Nxp Semiconductors N.v. · NASDAQ:NXPI

Nxp Semiconductors — Technical Presentation (December 2015)

41 slides from Nxp Semiconductors's technical presentation, Dec 16, 2015

  1. Slide 1: Die Attach 5 Project

    Die Attach 5 Project

  2. Slide 2: Agenda

    Agenda  Motivation: Environmental and health endangerment by lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 2 16 D

  3. Slide 3: Sustainability Efforts

    Sustainability Efforts Bosch: Just about half of Bosch’s 2014 research and development budget (4.9 billion euros) focused on the environment and on products designed to conserve resources. It is here that the challenge of the next century lies. Our objective: to develop innovative, useful, and excit

  4. Slide 4: Examples for Environmental Protection

    Examples for Environmental Protection CRI Powertrain Innovative electro-tools Photovoltaic with Li-Ion technology Saving energy in basestations Energy efficient Wind energy (gears) Solar thermal appliances ESP Power plant More efficient SSL Household/Office Smart grid lighting 4 16 December, 2015

  5. Slide 5: Lead: Environmental and Health Endangerment

    Lead: Environmental and Health Endangerment  Environmental dangers  Health dangers:  Poisonous substance  Neurotoxin  Accumulates in soft tissues & bones  Damage to nervous system  Causes brain disorder  Causes blood disorder in mammals 5 16 December, 2015

  6. Slide 6: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 6 16 D

  7. Slide 7: Use of Lead in Electronics

    Use of Lead in Electronics Exemption Expiry / Review Date Lead in soldering on PCB, the components and their finishes E/2015 Lead in solder for other application, not on PCB or glass E2010 Lead in finishes of Al-Capacitors E/2012 example IC packages Lead in soldering on glass for mass-flow sensors 2

  8. Slide 8: Use of Lead in Electronics

    Use of Lead in Electronics  Use of Lead containing Solders in PCB  PbSn63 or PbSn62Ag2 are & have been used for soldering components onto a printed circuit board (PCB)  Leadfree alternative solders known & implemented  E.g. SnAg3.8Cu0.7 (SAC)  Use of high Lead containing Solders as chipsolders

  9. Slide 9: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of solder alloys 400 400 Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) in °C °C 300 300 Temperature in Temperature 250 250 200 200 150 150 100 100 n Ag Ag Ag b b b n Sn

  10. Slide 10: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of of solder solder alloys 400 400 Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) Temperature in °C 300 300 250 250 200 200 150 150 100 100 nn bb 2S Ag Ag Ag b b n SSnn I

  11. Slide 11: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of of solder solder alloys 400 400 Tem perature load & lead-free Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) °C in °C 300 300 Temperature in Temperature 250 250 200 20

  12. Slide 12: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 12 16

  13. Slide 13: Legislation

    Legislation  European End-of-Life Vehicle (ELV) Directive (2000/53/EG) mandates conversion to environmentally friendly materials  Annex II (2010/115/EU, exemptions 8e-j/10d) ELV 7th Adaptation  Exemption may be cancelled if an alternative is available and proven  For 8e (lead in HMT solder) revi

  14. Slide 14: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & its use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 14 16

  15. Slide 15: DA5 Project at a Glance

    DA5 Project at a Glance  04/2009: Decision to form DA5 consortium: STMicroelectronics, NXP Semiconductors, Infineon Technologies, Robert Bosch, and Freescale Semiconductors.  DA5 = Die-Attach 5  DA5 focus on the use of high melting solder in semiconductor applications, especially for die attach i

  16. Slide 16: DA5 Approach

    DA5 Approach Press Release (Q2/2010) Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of alternatives for high-le

  17. Slide 17: DA5 Project Objectives

    DA5 Project Objectives  Joint development by semiconductor suppliers to address and mutually define the direction of Pb-free solder d/a-technology development  DA5 is working together with suppliers to find feasible alternative solutions for lead-free die-attach  Evaluate available and potential

  18. Slide 18: DA5 Setup for Pb-free Power Die Attach

    DA5 Setup for Pb-free Power Die Attach DA5  Major material suppliers from Europe, US and Asia were assessed  15 Preferred material suppliers were identified  Continuous contact is established.  7 Selected material suppliers out of 15 were chosen  To work out specific solutions within the DA5 pr

  19. Slide 19: Targeted Applications

    Targeted Applications  Power Modules  Smart Power ASICs  Power MOS-FETs & IGBTs in SMD packages  Power MOS-FETs & IGBTs in Through-Hole packages (THT)  Different applications have different specifications and may require Pictures not to scale different leadfree solutions 19 16 December, 2015

  20. Slide 20: Reliability Requirements

    Reliability Requirements *  AEC-Q100/-Q101 Grade 0  Typical Tjunction 175°C; max. up to 200°C  Thermal/electrical properties  Improvement compared to existing solutions needed  Reflow 260°C (SMD)  Moisture sensitivity level MSL3 or better (SMD)  Wire bonding temp. up to 260°C  Physics of fai

  21. Slide 21: Materials

    Materials  4 different material “classes” are in discussion DA 5 21 16 December, 2015

  22. Slide 22: Conductive Adhesives I

    Conductive Adhesives I  Principle  High electrical and thermal conductivity of adhesives is achieved by an increased silver filler content with very dense packing of filler particles. Reduction of particle size to micro and nano scale stimulates a sintering of the silver particles during the resin

  23. Slide 23: Conductive Adhesives II

    Conductive Adhesives II  Advantages  Good adhesion to different types of chip backside metals and leadframe platings.  Good thermal and electrical performances.  Standard production methods and equipment can be used for the application of the material and placement of the chip (Drop-In Solution)

  24. Slide 24: Conductive Adhesives III

    Conductive Adhesives III  Limitations  Some highly filled adhesives contain solvents to improve rheology. This requires more careful handling and control of the manufacturing process. It also bears a risk of leadframe and die surface contamination.  Material cost is higher compared to standard ad

  25. Slide 25: Ag Sintering I – Overview

    Ag Sintering I – Overview  Principle  Ag-sinter pastes: Ag particles (µm- and/or nm-scale) with organic coating, dispersants, & sintering promoters  Dispense, pick & place die, pressureless sintering in N2 or air in box oven  Resulting die-attach layer is a porous network of pure, sintered Ag 

  26. Slide 26: Ag Sintering II – Assembly

    Ag Sintering II – Assembly  Dispensability and staging time are improving, but issues persist  Voiding is improving  Process control issue: C- SAM scans are difficult to interpret  Bond line density differences and un- sintered material should be improved Die edge Die center  Reduction of un-si

  27. Slide 27: Ag Sintering III – 0-hr & Reliability Results

    Ag Sintering III – 0-hr & Reliability Results  Oxidation and/or delamination of interfaces is common, Delamination Die even at 0-hr, lowering adhesion and electrical & thermal performance. Potential solutions (not yet proven):  Reduce oxygen content in atmosphere during curing  Change paste formu

  28. Slide 28: TLPS materials I

    TLPS materials I  Advantages  Fulfills many of the drop-in replacement requirements for a paste  Better cost position compared to Ag sintering solutions  Good electrical performance on Ag-plated leadframes  Disadvantages  Medium metal content in die attach  Medium space rate, filled with Epox

  29. Slide 29: TLPS material II

    TLPS material II  The hybrid material showed a medium space rate. The spaces are filled with epoxy material  The reflow process is very critical and has to be further optimized, the reflow profile seems to be product specific  Reliability results are contradictory. Results are package / leadframe

  30. Slide 30: Alternative Solders I

    Alternative Solders I Properties to be considered  Robust manufacturing process  Repeatable solder application  Stable wetting angle Zn based alloy reference  Surface compatibility (chip backside, lf finish)  Reliability  Voiding / cracking / disruption after stress  Growth of brittle interme

  31. Slide 31: Alternative Solders II

    Alternative Solders II  Zn-based Alloys  Material currently only available in wire form  Low wettability makes the use of special equipment necessary (capability for mass production open)  Growth of brittle intermetallics at high temperature limits reliability  New formulations demonstrate lowe

  32. Slide 32: Key Performance Indicators I – Comparison of competing Technologies

    Key Performance Indicators I Comparison of competing Technologies DA5 assessment refers to best tested material in class 32 16 December, 2015

  33. Slide 33: Key Performance Indicators II – Comparison of competing Technologies

    Key Performance Indicators II Comparison of competing Technologies DA5 assessment refers to best tested material in class 33 16 December, 2015

  34. Slide 34: Key Performance Indicators III – Comparison of competing Technologies

    Key Performance Indicators III Comparison of competing Technologies DA5 assessment refers to best tested material in class 34 16 December, 2015

  35. Slide 35: Key Performance Indicators IV – Comparison of competing Technologies

    Key Performance Indicators IV Comparison of competing Technologies DA5 assessment refers to best tested material in class 35 16 December, 2015

  36. Slide 36: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 36 16

  37. Slide 37: DA5 Timeline (Overview/Milestones)

    DA5 Timeline (Overview/Milestones) 12th F2F Technology review & Supplier feedback Neubiberg 1st F2F 2ndF2F 3rd F2F 4th F2F 5th F2F 6th F2F 7th F2F 8th F2F 9th F2F 10th F2F 11th F2F 13th F2F Sibiu Reutlingen Agrate Regensburg Munich Munich Nijmegen Reutlingen Agrate Regensburg Munich Nijmegen General

  38. Slide 38: Material freeze DA5 – Automotive Process (ELV)

    Substitute DA5 Material(s) for - Automotive High-LeadProcess(ELV) Release Solders DA Material Semiconductor Electronic Package Vehicle Technology Technology Component Control Unit chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Lead-free Material Technology Component ECU Vehicle Mat

  39. Slide 39: Material freeze DA5 – Industrial Process (RoHS)

    Substitute DA5 Material(s) - Industrial for High-Lead Release Solders Process(RoHS) DA Material Package Semiconductor Customer Application Technology Technology Component chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Material Technology Component Product Material freeze Prototype

  40. Slide 40: Conclusion

    Conclusion  Today’s lead-free material technologies for semiconductor applications (die attach) are not ready to substitute high-lead solders in power applications as drop-in solution  Substantial development efforts have been running for 6 years now and will be continued. Nevertheless the DA5 con

  41. Slide 41: Contact Information

    Contact Information Speaker of the DA5 consortium: Bodo Eilken Infineon Technologies AG Email: bodo.eilken@infineon.com DA5 customer presentation: http://www.infineon.com/dgdl/DA5_customer_presentation. pdf?fileId=db3a30433fa9412f013fbd2aed4779a2 41 16 December, 2015

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