SCHMID Group N.V. · NASDAQ:SHMD
SCHMID — SCHMID Webinar: inside the industry (September 2026)
13 slides from SCHMID's conference presentation, Sep 24, 2026
Slide 1: SCHMID Webinar inside the industry
SCHMID Webinar inside the industry Sept. 24th 2026
Slide 2: Strategic Market Imperative: AI-Driven Advanced Packaging
Strategic Market Imperative AI-Driven Advanced Packaging The Market and our Position: • AI infrastructure is reshaping the Advanced Packaging demand • Value is shifting towards Advanced Packaging (high-density interconnects, power delivery and PLP) • SCHMID is uniquely positioned as a process and yi
Slide 3: Where We Play: Focussed Growth Strategy
Where We Play Focussed Growth Strategy Where we play: • AI Server Boards & Modules (HDI / high layer count) • IC Substrates (mid-term recovery + AI upside) • Panel-Level Packaging (Chiplets → the growth engine) How SCHMID contributes: • We deliver: • Best in class Yield (biggest lever) • Premium pro
Slide 4: Key market trends
Key market trends Globaly Heterogeneous Integration Disaggregation of monolithic dies into Shift to Heterogeneous Integration chiplets HPC now focuses on heterogeneous integration beyond transistor scaling. Complexity is moving from silicon to the package level. Challenges in Advanced Packaging Key
Slide 5: Key market trends: Larger and Larger Package Sizes
Key market trends Globaly Larger and Larger Package Sizes 4
Slide 6: Panel formats are not standardized — sizes range 310 to 700 mm
Panel formats are not standardized — sizes range 310 to 700 mm Competitive landscape — panel size and capacity Player Panel size Status Note TSMC evaluates two tracks • Longtan pilot runs one line with global Extends CoWoS-R and -L equipment vendors and one with TSMC (CoPoS) 310 × 310 mm Pilot; 2–3
Slide 7: Market Outlook
Market Outlook Based on several Market Intelligence Provider and SCHMID internal assessment • Overall, the market is projected to grow at a CAGR of 8% • Strongest growth is expected in the 18+ multilayer PCB – mainly driven by AI Server Board demands. Some expect AI-Server Boards to account to 10% o
Slide 8: FCBGA Substrate capacity falls short from 2027
FCBGA Substrate capacity falls short from 2027 Substrate manufacturer trends — supply & demand Build-up capacity vs demand (million m², layer-adj.) +20 % substrate prices so far, still rising Capacity Demand 33.5 per fully automated build-up line $1B (excl. building) for 0.6 – 1.0 million m2 p.a. 28
Slide 9: Glass Core Substrates
Glass Core Substrates The Evolution of Boards 8
Slide 10: Organic Core and Glass Core
Organic Core and Glass Core • Organic Core Substrates are the major Substrate category to date. • With increasing miniaturization requirements to sub 5µm, the SCHMID ET Process will be needed. • TGV (Through Glass Via) are necessary for increasing the density of the vertical Core connections. • SCHM
Slide 11: TGV metallization is the hurdle — and SCHMID's differentiator
TGV metallization is the hurdle — and SCHMID's differentiator Conformal liner + plug Butterfly / bridge fill SCHMID seed-less bottom-up fill fills bottom → top void risk + Low Cu volume → low stress in glass; RF-friendly + Standard ECD on a sputtered seed + Fills from the closed bottom: no void trap
Slide 12: Our full integrated Approach for Advanced packaging
Our full integrated Approach for Advanced packaging Touch free combined with optimized Clean Room Concepts for HVM Handling & Automation Wet Tools Plasma Process Plating Planarization EFEM Solutions InfinityLine V+ InfinityLine P+ PlasmaLine D InfinityLine C+ Automation, Intralogistics InfinityLine
Slide 13: Key messages for today
Key messages for today Executive summary PLP is emerging, not mature. Yole's $160M → >$650M (2024–30) is market revenue, not equipment — and AST, SpaceX and Rapidus are 1 not in it. Volume from end-2026 (ASE), 2027–28 (PTI, TSMC). Panel plating is consolidating. AMAT (NEXX) and Lam (Semsysco) now co
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