Nidec Chaun-choung Technology Corporation · TWSE:6230
Nidec Chaun-choung Technology — 1H 2026 Investor Conference
18 slides from Nidec Chaun-choung Technology's conference presentation, Aug 28, 2026
Slide 1: 1H 2026 Investor Conference
1H 2026 Investor Conference 尼得科超眾科技股份有限公司 Nidec Chaun-Choung Technology Corp. August 28th, 2026 2026/8/28
Slide 2: Disclaimer
Disclaimer This presentation of NCCI contains forward-looking statements subject to risks and uncertainties. Actual results may differ materially from those contained in the forward-looking statements.. The forward-looking statements in this presentation are the current beliefs of NCCI as of the dat
Slide 3: Agenda
Agenda • Company Profile • 1H, 2026 Financial Results • Focus: Market, Products & Technologies • Q&A 2026/8/28 2
Slide 4: Company Profile
Company Profile • Chairman and CEO： Sumikawa Yohei • Founded: Dec. 14, 1973 • Stock Listing: TWSE (Ticker: 6230) • Nidec Corporation: Shareholding: 86.30% (Aug. 2026) • Capital : NT$ 863,434 (K) • HQ Address : No. 184-3, Zhongxing N. St., Sanchong Dist., New Taipei City 241, Taiwan • Main Business :
Slide 5: Worldwide Factories & Offices
Worldwide Factories & Offices 2026/8/28 4
Slide 6: Operating Performance / Revenue Mix
Operating Performance / Revenue Mix 產品組合 3% 5% 3% 3% 5% 7% 7% 7% 12% 11% Others 26% 25% 14% 13% 20% 21% 7% 10% 12% 21% Game Console 17% 13% DT 24% 25% 34% 33% 16% 16% Network 32% 38% 32% Server 30% 29% 28% NB FY2022 FY2023 FY2024 FY2025 2026Q1 2026Q2 FY2022 FY2023 FY2024 FY2025 FY2026 Q1 FY2026 Q2 N
Slide 7: Operating Performance / Financial Results
Operating Performance / Financial Results Business Performance 14,000 25% 12,000 20% 10,000 15% NTD'000 8,000 10% 6,000 5% 4,000 2,000 0% 0 -5% 2022年 2023年 2024年 2025年 2026年6月止 Net sales 11,898 10,759 8,124 9,094 4,678 Gross Profit Margin 18% 20% 18% 15% 17% Net Profit Margin 5% 5% 2% -2% -3% FY NTD
Slide 8: NCCI Business Strategy
NCCI Business Strategy ① Expansion of AI and Liquid Cooling ② Strengthening the Manufacturing Base Business Focus on Liquid Cooling Development Optimization of Manufacturing Footprint Establish a dedicated liquid cooling Increase in-house production and development organization for server consolidat
Slide 9: Priority Development Target Markets
PRIORITY DEVELOPMENT TARGET MARKETS Aide All for dreams 5 PC : NB/DT = + 5G: NETWORKING HPC: HIGH-PERFORMANCE COMPUTING 2026/08/10 CORE THERMA' TECHNOLOGY a & 82S GREEN ENERGY & ENERGY STORAGE SYSTEMS MEDICAL & AEROSPACE @* EQUIPMENT Gp * \ acy
Slide 10: NCCI Thermal Product Line
NCCI Thermal Product Line 100 kW NCCI Thermal Capability Liquid Cooling Module (LCM) NCCI (CN, VN) Coolant Distribution Manifold (CDM) NCCI (CN, VN) Coolant Distribution Unit (CDU) Nidec (TH)+NCCI (CN) Liquid to Liquid Liquid to Air 10 kW Small Pump Nidec Sankyo (VN) Fan Nidec (CN, VN, PH) HP / VC N
Slide 11: NCCI High-Wattage Air/Liquid Cooling Solutions
NCCI High-Wattage Air/ Liquid Cooling Solutions High Power D8 HP Module 300~500 Watts HP/VC Module 800~1300 Watts 2025 2027 2026 2028 HP/VC Module LCM/CDM 500~800 Watts 3000~7000 Watts
Slide 12: Applications: Notebook PC / Desktop PC
Applications: Notebook PC / Desktop PC Current AI人工智慧產品 Future Big diameter Heat pipe for CPU & GPU Heat pipe diameter : 6mm ➔ 10mm Thermal Solution for Al Laptop Thermal Solution for Al Laptop D6/D8 Heat pipe Solution CPU+GPU 25~60 Watts D6+D8 Heat pipe Solution CPU 110Watts Gaming / High power Sol
Slide 13: Applications: Networking Products
Applications: Networking Products Current Future Hi-Power Air Cooling Solution for Switch Remote VC+ Heatpipe module : 850W ➔ 1300W 850 W VC solution 1300 W Remote VC+HP Solution Heat Pipe Solution for Base Station Product Heat pipe solution : 65W ➔ 230W Power1: 180W 65 W Power2: 50W VC Solution for
Slide 14: Applications: Servers
Applications: Servers Current Future Air cooling solution for Edge Server CPU CPU solution : 500W ➔ 600W CPU solution: 280W CPU solution : Total 400W Heat pipe solution for Cloud server CPU air cooling CPU solution : 1000W ➔ 1400W Two CPU<1000W Two CPU>1400W Hi-Power VC + HP Thermal Solution for AI
Slide 15: Applications: Liquid Cooling Solutions
Applications: Liquid Cooling Solutions Validation solutions Standard Cold plate SP3 SP5 (Milan, Rome) (Genoa) SP7 SP8 Mini CDU Cooling capacity 8kW, 30kW EGS EGS+HBM BHS SP 350W BHS AP 500W Manifold LCM Manifold CPU & GPU LCM ASIC & PCIe LCM Server Manifold Rack Manifold Row Manifold Custom Manifold
Slide 16: Business Outlook & Strategic Roadmap
Business Outlook & Strategic Roadmap 6230.TW Investor Conference Market Trends & Technology Application Innovation & Evolution Future Market Focus Air Cooling ➔ Liquid Cooling ■ Core Product Markets: Thermal Capacity Breakthrough: Addressing the shift to liquid cooling as AI chip power rises Maintai
Slide 17: Q&A
Aide All for dreams Q&A 2025/08/29 16
Slide 18: dec
dec —AIl for dreams
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