C Sun Mfg. Ltd. · TWSE:2467
C Sun Mfg — Q3 2020 Earnings Presentation
33 slides from C Sun Mfg's earnings presentation, Oct 27, 2020
Slide 1: 2467.TT Investor Conference
2467.TT Morrison Liang, Chairman Jamie Wu, Co-head Kent Chen , Co-head Venue: Taiwan Stock Exchange Taipei 101 October 27th , 2020
Slide 2: Disclaimer
Disclaimer 2 This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “anticipate” , “believe”, “could”, “estimate”, “expect”, “intend”, “plan” , “forecast” ,”project”, “predict”, “potential”
Slide 3: Agenda
Agenda 3 • 2020 Q3 Operating Results • Growth Opportunities &Product Development • Q&A
Slide 4: 2020Q3 Operating Results
4 2020Q3 Operating Results
Slide 5: 2020 Q3 Operating Results
2020 Q3 Operating Results 5 in TWD millions 2020Q3累計 2019Q3累計 2019 2018 2017 Amount % Amount % Amount % Amount % Amount % Revenue-Consolidated 2,750 3,368 4,438 5,700 5,003 COGS 2,384 70.8% 3,170 71.4% 3,902 68.5% 3,345 66.9% Gross Margin 985 29.2% 1,268 28.6% 1,798 31.5% 1,658 33.1% Operating Expen
Slide 6: Growth Opportunities & Product Development
6 Growth Opportunities& Product Development
Slide 7: Growth Opportunities & Product Development
Growth Opportunities & Product Development 7 -G2C Alliance(C SUN、GPM、GMM) Strategic Alliances for Competitive Advantage -2019-2021 Operating Results Growth Opportunities : ．Advanced Packaging(SEMI) ．Flat Panel Display (FPD) ． Printed Circuit Board(PCB)
Slide 8: G2C Alliance association of businesses
The association among businesses in different industries Specialized in different area (Vertical Integration) Sufficient resources for all kinds of needs Members of the association 1,618, RD members 529 (occupy 33%)
Slide 9: System in a Package
System in a Package FRA IR ES He GPM ow GPM Gan iene Bes |; i ——® Boer wu ta en ae ae GMM Ue. Jig Saw 4 Pick & Place ————e _ =| ! as o- ¢esun CP test OVEN =U G2C —VATUARTS One Stop Shop © Wafer Mount —— Wafer AOL CSUN Own” a a | GMM ens Sorter Say ¢sun ¢sun Inline type Plasma Oven et) ss Sputter ll
Slide 10: Fan Out Wafer Level Package
an Out Wafer Level Packag ia St ae G2C —ATARTS One Stop Shop
Slide 11: G2C One Stop Shop
a. mit G2C —ATUARS if BB em One Stop Shop
Slide 12: 2020~2021 Growth Opportunities - Semiconductor Field
2020~2021 Growth Opportunities- Semiconductor Field Trend and market development 12 • Taiwan semiconductor supply Chains plays a key role in global semiconductor industry. • U.S.-China trade war and COVID crisis accelerate the diversion of industry cluster and expedite the back to Taiwan investment.
Slide 13: 2020~2021 Growth Opportunities - Semiconductor Field
2020~2021 Growth Opportunities- Semiconductor Field Trends/ market development 13 • The development of advanced packaging technologies spur the growth of 5G and AIoT silicons. • The demand of silicons for 5G, AI and Autonomous cars is clear sky. • COF packaging is in shortage as driver IC bumps into
Slide 14: Semiconductor Field: Advanced packaging moving to chip level
2020~2021 Growth Opportunities- Semiconductor Field 14 Advanced packaging technologies are moving to chip level – TSMC is the bellwether
Slide 15: Driver IC-COF R2R Oven
Driver IC-COF R2R Oven 15 • Fully automated non contact type R2R oven has been moved in customer in China in Q1 2020 and repeat order is received. • Applications: COF、FPCB、Flex panel display and flex- electronics. RTR Oven
Slide 16: Glue Dispensing Process—VPO
Glue Dispensing Process—VPO 16 • For chip on wafer and u bump de-bubbling. • Delivered to packaging big names. • VPO connecting with OHT is certified by big name DRAM manufacturer in multi stacking process. Vaccum/Pressure Oven
Slide 17: Growth Momentum in SEMI: 5G RF module
Growth Momentum in SEMI: 5G RF module • RF modules integrated tread: Power Amplifier/filter 17 integration Wafer roller laminating Fully auto wafer Mylar machine peeler
Slide 18: WLP / PLP Advanced Packaging Process
WLP / PLP Advanced Packaging Process • Fan-Out RDL, The vacuum laminator of TSV, auto oven system 18 • Wafer vacuum laminator is preparing for mass production and repeat order to T-company, applied for SoW process • Burn in Auto Oven had passed the test of China’s DRAM Packaging Fab, now we’re talki
Slide 19: AI & AIoT Chips
AI & AIoT Chips • The production of advanced package in 2.5D TSV grows 19 increasingly because of the growing needs of AI chips • 3D TSV is under mass production, we not only improved our quality, but also increase our productivity, we estimate the needs will over hundred in five years The new strat
Slide 20: Opportunity in PCB
2020~2021 Industrial Technology Opportunity in PCB 20 • IC substrate and HDI factory are continuously growing • 5G server board • Mini Led substrate is going to mass production
Slide 21: Growing number of IC substrate and HDI factories
The number of factories of IC substrate and HDI are growing 21 • IC substrate/Substrate-Like PCB and HDI advanced equipment packaging • The needs of ABF process equipment is continuously growing Ultra-thin plate high- Multi-chamber vacuum laminator (ABF) ABF Mylar Peeler order laminating machine
Slide 22: 5G server board
5G server board • The need of 5G cell site and cloud generator 22 room is increasing • Developing LCP market positively Auto UV LED RTR UV LED RTR Auto Exposure Exposure Laminator
Slide 23: Mini LED substrate step into mass production
Mini Led substrate step into mass production Along with the smart phone start to take mini 23 LED for backlight function, making the amount of demand larger Auto Vaccum Ultra-thin plate high- Auto Mylar Peeler laminator order laminating machine
Slide 24: 24
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Slide 25: Mature product and IC substrate ultra thin board equipment
Mature product IC Substrate ultra thin 25 high market share board equipment promotion 5G communication, high frequency Optimize the vertical equipment、 and high speed commercialize marketing Automotive electronics, reliability FPC market, thin and fine Industrial transformation and expansi
Slide 26: 2020~2021 FPD industry and the opportunity
2020~2021 FPD industry and the opportunity 26 • G10.5、G8.6 TFT/OLED expansion demand in China • High in-vehicle mode applied for big size(3D nurb) • Mini LED/Micro LED • The needs of E-sport FPD boost the high class process
Slide 27: In-vehicle panel curing, aging, laminating
In-vehicle panel curing, aging, laminating 27 • Taiwan’s in-vehicle board expands production, the needs of revising machine is growing • Q2 I company ordered in-vehicle panel mode automatic process, Q3 H company ordered in-vehicle panel aging process. We’ve earned the exclusive order from the car fa
Slide 28: 3D curved protective glass for car
3D curved protective glass for car • Panel for cars with high protective glasses for Anti-glare and Anti- 28 fingerprint Coating baking line • Handed to the Japan’s well known glasses factory A company, Q3~testing for mass production process • Talking about collaboration with China’s Factory
Slide 29: Mini/Micro LED apply
Mini /Micro LED apply 29 • Mini LED backlight apply gradually play a role in high class panel • Importing Micro LED control line, for the preparation of mass production • Glass panel process import baking、UV、Plasma equipment on apply products • Q2 earned Epitaxial factory apply plasma on mini LED de
Slide 30: Needs of E-sport panel
Needs of E-sport panel 30 The delivery of e-sport LCD in 2020 is about 12,200,000 The amount increased 37% in 2019 IPS、VA technology is developing, so do the demand
Slide 31: Q4 / the expectation in 2020
Q4/the expactation in 2020 31 • G2C organization create the value of vertical integration • Advanced packaging continuously absorbing OEM T Factory, and Packaging factory A CapEx • IC substrate、mini LED apply continuously expanding, absorbed the investment from Taiwan • The demand of HDI server boar
Slide 32: Q&A
32 Q&A
Slide 33: Thank You
Thank You