Schmid Group N.v. Class A Ordinary Shares

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Group N.V. Provides Q1 2026 Business Update and Balance-sheet Strengthening

SCHMID Group Secures Major Order for Wet-Process Production Equipment Supporting AI- and HPC-Infrastructure

SCHMID Group N.V. announces closing of the second tranche of its USD 30 million convertible notes financing

SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company