Acm Research, Inc. · NASDAQ:ACMR
Acm Research — Investor Presentation (May 2026)
23 slides from Acm Research's investor presentation, May 2026
Slide 1: ACM Research, Inc. May 2026 Investor Presentation
Technology Product Customer Differentiation Platformization Globalization ACM Research, Inc. May 2026 Investor Presentation
Slide 2: Disclosures
DISCLOSURES Forward-looking Statements. Certain state ments containe d in this prese ntation are not historical facts and may be forward -looking state ments within the meaning of the Private Securitie s Litigation Reform Act of 1995. Words such as “plans,” “expe cts,” “believes,” “anticipa tes,” “d
Slide 3: ACM Research at a Glance
ACM Research at a Glance Cleaning • Multi-product supplier of semiconductor Flagship (SAPS, TEBO, Tahoe, Bevel Etch, SPM) Semi-critical equipment to leading global semiconductor manufacturers • Differentiated technology improves customer ECP, Furnace & Other production processes with better yields a
Slide 4: Financial Highlights
Financial Highlights Total Revenue Product Mix Cleaning ECP, Furnace & Other $901 Advanced P ackaging & Other $782 +42% 8% $558 7% 22% 19% $389 9% $260 19% 73% 69% $157 72% 74% FY23 FY24 FY25 FY20 FY21 FY22 FY23 FY24 FY25 $558M $782M $901M 1. Cleaning: Single wafer cleaning, Tahoe and semi-critical
Slide 5: History of Innovation and Customer Design Wins
History of Innovation and Customer Design Wins Dr. Wang Launches SFP, 1st 300mm Adv. 1st ECDP tool ACM Shanghai establishes furnace and Launches Ultra Pmax TM Major 1st SAPS tool SWC tool Packaging Opens 2nd for wide- 2nd capital ACM Research semi-critical PECVD and Ultra Track performance qualified
Slide 6: Global Semiconductor Capital Equipment Supplier
Global Semiconductor Capital Equipment Supplier ACM Res earch HQ Nasdaq: ACMR ACM Shanghai R&D and Manufacturing Center Europe Sales & Services Shanghai R&D Center (Zh angjiang) Hanguk ACM, ACM Korea Shanghai Asia-Pacific Manufacturing Center >200,000 ft 2 (Chuansha) Research Institute & Manufacturi
Slide 7: Customer Concentration and Revenue Mix by Customer Type
Customer Concentration (≥10%) and Revenue Mix by Customer Type 10% Customer Mix – Annual Ranking Revenue Mix by Customer Type Largest 2nd 3rd 4th 2025 16.9% 13.5% 11.6% 10.2% 52.2% Customer Type 2025 2024 2023 Memory 27.3% 21.8% 24.1% 2024 14.7% 13.6% 12.0% 11.9% 52.2% Foundry/Logic/Other 58.9% 71.1
Slide 8: Expanding Serviceable Available Market (SAM)
Expanding Serviceable Available Market (“SAM”)1 PECVD | $5.3B Introduced late 2022 Track | $3.0B Introduced late 2022 Estimated 2025 SAM of $21 billion addressed 2020: Furnace, LPCVD, Furnace | $2.6B by ACM Research’s Vacuum Anneal , High- Temperature Oxidation, 2022: Furnace ALD current product The
Slide 9: Long-Term Target for $4B+ in Revenue
Long-Term Target for $4B+ in Revenue Long-Term Target Composition Advanced Packaging & Other > $4B* ACM Research ECP, Furnace & Other Mainland China ACM Research SAM1 China SAM2 Share3 Revenue Cleaning Cleaning $7.3B $2.4B 60% $1.43B ECP $1.5 $0.5 60% $293M Furnace $2.6 $0.8 15% $127 PECVD $5.3 $1.7
Slide 10: Growth Strategy
Growth Strategy Growth at Existing International Expansion New Capacity New Products Customers • Continue winning share at existing • Shanghai Lingang production and • Broad product portfolio covering • Expanding sales & services teams in R& D center is up and running customers ~95% of cleaning proc
Slide 11: Q1 2026 Summary
Q1 2026 Summary Q1 2026 Financial Results • $231.3 million revenue (up 34.2% y/y); total shipments of $240.7 million (up 53.6% y/y) • 46.4% GAAP gross margin (versus 47.9% in Q1 2025) • 46.5% non-GAAP gross margin (versus 48.2% in Q1 2025) • $36.2 million GAAP operating income (up 40.3% y/y; 15.6% o
Slide 12: Q1 2026 Financial Results
Q1 2026 Financial Results Revenue Non-GAAP Gross Profit +34.2% 29.5% $231.3M $107.6M $172.3M $83.1M 48.2% 46.5% Q1‘25 Q1’26 Q1’25 Q1’26 EPS Balance Sheet Finished goods inventory GAAP Non-GAAP Ending cash & cash equivalents 1 $0.30 $0.46 $1,252M $1,098M $1,133M $0.24 $0.34 $498M $484M $299M $302M $2
Slide 13: Q1 2026 Revenue Detail
Q1 2026 Revenue Detail Revenue by Product: Q1’26 vs. Q1’25 Cleaning 34.2% $231.3M • $122.5M revenue (down 5.5%) 11% Advanced Packaging & Other • Revenue mix 53% vs. 75% $172.3M 9% 36% ECP, Furnace & Other ECP, Furnace & Other 16% • $84.2M revenue (up 204.9%) • Revenue mix 36% vs. 16% 75% 53% Cleanin
Slide 14: Wafer Cleaning
Wafer Cleaning Flagship Cleaning Tools SAPS TEBO Ultra – C Tahoe Bevel Etch Single Wafer High Temp SPM Bevel Etching process for 3D NAND , DRAM Single High Temp SPM Cleaning for metal Megasonic Cl eaning for Bubble Oscillation Cleaning for Patterned Hybrid W afer Cleaning W ith Significant and adv a
Slide 15: Vertical Furnace
Vertical Furnace Ox Ion Metal Mask Photo Exposure Develop Etch CVD ALD /Anneal Implantation Wire Furnace Tube Temperature Existing ACM In Film Type Process Classification Range Research Product Development Oxidation Wet oxygen/dry oxygen/nitrogen 700~1200℃ ★ Annealing annealing Normal Pressure Chemi
Slide 16: PECVD
PECVD Model Ultra Pmax PECVD Dielectric Films: SiO₂ / Si₃N₄ / SiON / TEOS Film Category / Type Advanced Films: SiCN / APF Applicable to 300mm wafer processing • Patented chamber design, gas distribution unit & chuck design • Multi-frequency RF architecture • Independent HF & LF control • Liquid prec
Slide 17: Track
Track Offline Chamber Model Model Technical Features Bake Range Development Phase /Inline Temperature • Support 300mm wafers • 4 × 12-inch load p orts • 12 coating chambers + 12 developing chambers (12C12D) ArF Model • Throughput > 300 W PH • 13 robots integrated Process- Multi-zone precision • Up t
Slide 18: Electroplating
Electroplating Ultra ECP ap Model Ultra ECP map Ultra ECP 3D Ultra ECP ap Ultra ECP GIII Ultra ECP ap-p Ultra ECDP (Cu-Ni-SnAg-Au) Au bump / thin film / Dual-damascene Pillar bump, Solder RF product Pillar bump, RDL 3D/2.5D high aspect High-density Fan Out deep hole Application plating (90nm- ratio
Slide 19: Advanced Packaging
Advanced Packaging Comprehensive solution for wafer and panel-level advanced packaging wet process Scrubber Coater Developer ECP SFP • Make use of ACM Research’s Cleaning Tape Frame Clean technology advantages to expand application in Asia, especially advanced packaging manufacturers in China • Dedi
Slide 20: Panel-level Packaging
Panel-level Packaging A comprehensive suite of wet processing and plating tools engineered for Panel-Level Packaging (PLP), supporting next-gen chiplet integration and advanced packaging nodes. Ultra C vac-p Flux Cleaning Ultra C bev-p Panel Bevel Etch & Clean Ultra ECP ap-p Horizontal Panel Plating
Slide 21: Neptune Series
— Neptune Series Stress-free polishing Tools) | Panel-level advanced packaging Tools) Saturn Set ies _ {PECVD Tools) iss | é | | * Mercury Series ATrack “I dvanced packaging Tools) ACM Earth Series [ (Cl¢aning Tools) / / /
Slide 22: Q1 2026 GAAP to Non-GAAP Reconciliation
Q1 2026 GAAP to Non-GAAP Reconciliation 22
Slide 23: Thank You
THANK YOU！ ACM Research Technology Product Customer Differentiation Platformization Globalization