill-of-Materials cost • Large internal SRAM removes the need for external DRAM • Low cost package options enable 2-layer or 4-layer PCB designs i.MX RT • Integrated PMIC with DC-DC • Lowest active power consumption among all Cortex
Slide 10: i.MX RT1050 Overview
i.MX RT1050 Overview i.MX RT1050 Specifications − Package: MAPBGA196 | 10x10mm^2, 0.65mm pitch (130 GPIOs) System Control Main CPU Platform Connectivity − Temp / Qual: -40 to 105°C (Tj) Industrial / -40 to 95°C (Tj) Consumer Secure JTAG Core eMMC 4.5 / SD 3.0 x2 ARM Cortex-M7 PLL, OSC UART x8 Key Fe
Slide 11: IMXRT1050-EVKB
IMXRT1050-EVKB • Production silicon • (Today) PUBLIC 12
Slide 12: Strength in Product Longevity
Strength in Product Longevity i.MX RT1050: 10-year program • NXP (both NXP LPC and former Freescale) have longstanding track records of providing long-term production support for our products • NXP has a formal product longevity program for the market segments we serve − For the automotive and medic
Slide 13: i.MX RT1000 Roadmap
i.MX RT1000 Roadmap 800+MHz Premium i.MX RT1050 i.MX RT1060 600MHz Cortex-M7, 32K/32K L1 Cortex-M7, 32K/32K L1 Balanced 512KB SRAM 1MB SRAM 8/16-bit EMI (SDRAM/SRAM) 8/16-bit EMI (SDRAM/SRAM) BGA196 LCD / CSI / 2D acceleration BGA196 LCD / CSI / 2D acceleration Standard Security Standard Security i.
Slide 14: RT1020 – From RT1050 to Low Cost LQFP Solutions
i.MX RT1020 - From RT1050 to Low Cost LQFP Solutions 144LQFP, 20x20 196BGA, 10x10 i.MX RT1050 100LQFP, 14x14 196BGA, 12x12 Cortex®-M7 up to 600MHz Cortex®-M7 up to 500MHz RT1050 32KB/32KB I/D Cache 16KB/16KB I/D Cache RT1020 512KB SRAM / TCM 256KB SRAM / TCM 4x Flex PWM, 4x Quad Timer, 4x ENC 2x Fle
Slide 15: i.MX RT1020 Block Diagram
i.MX RT1020 Block Diagram High Performance and Integration System Control Main CPU Platform Connectivity − Cortex® -M7 up to 500MHz with 16KB/16KB I/D cache Secure JTAG Core 2x eMMC 4.5/SD 3.0 Arm® Cortex®-M7 − High Speed USB with PHY PLL, OSC 8x UART 16 KB I-cache 16 KB D-cache − Multi PWM for dual
Slide 16: RT1060 vs RT1050 Comparison
i.MX RT1020 - From RT1050 to Low Cost LQFP Solutions 196BGA, 10x10 196BGA, 10x10 i.MX RT1050 i.MX RT1060 196BGA, 12x12 196BGA, 12x12 Cortex®-M7 up to 600MHz Cortex®-M7 up to 600MHz RT1050 32KB/32KB I/D Cache 32KB/32KB I/D Cache RT1060 512KB SRAM / TCM 512KB SRAM / TCM, 512KB OCRAM 4x Flex PWM, 4x Qu
Slide 17: i.MX RT1060 Overview
i.MX RT1060 Overview System Control i.MX RT1060 Connectivity • Specifications • Key Features and Advantages Secure JTAG CPU Platform eMMC 4.5 / SD 3.0 x2 PLL, OSC ARM Cortex-M7 UART x8 ▪ Process: SMIC40LL ▪ ARM® Cortex® -M7 processor, 600MHz, RTC & Reset 32 KB I-cache 32 KB D-cache 32KB I-Cache, 32K
Slide 18: RT Status Summary i.MX NPI Status
RT Status Summary i.MX NPI status NPI Description Engineering Samples Mass Production ARM® Cortex®-M7, up to 500MHz, 256K SRAM/TCM, June 2018 (100 LQFP) i.MX RT1020 Connectivity, Motor Control, February 2018 October 2018 (144 LQFP) 20x20 (.5) 144, 14x14(.5)100 LQFP ARM® Cortex®-M7, up to 600MHz, Now
Slide 19: Enablement
Enablement PUBLIC | 22
Slide 20: MCUXpresso Software & Tools — Products
MCUXpresso Software & Tools — Products Software Development Kit (SDK) • The software framework and reference for application development with NXP’s MCUs based on ARM® Cortex®-M cores • Includes production-grade software with integrated RTOS, integrated stacks and middleware, reference software, and
Slide 21: MCUXpresso SDK
Learn more at: www.nxp.com/mcuxpresso/sdk MCUXpresso SDK The software framework and reference for Kinetis & LPC Product Features MCU application development Architecture: Reference Software: ▪ CMSIS-CORE compatible ▪ Peripheral driver usage examples ▪ Single driver for each peripheral ▪ Application
Slide 22: MCUXpresso IDE
Learn more at: www.nxp.com/mcuxpresso/ide MCUXpresso IDE Free Eclipse and GCC-based Integrated Product Features: • A free-of-charge, code size unlimited IDE Development Environment (IDE) for C/C++ development on Kinetis and LPC MCUs • Eclipse platform plus many ease-of-use improvements for MCU appli
Slide 23: MCUXpresso Config Tools
Learn more at: www.nxp.com/mcuxpresso/config MCUXpresso Config Tools Integrated configuration and MCUXpresso Config Tools is a suite of evaluation and development tools for LPC configuration tools that helps guide users from first evaluation and Kinetis® MCUs to production software development. Avai
Slide 24: RTOS Support
RTOS Support • FreeRTOS − NXP Mainline RTOS. Maintained & preintegrated into SDK. Amazon FreeRTOS with AWS components planned. • MQX v5.x − High performance, commercial contract RTOS + IoT Reference Platform integration which allows easy integration of comms protocols like RESTful API, SNMP, emanil,
Slide 25: Optimized GUI for i.MX RT
Optimized GUI for i.MX RT GUI Provider / RTOS Type Language builder Business model Product required? tools Crank /Story Developer seats, volume Library + API C / C++ Yes Optional (any) Board based product line license Draupner / Free developer tools, volume Recommended Library + API C++ Yes TouchGFX
Slide 26: MIMXRT1050 Development Platform Key Features
MIMXRT1050 Development Platform Key Features Connectivity Part Numbers: MIMXRT1050-EVKB ($79) • Micro USB Host connector Display (4.3”): RK043FN02H-CT ($29) • Micro USB OTG connector • Ethernet (10/100T) connector Processor • CAN Transceivers • NXP Semiconductors MIMXRT1052DVL6A • ARDUINO interface
Slide 27: i.MX RT SOM Partners
i.MX RT SOM Partners Embedded Artists Future Design Inc • Distributors: • Distributor: − Future, Digi-key, Mouser − Avnet, Digi-key, Mouser, • http://www.embeddedartists.com • http://www.teamfdi.com/ • http://www.embeddedartists.com/products/oem/imxrt1052_oem.php • http://www.embeddedartists.com/pro
Slide 28: MIMXRT1020 Development Platform – Real 2 Layer PCB Design
MIMXRT1020 Development Platform – Real 2 Layer PCB Design Part Numbers: MIMXRT1020-EVK ($49) Processor Sensor • NXP Semiconductors MIMXRT1021DAG4A • 6-Axis Ecompass (3-Axis Mag, 500MHz ARM Cortex-M7, 144LQFP 3-Axis Accel) sensor FXOS8700CQ Memory • 256 Mbit SDRAM memory Debug • 512Mbit Hyper Flash •
Slide 29: i.MX RT1050 App Notes
i.MX RT1050 App Notes • How to enable Boot from QuadSPI • Boot from HyperFlash & SD Card • Developing Camera Applications • Power consumption & measurement • How to use iMX RT Low Power Features • Migration Guide from 6ULL to RT • Migration Guide from Kinetis to RT • Using Multi Channel features of
Slide 30: i.MX RT Enablement Overview
i.MX RT Enablement Overview Software Hardware Runtime Software Development Tools Development Tools Application Specific Support NXP Solutions: IDE / Toolchains: Evaluation Kits: Broad Market: • Graphics • Touch HMI • Camera interface • NXP Community • Motor Control • Solution Designs • Voice activat
Slide 31: NXP trademarks notice
NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2018 NXP B.V.
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