Aixtron Se · XETR:AIXA

Aixtron — Q1 2016 Earnings Presentation

36 slides from Aixtron's earnings presentation, April 2016

  1. Slide 1: AIXTRON Investor Presentation

    AIXTRON Investor Presentation IR Presentation – Q1/2016 (FSE: AIXA, ISIN DE000A0WMPJ6, NASDAQ: AIXG, ISIN: US0096061041) © AIXTRON Investor Relations, April 2016

  2. Slide 2: Forward-Looking Statements

    AIXTRON INVESTOR PRESENTATION 2 Forward-Looking Statements This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON within the meaning of the safe harbor provisions of the US Private Securities Litigation

  3. Slide 3: Who we are

    ABOUT AIXTRON 3 Who we are  Headquarters based in Herzogenrath, Germany  Technology leader in deposition systems  Worldwide presence with 12 sales/representatives offices  More than 3,000 deposition systems delivered and production facilities all over the world  Company founded in 1983 – over 3

  4. Slide 4: Global Presence

    ABOUT AIXTRON 4 Global Presence

  5. Slide 5: Our Vision: Technology. Materials. Performance.

    ABOUT AIXTRON 5 Our Vision Technology. Materials. Performance. Technology. Materials. Performance. We are the recognized We enable our We deliver the technology leader customers to performance driving in complex material successfully shape the economic success deposition. markets of the future, thro

  6. Slide 6: Our Technology. Your FUTURE.

    AIXTRON TECHNOLOGIES 6 Our Technology. Your FUTURE. Compound Semiconductors Silicon Semiconductors LED Lighting Memory & Logic Organic Carbon OLED Power Management

  7. Slide 7: Our Technology Portfolio

    AIXTRON TECHNOLOGIES AND PRODUCTS 7 Our Technology Portfolio Silicon Compound Semiconductors Organic Carbon Semiconductors MOCVD ALD/MOCVD OVPD®/PVPD®/TFE PECVD LEDs, Lasers and Power Management Silicon Graphene, Organic Electronics Optoelectronics GaN / SiC Semiconductors CNTs and CNWs • LEDs for d

  8. Slide 8: Revenue Analysis

    OPERATIONS 8 Revenue Analysis Q1/2016: Q1/2016: Q1/2016: by equipment & spares by end application by region (equipment only) 8% 15% 17% 44% 13% 36% 26% 70% 56% 15% LED Equipment Silicon Asia Spares Power Electronics Europe Optoelectronics USA Others

  9. Slide 9: 24-Month Business Development

    FINANCIALS 9 24 - Month Business Development (€ million) Total Order Intake 49.7 50.2 49.3 48.9 52.5 44.4 34.4 31.3 @ $1.35 @ $1.25 @ $1.10 Equipment (only) 91.2 70.7 79.0 72.3 66.4 65.2 67.7 Order Backlog 42.9 * @ $1.35 @ $1.25 @ $1.10 *) revalued on Jan.1, 2016 to €46.7m at $1.10/€ Total Revenues

  10. Slide 10: Consolidated Income Statement

    Financials 10 Consolidated Income Statement* (€ million) Q1/16 Q1/15 +/- Q1/16 Q4/15 +/- Revenues 21.4 40.3 -47% 21.4 62.5 -66% Cost of sales 18.3 31.5 -42% 18.3 42.8 -57% Gross profit 3.1 8.8 -65% 3.1 19.6 -84% Gross Margin 15% 22% -7 pp 15% 31% -16 pp Selling expenses 2.9 3.3 -12% 2.9 2.6 12% Gene

  11. Slide 11: Consolidated Statement of Financial Position

    Financials 11 Consolidated Statement of Financial Position* (€ million) 31/3/16 31/12/15 31/3/15 Property, plant & equipment 79.0 81.3 79.4 Goodwill 74.6 75.9 65.7 Other intangible assets 6.0 6.4 2.3 Others 3.3 3.9 5.0 Non-current assets 162.9 167.6 152.5 Inventories, WIP & Finished Goods 73.6 70.8

  12. Slide 12: Consolidated Statement of Cash Flows

    Financials 12 Consolidated Statement of Cash Flows* (€ million) Q1/16 Q1/15 Q1/16 Q4/15 Cash Flow from operating activities -19.4 -10.1 -19.4 -32.1 Cash Flow from investing activities 7.1 11.3 7.1 30.1 Cash Flow from financing activities 0.0 0.0 0.0 0.0 Exchange rate changes -2.7 6.2 -2.7 0.8 Net ch

  13. Slide 13: Market Prospects

    FUTURE MARKETS 13 Market Prospects Short-Term • Further increasing adoption of LEDs for Solid State Lighting • Increased emergence of wide band gap GaN or SiC based devices for energy efficient power management • Development of next generation NAND and DRAM memory devices • Further progress in the d

  14. Slide 14: AIXTRON Investor Presentation

    AIXTRON INVESTOR PRESENTATION 14

  15. Slide 15: AIXTRON Key Enabler for Innovative Future

    AIXTRON TECHNOLOGIES AND PRODUCTS 15 AIXTRON  Key Enabler for Innovative Future New Complex Materials Tech Trends Compound Semiconductors • GaAs/ GaN (Sensors) • GaN/SiC (RF/Power – Mobile) LOREM • GaAs/InP (Laser - Datacom) • GaN (LED – LiFi) Silicon Semiconductors Big Data LOREM • III-V (Next-gen

  16. Slide 16: LED Lighting Market: Multiple Tipping Points

    INDUSTRY & MARKETS 16 LED Lighting Market: Multiple Tipping Points Source: : AIXTRON, McKinsey 2012 LED Lighting Cycle Various Different Numerous Applications Regions Players

  17. Slide 17: LED Lighting Market Estimates

    INDUSTRY & MARKETS 17 LED Lighting Market Estimates Source: IHS Q1/2016, Strategies Unlimited Globalization and urbanization to drive LED lighting opportunities: • Emerging countries: need for energy efficient lighting solutions • Developed countries: SSL driven by expanding renovation market • Outd

  18. Slide 18: Technology Position

    AIXTRON TECHNOLOGIES AND PRODUCTS 18 Technology Position MOCVD for LEDs, MOCVD for Power Lasers and Management Optoelectronics MOCVD for III-V on ALD for Memory ALD for Memory Silicon  Customer B & C  Customer A OVPD for OLED deposition Thin-Film Carbon Encapsulation for OLED R&D Demo &Qualificati

  19. Slide 19: Compound Semiconductors – MOCVD

    AIXTRON TECHNOLOGIES AND PRODUCTS 19 Compound Semiconductors – MOCVD Two Reactor Technologies  Planetary Reactor® & Close Coupled Showerhead® (CCS) • Addressing multiple industries • Established industry standard & market leading • Configurable, extendable common platform • Introduced the latest MO

  20. Slide 20: Compound Semiconductors – Wide Band Gap Power Electronics

    AIXTRON TECHNOLOGIES AND PRODUCTS 20 Compound Semiconductors – Wide Band Gap (WBG) Power Electronics Consumer Electronics & IT Automotive Energy Industrial Power Management Power Switching 30V 600V 1.2 kV ≥2kV • Electronic appliances • Infotainment • General automotive electro • Power Grid / Smart m

  21. Slide 21: Compound Semiconductors – Wide Band Gap Power Electronics

    AIXTRON TECHNOLOGIES AND PRODUCTS 21 Compound Semiconductors – Wide Band Gap (WBG) Power Electronics Source: DOE, IHS Q4/2014 WBG GaN and SiC based Power Management Device Shipments ~10x CAGR: 33% ~7x 1x (2015: Indexed=1z) 2015e 2020e 2023e Higher- Reduced Energy High Voltage Improved power Higher t

  22. Slide 22: Organic Electronics – OVPD + Encapsulation

    AIXTRON TECHNOLOGIES AND PRODUCTS 22 Organic Electronics – OVPD® + Encapsulation Source: DisplaySearch, AIXTRON OLED manufacturing process Cleaning Cleaning Glass cutting ITO deposition Organic material deposition Bonding Coating Etching Cathode deposition Aging Stripping Encapsulation Final test Te

  23. Slide 23: Organic Electronics – Front-end Process Equipment

    AIXTRON TECHNOLOGIES AND PRODUCTS 23 Organic Electronics – Front-end Process Equipment Source: IHS; AIXTRON internal estimates Focus Activities Cumulative Capex Key competency: Thin-film deposition Value creation: 60% 100% 80% 75% 55% 45% 40% 20% 20% 5% 10% 5% Cathode Module Cleaning Deposition depo

  24. Slide 24: Organic Electronics – OVPD

    AIXTRON TECHNOLOGIES AND PRODUCTS 24 Organic Electronics – OVPD® Product Description – OVPD  Proprietary carrier-gas enhanced gas phase deposition approach for organic thin films*  Based on AIXTRON‘s core competence of carrier gas enhanced vapour phase deposition  Free scalability: suitable for a

  25. Slide 25: Organic Electronics – OPTACAP PECVD

    AIXTRON TECHNOLOGIES AND PRODUCTS 25 Organic Electronics – OPTACAP™ PECVD Product Description – OptaCap™ PECVD  Proprietary PECVD technology based on linear plasma sources  Based on AIXTRON‘s core competence of carrier gas enhanced vapour phase deposition “Disruptive deposition technology  Free s

  26. Slide 26: Silicon Semiconductors – Leading Edge Technologies

    AIXTRON TECHNOLOGIES AND PRODUCTS 26 Silicon Semiconductors – Leading Edge Technologies Source: Gartner 2016 At the forefront to extend Moore’s Law Memory Logic transistor Interconnects (ALD) (MOCVD- III-V) (Graphene/CNT) >3x ≤22nm fab capacities “More than Moore” ~1.1x Total fab capacities (2015: I

  27. Slide 27: Silicon Semiconductors - ALD

    AIXTRON TECHNOLOGIES AND PRODUCTS 27 Silicon Semiconductors - ALD Product Description – ALD • 300mm ALD Technology • QXP-8300 Mini-batch system • High throughput : 2 Process Chambers – 8 stations “Best-in class technology, state of the art • Up to 3 vaporizers and one bubbler deposition system, lowe

  28. Slide 28: Carbon Nanomaterials – PECVD

    AIXTRON TECHNOLOGIES AND PRODUCTS 28 Carbon Nanomaterials – PECVD Graphene and Carbon Nanotube Deposition Systems • Proprietary thermal and plasma enhanced chemical vapour deposition technology • Excellent uniformity and reproducibility with fast turnaround cycle times • BM platform: BM R&D (2-inch)

  29. Slide 29: Consolidated Income Statement

    FINANCIALS 29 Consolidated Income Statement* (€ million) 2015 2014 2013 Revenues 197.8 193.8 182.9 Cost of sales 147.9 154.1** 204.7** Gross profit 49.8 39.7** -21.8** Gross Margin 25% 21% -12% Selling expenses 11.5 14.1** 14.5** General & admin expenses 16.3 19.3 18.2 R&D 55.4 66.7 57.2 Net other o

  30. Slide 30: Consolidated Statement of Financial Position

    Financials 30 Consolidated Statement of Financial Position* (€ million) 31/12/15 31/12/14 31/12/13 Property, plant & equipment 81.3 77.3 79.9 Goodwill 75.9 64.8 64.1 Other intangible assets 6.4 2.5 3.1 Others 3.9 4.6 5.7 Non-current assets 167.6 149.2 152.7 Inventories, WIP & Finished Goods 70.8 81.

  31. Slide 31: Consolidated Statement of Cash Flows

    FINANCIALS 31 Consolidated Statement of Cash Flows* (€ million) 2015 2014 2013 Cash Flow from operating activities -45.7 -33.8 8.2 Cash Flow from investing activities 41.2 -23.2 -39.7 Cash Flow from financing activities -0.1 0.2 101.6 Exchange rate changes 4.3 5.9 -2.4 Net change in Cash & Cash Equi

  32. Slide 32: Annual Equipment Revenues by Application (excl. spares)

    OPERATIONS 32 Annual Equipment Revenues by Application (excl. spares) 800 (EUR million) 700 600 500 400 300 200 100 0 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 LED Silicon Power Electronics Optoelectronics* Others * Optoelectronics includes applications in

  33. Slide 33: Equipment Order Intake per Quarter

    OPERATIONS 33 Equipment Order Intake per Quarter driven by strategic (EUR million) 250 China investments Overcapacity driven by LED TV Absorption, Industry 200 driven by Consolidation notebook driven by driven by backlighting 150 telecom/datacom mobile phone and mobile phone penetration 100 50 0 1Q9

  34. Slide 34: Global Presence

    ABOUT AIXTRON 34 Global Presence AIXTRON SE Headquarters AIXTRON Ltd. AIXTRON Inc. Herzogenrath, Germany Cambridge, United Kingdom Sunnyvale, California, USA Core of AIXTRON’s activities is Focus on key MOCVD reactor Focus on silicon applications for the Technology and R&D Center component technolog

  35. Slide 35: Financial Calendar & Contact Data

    35 Financial Calendar & Contact Data • May 25, 2016 Annual General Meeting, Aachen • July 26, 2016 H1/2016 Results, Conference Call • October 25, 2016 9M/2016 Results, Conference Call • February 2017 FY/2016 Results, Conference Call For further information please contact: Investor Relations & Corpor

  36. Slide 36: Thank you very much for your attention.

    Thank you very much for your attention. AIXTRON SE Dornkaulstr. 2 52134 Herzogenrath Germany Phone +49 (2407) 9030-0 Fax +49 (2407) 9030-40 E-Mail invest@aixtron.com

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