C Sun Mfg. Ltd. · TWSE:2467
C Sun Mfg — Investor Conference, Taiwan Stock Exchange, November 2020
30 slides from C Sun Mfg's conference presentation, Nov 26, 2020
Slide 1: 2467.TT Investor Conference
2467.TT Andy Huang, Co-head Venue: Taiwan Stock Exchange Taipei 101 November 26th , 2020
Slide 2: Disclaimer
免責聲明 2 This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “anticipate” , “believe”, “could”, “estimate”, “expect”, “intend”, “plan” , “forecast” ,”project”, “predict”, “potential”, “con
Slide 3: Agenda
議程 3 • Growth Opportunities & Product Development • Q&A
Slide 4: Growth Opportunities & Product Development
Growth Opportunities& Product Development
Slide 5: G2C Alliance (C SUN, GPM, GMM)
Growth Opportunities & Product Development 5 -G2C Alliance(C SUN、GPM、GMM) Advantages Of Strategic Alliances -2019-2021 Operating Results Growth Opportunities : ．Advanced Packaging(SEMI) ．Flat Panel Display (FPD) ． Printed Circuit Board(PCB)
Slide 6: Advantages of Strategic Alliances
Each partner own different core technologies and deeply rooted in electronic industry. Can integrate partner’s resources to cater customer's need swiftly. 33% of Actiance’s employees are R&m. 1,618, RD members 529. (529/1618)
Slide 7: System in a Package
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Slide 8: Fan Out Wafer Level Pack
Fan Out Wafer Level Pack i to Sh ae G2C — VATU ARIS One Stop Shop
Slide 9: GMM
GMM bi GMM i En a " : | Ge, eit G2C —WAaTUARIS if BB em One Stop Shop
Slide 10: 2020~2021 Semiconductor Opportunities
2020~2021 Semiconductor Opportunities Trend and market development 10 • The development of advanced packaging technologies spur the growth of 5G and AIoT silicons. • The demand of silicons for 5G, AI and Autonomous car. • The trend of hereto-integration of technologies is undergoing and the growth o
Slide 11: 2020~2021 Semiconductor Opportunities
2020~2021 Semiconductor Opportunities Trends/ market development 11 • The development of advanced packaging technologies spur the growth of 5G and AIoT silicons. • The demand of silicons for 5G, AI and Autonomous cars is clear sky. • COF packaging is in shortage as driver IC bumps into production bo
Slide 12: 2020~2021 Advanced Packaging Technology Trend
2020~2021 Advanced Packaging Technology Trend. Advanced packaging technologies are moving to 12 chip level – TSMC is the bellwether
Slide 13: R2R (Roll to Roll) Oven
COF Industrial Application-Floating R2R (Roll to Roll)Oven 13 • Fully automated non contact type R2R oven has been moved in customer in China in Q1 2020 and repeat order is received. • Applications: COF, FPCB, Flex panel display and flex-electronics. Non-Contacted Roll to Roll Automated Oven
Slide 14: 3D Packaging & AutoClave Process - VPO
3D Packaging & AutoClave Process- VPO(Vacuum Pressure Oven) • For chip on wafer and u bump de-bubbling. 14 • Delivered to packaging big names. • VPO connecting with OHT is certified by big name DRAM manufacturer in multi stacking process. Vacuum Pressure Oven
Slide 15: 5G RF Module
5G RF Module 15 RF Module Integration Trend: Power Amplifier / Filter Integration. Wafer-form Auto Roller Laminator Auto Mylar Peeler
Slide 16: WLP / PLP Advanced Packaging Equipment
WLP / PLP Advanced Packaging Equipment • RDL Fan-Out Package process vacuum lamination and Automated Oven Line. 16 • Wafer vacuum lamination equipment was prepared prior to mass production in T company and started placing repeat orders, for the SoW process base line. • Burn in Auto Oven has been pas
Slide 17: AI & AIoT Chips
AI & AIoT Chips • The production scale of 2.5D TSV advanced packaging expands with the application of AI 17 chips, and continues to increase volume. • As 3D TSV enters into the mass production stage, the specifications nearing to its requirement and production scale continue to grow. It is estimated
Slide 18: 2020~2021 PCB Technology & Opportunity
2020~2021 PCB Technology & Opportunity 18 • Prompt plant construction for IC Carrier and HDI Board • 5G Servo Board • Mass Production for Mini LED Base.
Slide 19: Fast Plant Construction for IC Carrier and HDI Board
Fast Plant construction for IC Carrier and HDI Board 19 • IC Substrate/Substrate Type and HDI High-End Packaging Equipment. • Demand for ABF process equipment continues to increase. Ultra-thin board high-end Multi-chamber Dry vacuum Film Peeling Machine ABF Mylar Peeler laminating machine laminating
Slide 20: 5G Servo Board
5G Servo Board 20 • Significant increase in demand for 5G base stations and cloud server servo boards . • Actively expanding the market for LCP Fully Auto Exposure RTR Auto Exposure Roll to Roll Auto System Machine Laminator
Slide 21: Mini LED Circuit Base Mass Production
Mini LED Circuit Base Mass Production 21 • The massive backlighting conversion of smart phones to mini LEDs, has tremendously increase the demand. Auto Vacuum Auto Roller Laminating Auto Single-Sided Laminating Line Machine Peeling machine
Slide 22: 22
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Slide 23: IC Substrate Ultra-Thin Board Equipment Promotion
23 Prime Proven Technology in IC Substrate Ultra-Thin the industry covering Board Equipment Promotion High Frequency and Speed for 5G Communication Optimize equipment and commercial market promotion High reliable automotive electronics Market for thin and compact FPC Expansion and Transfor
Slide 24: 2020~2021 FPD Industry Overview and Opportunities
2020~2021 FPD Industry overview and opportunities 24 • Mainland Customer G10.5、G8.6 TFT/OLED slows down in plant construction. • Large-scale applications of high- end automotive modules (3D) • Mini LED/Micro LED manufacturing process. • Gaming Panel Monitor demand promotes requirement of high- end p
Slide 25: Car Panel Oven, Curing & Lamination
Car Panel Oven, Curing & Lamination • Demand for Taiwan’s automotive panels expand and modification of Taiwan's automotive panels continues to 25 increase. • There are special line order from cars manufacturers. Q2, orders from I-company on car panel module automation line and Q3 H-company car panel
Slide 26: 3D Curved Protective Glass for Car
3D Curved Protective Glass for car • High-End Protective Glass Anti-glare and Anti-fingerprint layer baking line 26 for car panel. • Delivered to Japanese glass factory A company. Mass production for verification in Q3 • Negotiating co-operation with major China manufactures
Slide 27: Mini/Micro LED Application
Mini /Micro LED Application 27 • Mini LED backlight applications will gradually be used in high-end panels • Micro LED experimental lines are successively being introduced to gear up for mass production. • The glass backplane process has managed to introduce Oven, UV, and Plasma equipment for produc
Slide 28: Continuous Demand in Gaming Monitor
Continuous Demand in Gaming Monitor 28 • In Y2020, Gaming LCD shipments is forecasted to be 12.2 million units. • There is a 37% growth compared with Y2019. • The continuous increase in IPS and VA Technologies, as result a demand for new equipment.
Slide 29: Q4/2020 Outlook
Q4/2020 Outlook 29 • The G2C platform creates and provides equipment integration advantages. • Follow up on advanced packaging capital expenditures with the foundry company T. • Keeping up with the capital expenditures with advanced packaging of OEM T company. • System-in-package applications are wi
Slide 30: Thank You
Thank You
C Sun Mfg. — Investor Conference, Taiwan Stock Exchange, November 2020 on 6ix