Acm Research, Inc. · NASDAQ:ACMR
Acm Research — Investor Presentation (August 2026)
23 slides from Acm Research's investor presentation, August 2026
Slide 1: ACM Research, Inc. August 2026 Investor Presentation
Technology Product Customer Differentiation Platformization Globalization ACM Research, Inc. August 2026 Investor Presentation
Slide 2: Disclosures
DISCLOSURES Forward-looking Statements. Certain state ments containe d in this prese ntation are not historical facts and may be forward -looking state ments within the meaning of the Private Securitie s Litigation Reform Act of 1995. Words such as “plans,” “expe cts,” “believes,” “anticipa tes,” “d
Slide 3: ACM Research at a Glance
ACM Research at a Glance Cleaning • Multi-product supplier of semiconductor Flagship (SAPS, TEBO, Tahoe, Bevel Etch, SPM) Semi-critical equipment to leading global semiconductor manufacturers • Differentiated technology improves customer ECP, Furnace & Other production processes with better yields a
Slide 4: Financial Highlights
Financial Highlights Total Revenue Product Mix Cleaning ECP, Furnace & Other $901 Advanced P ackaging & Other $782 +42% 8% $558 7% 22% 19% $389 9% $260 19% 73% 69% $157 72% 74% FY23 FY24 FY25 FY20 FY21 FY22 FY23 FY24 FY25 $558M $782M $901M 1. Cleaning: Single wafer cleaning, Tahoe and semi-critical
Slide 5: History of Innovation and Customer Design Wins
History of Innovation and Customer Design Wins Dr. Wang Launches SFP, 1st 300mm Adv. High-Temp ACM Shanghai establishes furnace and Launches Ultra Pmax TM Major 1st SAPS tool SWC tool Packaging Opens 2nd SPM tool 2nd capital ACM Research semi-critical PECVD and Ultra Track performance qualified by o
Slide 6: Global Semiconductor Capital Equipment Supplier
Global Semiconductor Capital Equipment Supplier ACM Res earch HQ Nasdaq: ACMR ACM Shanghai R&D and Manufacturing Center Europe Sales & Services Shanghai R&D Center (Zh angjiang) Hanguk ACM, ACM Korea Shanghai Asia-Pacific Manufacturing Center >200,000 ft 2 (Chuansha) Research Institute & Manufacturi
Slide 7: Customer Concentration and Revenue Mix by Customer Type
Customer Concentration (≥10%) and Revenue Mix by Customer Type 10% Customer Mix – Annual Ranking Revenue Mix by Customer Type Largest 2nd 3rd 4th 2025 16.9% 13.5% 11.6% 10.2% 52.2% Customer Type 2025 2024 2023 Memory 27.3% 21.8% 24.1% 2024 14.7% 13.6% 12.0% 11.9% 52.2% Foundry/Logic/Other 58.9% 71.1
Slide 8: Expanding Serviceable Available Market (SAM)
Expanding Serviceable Available Market (“SAM”)1 PECVD | $6.2B Introduced late 2022 Estimated 2025 SAM of Track | $3.5B $22 billion addressed Introduced late 2022 by ACM Research’s current product 2020: Ult ra Fn Furnace / Anneal, 2022: Thermal ALD, 2024: PEALD Furnace | $1.7B portfolio 2019: ECP ap
Slide 9: Long-Term Target for $4B+ in Revenue
Long-Term Target for $4B+ in Revenue Long-Term Target Composition ACM Research Advanced Packaging & Other ACM Research ECP, Furnace & Other > $4B* Mainland China SAM1 China SAM 2 Share3 Revenue Cleaning $7.4B $2.6B 60% $1.54B Cleaning ECP $1.8B $0.6B 60% $368M Furnace $1.7B $0.6B 15% $88M PECVD $6.2
Slide 10: Growth Strategy
Growth Strategy Growth at Existing International Expansion New Capacity New Products Customers • Continue winning share at existing • Expanding sales & services teams in • Shanghai Lingang production and • Broad product portfolio covering customers U.S., Europe, Korea and SE Asia R& D center is up a
Slide 11: Q2 2026 Summary
Q2 2026 Summary Q2 2026 Financial Results • $292.9 million revenue (up 36.0% y/y); total shipments of $281.5 million (up 36.4% y/y) • 46.0% GAAP gross margin (versus 48.5% in Q2 2025) • 46.0% non-GAAP gross margin (versus 48.7% in Q2 2025) • $49.7 million GAAP operating income (up 56.9% y/y; 17.0% o
Slide 12: Q2 2026 Financial Results
Q2 2026 Financial Results Revenue Non-GAAP Gross Profit +36.0% 28.6% $292.9M $134.8M $215.4M $104.8M 46.0% 48.7% Q2‘25 Q2’26 Q2’25 Q2’26 EPS Balance Sheet Finished goods inventory GAAP Non-GAAP Ending cash & cash equivalents 1 $1.23 $0.61 $1,252M $1,356M $0.55 $1,098M $1,133M $0.44 $484M $302M $291M
Slide 13: Q2 and YTD Revenue Detail
Q2 and YTD Revenue Detail Revenue by Product: Q2’25 vs Q2’26 Revenue by Product: 1H’25 vs 1H’26 36.0% $292.9M 35.2% $524.2M 11% Advanced Packaging & Other 11% Advanced Packaging & Other $215.4M $387.7M 6% 7% 41% ECP, Furnace & Other 44% ECP, Furnace & Other 22% 20% 72% 73% 49% Cleaning 45% Cleaning
Slide 14: Wafer Cleaning
Wafer Cleaning Flagship Cleaning Tools SAPS TEBO Ultra – C Tahoe Bevel Etch Single Wafer High Temp SPM Bevel Etching process for 3D NAND , DRAM Single High Temp SPM Cleaning for metal Megasonic Cl eaning for Bubble Oscillation Cleaning for Patterned Hybrid W afer Cleaning W ith Significant and adv a
Slide 15: Vertical Furnace
Vertical Furnace Ox Ion Metal Mask Photo Exposure Develop Etch CVD ALD /Anneal Implantation Wire Furnace Tube Temperature Existing ACM In Film Type Process Classification Range Research Product Development Oxidation Wet oxygen/dry oxygen/nitrogen 700~1200℃ ★ Annealing annealing Normal Pressure Chemi
Slide 16: PECVD
PECVD Model Ultra Pmax PECVD Dielectric Films: SiO₂ / Si₃N₄ / SiON / TEOS Film Category / Type Advanced Films: SiCN / APF Applicable to 300mm wafer processing • Patented chamber design, gas distribution unit & chuck design • Multi-frequency RF architecture • Independent HF & LF control • Liquid prec
Slide 17: Track
Track Offline Chamber Model Model Technical Features Bake Range Development Phase /Inline Temperature • Support 300mm wafers • 4 × 12-inch load p orts • 12 coating chambers + 12 developing chambers (12C12D) ArF Model • Throughput > 300 W PH • 13 robots integrated Process- Multi-zone precision • Up t
Slide 18: Electroplating
Electroplating Ultra ECP ap Model Ultra ECP map Ultra ECP 3D Ultra ECP ap Ultra ECP GIII Ultra ECP ap-p Ultra ECDP (Cu-Ni-SnAg-Au) Au bump / thin film / Dual-damascene Pillar bump, Solder RF product Pillar bump, RDL 3D/2.5D high aspect High-density Fan Out deep hole Application plating (90nm- ratio
Slide 19: Advanced Packaging
Advanced Packaging Comprehensive solution for wafer and panel-level advanced packaging wet process Scrubber Coater Developer ECP SFP • Make use of ACM Research’s Cleaning Tape Frame Clean technology advantages to expand application in Asia, especially advanced packaging manufacturers in China • Dedi
Slide 20: Panel-level Packaging
Panel-level Packaging A comprehensive suite of wet processing and plating tools engineered for Panel-Level Packaging (PLP), supporting next-gen chiplet integration and advanced packaging nodes. Ultra C vac-p Flux Cleaning Ultra C bev-p Panel Bevel Etch & Clean Ultra ECP ap-p Horizontal Panel Plating
Slide 21: Neptune Series
— Neptune Series Stress-free polishing Tools) | Panel-level advanced packaging Tools) Saturn Set ies _ {PECVD Tools) iss | é | | * Mercury Series ATrack “I dvanced packaging Tools) ACM Earth Series [ (Cl¢aning Tools) / / /
Slide 22: Q2 2026 GAAP to Non-GAAP Reconciliation
Q2 2026 GAAP to Non-GAAP Reconciliation 22
Slide 23: Thank You
THANK YOU！ ACM Research Technology Product Customer Differentiation Platformization Globalization