Slide 1: DA5 Consortium Customer Presentation
nexperia Cinfineon” DA5 Consortium Customer prese
Slide 2: Updates to last version from 16.04.2026
DA5 Consortium Updates to last version from 16.04.2026 Updated content was retained for slides 2, 6-7, 9, 13, 22-26, 28-29, 33 and 36. Repeated visual elements were standardized across the deck. Dense paragraphs were shortened into presentation-ready decision points. 11.09.2026 © 2026 DA5 Consortium
Slide 3: Agenda
DA5 Consortium Agenda 01 Motivation: health & environment current section 02 Legislation status 03 Lead in electronics 04 DA5 structure & approach 05 Partners & sustainability 06 Requirements & alternatives & results 07 Timeline & conclusion 11.09.2026 © 2026 DA5 Consortium 3
Slide 4: Lead: Environmental and Health Endangerment
DA5 Consortium Lead: Environmental and Health Endangerment Lead is a persistent toxic substance; the health and environmental rationale for substitution is clear. Environmental dangers Health dangers Contamination of water, air and soil Neurotoxin; accumulates in soft tissues and bones Persistence i
Slide 5: Agenda
DA5 Consortium Agenda The storyline follows the decision logic: why lead matters, where it remains technically needed, and what DA5 is doing to replace it responsibly. 01 Motivation: health & environment 02 Legislation status current section 03 Lead in electronics 04 DA5 structure & approach 05 Part
Slide 6: Lead (Pb) CAS 7439-92-0 in Europe
DA5 Slide updated Consortium Lead (Pb) CAS 7439-92-0 in Europe Lead can still be used in defined semiconductor applications, but only within regulated exemptions and declaration rules. REACH – Reg 1907/2006 RoHS – Dir 2011/65/EU ELV – Dir 2000/53/EC SVHC candidate list; declaration Restricted to 0.1
Slide 7: RoHS, ELV and REACH comparison
DA5 Slide updated Consortium RoHS – Restriction of Hazardous ELV – End of Life of Vehicle REACH – Regulation on Registration Substances Directive Directive Evaluation and Authorization of Chemical Reference 2011/65/EU 2000/53/EC 1907/2006/EC Status Restricted Substance In Annex II Restricted Substan
Slide 8: Agenda
DA5 Consortium Agenda The storyline follows the decision logic: why lead matters, where it remains technically needed, and what DA5 is doing to replace it responsibly. 01 Motivation: health & environment 02 Legislation status 03 Lead in electronics current section 04 DA5 structure & approach 05 Part
Slide 9: Use of Lead in Electronics
DA5 Slide updated Consortium Use of Lead in Electronics The replacement challenge has shifted from PCB-level soldering to package-level die and clip attach. PCB-level solders PbSn63/ PbSn62Ag2 have been used on printed circuit boards. Lead-free alternatives such as SAC (SnAg3.8Cu0.7) are known and i
Slide 10: Materials for Die Attach: Solder Alloys
DA5 Consortium Materials for Die Attach: Solder Alloys Brittleness of remaining alloy candidates limits reliability—especially for larger die, thin chips and constrained package geometries. Why substitution is hard Reliability pressure points High-melting behavior must survive board-level Constraint
Slide 11: Agenda
DA5 Consortium Agenda The storyline follows the decision logic: why lead matters, where it remains technically needed, and what DA5 is doing to replace it responsibly. 01 Motivation: health & environment 02 Legislation status 03 Lead in electronics 04 DA5 structure & approach current section 05 Part
Slide 12: DA5 Project at a Glance
DA5 Consortium DA5 Project at a Glance DA5 = Die-Attach 5: a joint semiconductor consortium focused on feasible lead-free die and clip attach technologies. 04/2009 12/2015 07/2017 Today DA5 consortium formed by ST, NXP and Freescale merge into Nexperia joins DA5 consortium Focus remains on NXP, Infi
Slide 13: Sustainability Efforts I
DA5 Slide updated Consortium Sustainability Efforts I Infineon: We understand sustainability as the symbiosis between economy, ecology and social engagement. At Infineon, we responsibly manage the handling of hazardous materials to safeguard human health and environmental protection. As part of Infi
Slide 14: Sustainability Efforts II
DA5 Consortium Sustainability Efforts II NXP: Sustainability is deeply integrated into our long-term business strategy and is a core part of our operational culture. We strive to innovate technologies that contribute to a better, safer, more secure and more sustainable world, while continuously impr
Slide 15: DA5 Approach
DA5 Consortium DA5 Approach Press Release (Q2/2010) at start of DA5 project Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the
Slide 16: DA5 Project Objectives
DA5 Consortium DA5 Project Objectives Objective: identify sustainable, robust, standardized, reliable and dependable lead-free solutions for customers. 1 Develop direction: Jointly define Pb-free die- and clip-attach technology direction with suppliers. 2 Evaluate candidates: Screen available and po
Slide 17: Agenda
DA5 Consortium Agenda The storyline follows the decision logic: why lead matters, where it remains technically needed, and what DA5 is doing to replace it responsibly. 01 Motivation: health & environment 02 Legislation status 03 Lead in electronics 04 DA5 structure & approach 05 Partners & sustainab
Slide 18: DA5 Setup for Pb-free Die-Attach
DA5 Consortium DA5 Setup for Pb-free Die-Attach Supplier engagement is global, continuous and focused on work packages with the most promising candidates. 37 4 3×/year major material suppliers suppliers working continuously common supplier update identified with DA5 cadence Major suppliers from Euro
Slide 19: Agenda
DA5 Consortium Agenda The storyline follows the decision logic: why lead matters, where it remains technically needed, and what DA5 is doing to replace it responsibly. 01 Motivation: health & environment 02 Legislation status 03 Lead in electronics 04 DA5 structure & approach 05 Partners & sustainab
Slide 20: Challenges/ Requirements
DA5 Consortium Challenges/ Requirements A viable material must combine high-temperature stability, process compatibility, reliability and electrical/ thermal performance. Thermal stability Package compatibility No re-melting or delamination after 3× 260°C PCB Thin die <120µm and large die up to 70mm
Slide 21: Alternatives Evaluation
DA5 Consortium Alternatives Evaluation Adhesives TLPS Metal sintering Solders Metal filler in organic High melting metal Ag/ Cu µm- and/ or Metal alloys resin (Ag) powders in organic flux nm-scale particles Zn (Cu, Ag) Organic coating Bi Volatile solvent Sintering promoters SnSb Limitation Limitatio
Slide 22: Conductive Adhesives
DA5 Slide updated Consortium Advantages Limitations Conductive Adhesives Compatible with Ag, Cu, Au PPF Epoxy bleed-out from components Principles platings added for viscosity control Smaller particles (nano) higher sintering Low elastic modulus, reduced Risk of die top contamination degree, which
Slide 23: Metal Sintering
DA5 Slide updated Consortium Metal Sintering Principle Material: Ag- or Cu-sintering pastes: Ag or Cu particles (µm- and/ or nm-scale) with organic coating, dispersants, and sintering promoters. Process: Dispense/ screen print pick & place die pressure-less/ -assisted sintering under N2 or air.
Slide 24: TLPS: Transient Liquid Phase Sintering
DA5 Slide updated Consortium TLPS: Transient Liquid Phase Sintering Principle TLPS Paste is in general a mixture of a high melting metal powder (e. g. Cu or Ag) and a Pb-free solder powder (e. g. Sn based) in an organic flux. After curing a matrix of e.g., pure Cu, CuSn alloy (melting temp. > 400°C)
Slide 25: Alternative Solders
DA5 Slide updated Consortium Alternative Solders Principle Alternative solders (Zn-, Bi-, SnSb-based, SAC-SnSb alloys) form intermetallic phases during reflow, creating a metallurgical bond between die backside metallization and leadframe. Brittle Zn intermetallics These alloys rely on solid-state d
Slide 26: Key Performance Indicators
DA5 Slide updated Consortium Key Performance Indicators DA5 uses a revised rating system with Pb-based solder set as the reference value of 5 for each criterion. How to read the assessment Assessment refers to the best material tested in each class. Valid for die thickness >120 µm. Applies to die at
Slide 27: Agenda
DA5 Consortium Agenda The storyline follows the decision logic: why lead matters, where it remains technically needed, and what DA5 is doing to replace it responsibly. 01 Motivation: health & environment 02 Legislation status 03 Lead in electronics 04 DA5 structure & approach 05 Partners & sustainab
Slide 28: Timeline
DA5 Slide updated Consortium Timeline DA5 maintains a regular supplier cadence and continues material evaluation alignment between workshops. Three times/ year Between workshops July 2026 November 2026 Common update meetings Alignment between supplier Last DA5-supplier workshop Next DA5-supplier wor
Slide 29: Summary DA5-supplier workshop July 2026
DA5 Slide updated Consortium Summary DA5-supplier workshop July 2026 The workshop combined supplier updates, DA5 feedback and internal alignment on how to improve supplier support. Supplier updates Technical discussion Next support actions Latest activities on Pb Results discussed thoroughly Detaile
Slide 30: Boundary Conditions
DA5 Consortium Boundary Conditions Package Type/ Geometry Chemical Interactions • Die size & thickness • Ionic content • Clip and/ or wire bond package • Legal restrictions, e.g. ELV & RoHS Physical Properties Metallizations Die/ Clip/ LF • El./ th. conductivity, yield • Cu, Ni, Ag, Pd/Au, Ni/Au, Ni
Slide 31: DA5 - Automotive Release Process (ELV)
DA5 Consortium DA5 - Automotive Release Process (ELV) 11.09.2026 © 2026 DA5 Consortium 31
Slide 32: DA5 - Industrial Release Process (RoHS)
DA5 Consortium DA5 - Industrial Release Process (RoHS) 11.09.2026 © 2026 DA5 Consortium 32
Slide 33: Conclusion I
DA5 Slide updated Consortium Conclusion I No currently available lead-free material technology is ready to replace high-melting temperature lead solders across semiconductor applications. 1 More than 15 years of development have produced promising but application-specific results. 2 DA5 evaluated mo
Slide 34: Conclusion II
DA5 Consortium Conclusion II The deployment path remains sequential: technology freeze → semiconductor qualification → customer qualification → supply-chain conversion. Customer qualifications and supply-chain ramp-up can only begin after package technology and component qualification. No universal
Slide 35: List of Abbreviations
DA5 Consortium List of Abbreviations Ag Silver AEC Automotive Electronics CTE Coefficient of Thermal Council Expansion Au Gold ELV End-of-Life Vehicle HTS High Temperature Storage Bi Bismuth EU European Union IMC Intermetallic Compound Cu Copper MSL Moisture Sensitivity Level PCB Printed Circuit Boa
Slide 36: Contact Information
DA5 Slide updated Consortium Contact Information Speaker of the DA5 consortium Riccardo Villa STMicroelectronics srl Email: riccardo.villa@st.com DA5 customer presentation https://www.infineon.com/row/public/documents/corporate/company/sustainability/da5-customer-presentation.pdf The full “DA5 Die C