Slide 1: Realizing IOWN 2.0: Development Status and Future Outlook of Opto-Electronics Convergence Network Switches
Realizing IOWN 2.0 : Development Status and Future Outlook of Opto-Electronics Convergence Network Switches Masahito Tomizawa, Senior Executive Vice President and CTO, NTT Innovative Devices Corporation October 6, 2025
Slide 2: Challenging the World with IOWN and Optical Communication
Introduction Challenging the World with IOWN and Optical Communication Effectively No Distance Solving Power Issues in Data Centers IOWN 1.0 （PEC-1） IOWN 2.0 （PEC-2） NTT Innovative Devices Corp. ©2025 – Proprietary & Confidential 2
Slide 3: AI: The Tilt for Computational Performance
AI : The Tilt for Computational Performance Legacy cloud services AI (e.g. LLM) Tasks Relatively small Huge With one processor Server To do one task, shared across multiple (processor) 1000 + processors tasks Between processors Key Technology Virtualization communication network Accelerating need fo
Slide 4: Demand for Processing Power
AI : The Tilt for Computational Performance Demand for Processing Power NTT Innovative Devices Corp. ©2025 – Proprietary & Confidential 4
Slide 5: Directions for Surging AI Demand
Directions for Surging AI Demand Three Pillars of Semiconductors Advanced Semiconductor Pushing Miniaturization to the Limit Miniaturization （7nm 5nm 3nm 2nm Sub2nm Å） Planar integration is reaching its limits Ultra-Dense Packaging — shifting toward 2.5D and 3D packaging Limits of electrical technol
Slide 6: Advanced Semiconductor Miniaturization
Advanced Semiconductor Miniaturization The Limits of Moore's Law • Moore's Law: The integration rate of semiconductor integrated circuits doubles every 18 months (later, every 24 months). • When a circuit is miniaturized to 1/k, the area becomes 1/k², the power consumption becomes 1/k², and the perf
Slide 7: The Road to High Frequency and Low Power Toward Opto-Electronic Convergence
The Road to High Frequency and Low Power Toward Opto-Electronic Convergence 50~100 GHz is already in practical use Electrical Wiring I/O Power Consumption [mW] Electricity Electrical Wiring Electrical Wiring Optical Wiring Optical Wiring Optical Wiring On-Board Signal Transmission [cm] Optical signa
Slide 8: Evolution of Opto-Electronic Devices
Evolution of Opto-Electronic Devices Roadmap PEC : Photonics Electronics Convergence Commercialization CY2021 CY2023 CY2025 – CY2026 CY2028 CY2032 Generation PEC-1 DC to DC PEC-2 Board to Board PEC-3 Package to Package PEC-4 Die to Die Data-rate 400G->800G->1.6T->3.2T-> 1.6T->3.2T->6.4T-> 64G->128G-
Slide 9: NTT and the History of Optical Innovation
NTT and the History of Optical Innovation 1P Target of IOWN 100 T Gen 3 Optical 10 T Data Rate [bps] Gen 2 Optical 1T 100 G 10 G Gen 1 Optical 1G 100 M 1980 1990 2000 2010 2020 2030 Commercialization Year NTT Innovative Devices Corp. ©2025 – Proprietary & Confidential 9
Slide 10: NTT and the History of Optical Innovation
NTT and the History of Optical Innovation 1P Target of IOWN 100 T Gen 3 Optical 10 T Data Rate [bps] Gen 2 Optical 1T 100 G 400G COSA+DSP ROADM AWG 10 G Gen 1 100G/200G GaAs products DSP Optical 1G 40G-OTN 100 M Laser module Optical fiber 1980 1990 amplifier2000 2010 2020 2030 Commercialization Year
Slide 11: 10 Million× Growth in 50 Years
NTT and the History of Optical Innovation Smartphone Telephone PC＋Mobile AI ＋Cloud 1P Target of IOWN 10 Million× Growth in 50 Years 100 T NTT’s Contribution to Gen 3 Optical Optical Products （Core DSP Adoption） 10 T Data Rate [bps] Gen 2 Optical JP Network： 72 % US Network：14+α% 1T 100 G 400G COSA+D
Slide 12: Opto-Electronic Switch Overview
Opto-Electronic Switch Overview Conventional Optical Communication Switch Front View Optical Switch IC Chip Communication Chassis Module Insertion Port for Optical Communication Module Electrical Wiring Length Optical Wiring ～300mm Opto-Electronic Converged Switch Top View Switch IC Chip Optical Eng
Slide 13: Optical Computing at the Expo Pavilion
Optical Computing at the Expo Pavilion • At the NTT Pavilion of the Osaka-Kansai Expo, a computer powered by IOWN 2.0 achieved one- eighth the power consumption. • This remarkable efficiency was made possible by a combination of advanced devices, computer architecture, and software. IOWN Optical Com
Slide 14: PEC-2: Commercial Deployment of Opto-Electronic Converged Switches
PEC-2 Commercial Deployment of Opto-Electronic Converged Switches NID Products System Partner Products System Partner Products Server-to-Server “6.4T Optical engine & “102.4T SW-BOX” ”Switch Rack” Interconnection within a 102.4T CPO-SW Module” Data Center • Commercialization Target: Q4 2026 (Sample
Slide 15: Within AI Data Centers: From Scale-Out to Scale-Up
Within AI Data Centers From Scale-Out to Scale-Up Data Center Switch Architecture & Opto-Electronic Switch Deployment Scale-up Switch Switch Switch … Switch Switch Switch Switch … Switch Switch … Copper Optics Optical Integration within the Scale- Up Domain Accelerators Accelerator Accelerator … … A
Slide 16: PEC-2: Commercial Deployment of Opto-Electronic Converged Switches
PEC-2 Commercial Deployment of Opto-Electronic Converged Switches • 102.4 Tbps Capacity, 50% Power Reduction with Switch Alone • Partnership Established: Broadcom + Accton • Market Launch Starting in 2026 ‒ 2026 Q2: Optical Engine Samples ‒ 2026 Q3: Live Demonstration at OCP 2026 ‒ 2026 Q4: Commerci
Slide 17: On Market Competitiveness
On Market Competitiveness • A Unique Socket-type Optical Engine ‒ Enables fundamental reduction in repair costs in case of optical engine failure ‒ Flexibly supports media mix (short-reach, long-reach, wavelength-division multiplexing, etc.) and evolving data center configuration ‒ A multi-vendor su
Slide 18: Partner List
Partner List NTT Innovative Devices is responsible for the overall design of the CPO-SW module, and a coordination of the entire process including an alignment of partner companies to deliver the product. Design & delivery of Design & manufacture of 102.4Tbps SW-LSI 102.4Tbps SW-BOX Manufacture of t
Slide 19: PEC-3 (Next-Generation)
PEC-3（Next-Generation） Chip-to-Chip Optical Interconnect (Optical Chiplet) (8mm x 10 mm) Optical Switch GPU HBM GPU Board Optical Very thin active region Chiplet GPU Package Optical propagation in III-V semiconductor Transmission waveform: 64Gbps Multiple-Board Rack Liquid Cooling unit （Number of GP
Slide 20: Feasibility check 0.26 pJ/bit for 64 Gbps @ 10 mA
Feasibility check 0.26 pJ/bit Demonstration DFB laser InP waveguide DUT: Device under test EAM RF cable RF cable PPG Bias-T Bias-T RF amp. probe probe InP taper DC power supply DUT DC power SiOx waveguide (EAM) Stage supply (PD) DC power supply Sampling E-O-E measurement (laser) Oscilloscope Experim
Slide 21: Summary
Summary As AI becomes mainstream, connecting vast numbers of processors through networks is essential. For low-power connections, optical communication is virtually the only viable solution. NTT will continue to leverage its extensive experience in optical communications to take on global challenges
Slide 22: Forward-looking statements and translation notice
This document is a translation of the Japanese original. The Japanese original is authoritative. The forward-looking statements and projected figures concerning the future performance of NTT and its subsidiaries and affiliates contained or referred to herein are based on a series of assumptions, pr