Slide 1: Gold Circuit Electronics 2024 Investor Conference
Gold Circuit Electronics 2024 Investor Conference Date: Aug. 16 , 2024 1
Slide 2: Disclaimer
Disclaimer The presentation contains projections & estimates of financial information as well as market and product developments for future periods. These projections & estimates are based on information currently available which we believe to be reliable, but they involve risks & uncertainties. Our
Slide 3: General Information
General Information Company Name: Gold Circuit Electronics Founded in 1981 Stock Listed Mar. 9th, 1998 Capital NTD 4,918 Million Product Tech. High Layer Count, HDI, Heavy Cu & Backplane Manufacturing Taiwan 、Suzhou 、Chang Shu Sites
Slide 4: Global Support & Service
Global Support & Service Europe Europe Asia America Korea East USA ChangShu I Japan West USA South USA ChangShu II ShenZhen Suzhou Taiwan Thailand Africa Malaysia Oceania Service Office Plant
Slide 5: Sales Revenue History
Sales Revenue History REVENUE TREND REVENUE REVENUE TRENDTREND NT$ NT$ Hundred HundredMillion Million REVENUE REVENUE TREND TREND NT$ Hundred NT$ Hundred Million Million NT$ Hundred 350 328 Million 350 300 350 301 300 266 328 328 266 300 300 250 250 234 234 266 266 201 191 192 192 206 220 250 250 20
Slide 6: Consolidated Financial Statement
Y2024 H1 Unit: NT$ hundred million Consolidated Financial Statement Compared with the 2024 H1 2023 H1 same period last year Operating Revenue 186.39 132.6 41% Operating costs 131.76 103.24 Gross Profit 54.63 29.36 86% Gross Profit Margin 29.31% 22.14% 32.37% Operating Expenses 15.19 11.87 Net other
Slide 7: Y2024/Y2023 (Quarterly) Consolidated Financial Statement
Y2024/Y2023(Quarterly) Consolidated Financial Statement Unit: NT$ hundred millions Q1 Q2 Q3 Q4 Y2023 Operating Revenue 63.3 69.3 82.5 85.3 Gross Profit Margin 20.4% 23.8% 29.3% 27.80% Income before Tax 6.5 12.1 17.1 16.45 Y2024 Operating Revenue 90.7 95.7 Gross Profit Margin 26.9% 31.6% Income befor
Slide 8: Capability
Capability Full Range of Technology Availability Layer Count 56L IC Testing Adv. Server & Networking 30L Server Telecom Telecom Server Power NB Smart Home 10L Tablet/ NB Telecom LEO Automotive Smart Phone Automotive Automotive MLB HDI Heavy Cu Technology
Slide 9: Product Application (GCE)
Y2018 Y2019 Y2020 Y2021 Y2022 Y2023 Y2024 H1 = Others T% Th 8% 9% 7% 6% T% NB 22% 22% 20% 22% 13% 14% 11% = Networking 29% 22% 21% 19% 20% 17% 13% Server 42% 49% 51% 50% 60% 64% 69%
Slide 10: Q&A
Q&A 10
Slide 11: Thank you for your attention!
Thank you for your attention ! 11