Nidec Chaun-choung Technology Corporation · TWSE:6230
Nidec Chaun-choung Technology — H1 2023 Earnings Presentation
14 slides from Nidec Chaun-choung Technology's earnings presentation, Aug 25, 2023
Slide 1: 1H, 2023 Investor Conference
1H, 2023 Investor Conference 尼得科超眾科技股份有限公司 Nidec Chaun-Choung Technology Corp. Date: Aug. 25th, 2023 Nidec Chaun-Choung Technology Corporation 2023/8/23 0/14
Slide 2: Disclaimer
Disclaimer This presentation of NCCI contains forward-looking statements subject to risks and uncertainties. Actual results may differ materially from the contained in the forward-looking statements. The forward-looking statements in this presentation are the current belief of NCCI as of the date fo
Slide 3: Agenda
Agenda • Company Profile • 1H, 2023 Financial Results • Focus: Market, Products & Technologies • Q&A 2023/08/25 2
Slide 4: Company Profile
Company Profile • Chairman and CEO：Nagai Junichi • Founded : Dec.14. 1973 • Stock Listing：TWSE ( ticker: 6230) • Nidec Corporation: Hold 86.3% shares, as a major shareholder (Jul. 2023). • Capital : NT$ 863,434 (K) • HQ Address : No. 184-3, Zhongxing N. St., Sanchong Dist., New Taipei City 241, Taiw
Slide 5: Worldwide Factories & Offices
Worldwide Factories & Offices 2023/08/25
Slide 6: Financial result-Product Mix
Financial result-Product Mix 2023/08/25 5
Slide 7: Financial Result-Revenue
Financial Result-Revenue NTD$: Million 2023/08/25 6
Slide 8: Financial Result-Financial Index I.
Financial Result-Financial Index I. 2023/08/25 7
Slide 9: Financial Result-Financial Index II
Financial Result-Financial Index II 2023/08/25 8
Slide 10: Focus Market
Focus Market 5G : Network/Telecom. PC: NB / DT HPC Heat Transfer Core Technology Automotive (EV) Gaming Portable Devices 2023/08/25 9
Slide 11: Focus Developing Products - I
Focus Developing Products - I • Slim Thermal Solution for DRAM Ultra Thin VC (t<1.0mm) for 6 Watts • Slim Thermal Solution for Gaming NB Slim VC (1.0mm≤ t ≤2.0mm) for CPU+GPU 140 Watts 2023/8/23 10
Slide 12: Focus Developing Products - II
Focus Developing Products - II • Hi-Power VC Thermal Solution for HPC Server High Heat Flux Vapor Chamber > 80 W/cm2 • Hi-power Heat Pipe Module for 5G Telecom Switch Long Heat Pipe L ≥ 600 mm for 500Watts 2023/8/23 11
Slide 13: Focus Developing Products - III
Focus Developing Products - III • Ultra-thin Thermal Solution for 5G Smart Phone ∙ VC Thickness 0.25mm – 0.35mm • IGBT (Insulated Gate Bipolar Transistor) Thermal Solution - Electric Vehicle ∙ 45KW, Cold Plate 2023/8/23 12
Slide 14: Competitive Advantages
Competitive Advantages • Metallurgy & Wick Technology – Nidec & NCCI team with strong basic research and Proprietary multi-wick design to support Ultra-thin / Hi-power Thermal Solutions. • Automation Equipment Building in House – Nidec & NCCI team up to develop manufacturing machine from sample to m
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