Gold Circuit Electronics Ltd · TWSE:2368
Gold Circuit Electronics — 2026 Investor Conference
11 slides from Gold Circuit Electronics's conference presentation, Mar 18, 2026
Slide 1: Gold Circuit Electronics 2026 Investor Conference
Gold Circuit Electronics 2026 Investor Conference Date: Mar. 18, 2026 1
Slide 2: Disclaimer
Disclaimer The presentation contains projections & estimates of financial information as well as market and product developments for future periods. These projections & estimates are based on information currently available which we believe to be reliable, but they involve risks & uncertainties. Our
Slide 3: General Information
General Information Company Name: Gold Circuit Electronics Founded in 1981 Stock Listed Mar. 9th, 1998 Capital NTD 5,105 Million Product Tech. High Layer Count, HDI, Heavy Cu & Backplane Manufacturing Taiwan 、Suzhou 、Chang Shu 、Thailand Sites 3
Slide 4: Global Support & Service
Global Support & Service Europe Europe Asia America Korea East USA ChangShu I Japan West USA South USA ChangShu II ShenZhen Suzhou Taiwan Thailand Africa Malaysia Oceania Service Office Plant 4
Slide 5: Sales Revenue History
Sales Revenue History NT$ Hundred Million REVENUE TREND 700 600 600 500 389 400 328 301 300 266 234 192 192 206 190 200 120 100 0 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 FEB 5
Slide 6: Y2025 Consolidated Financial Statement
Y2025 Consolidated Financial Statement Unit: NT$ hundred million Compared with the same 2025 2024 period last year Operating Revenue 600.03 389.52 54% Operating costs 403.21 275.56 Gross Profit 196.83 113.96 73% Gross Profit Margin 32.8% 29.3% 3.5% Operating Expenses 56.53 33.15 Net other income (ex
Slide 7: Y2025/Y2024 (Quarterly) Consolidated Financial Statement
Y2025/Y2024(Quarterly) Consolidated Financial Statement Unit: NT$ hundred millions Q1 Q2 Q3 Q4 Y2024 Operating Revenue 90.7 95.7 104.6 98.5 Gross Profit Margin 26.9% 31.6% 32.3% 25.9% Income before Tax 18.4 23 23.5 20 Y2025 Operating Revenue 120.6 138.5 176.8 164.1 Gross Profit Margin 31.3% 29.6% 35
Slide 8: Capability
Capability Full Range of Technology Availability Layer Count 56L IC Testing Adv. Server & Networking 30L Server Telecom Telecom Server Power NB Smart Home 10L Tablet/ NB Telecom LEO Smart Phone Automotive Automotive Automotive MLB HDI Heavy Cu Technology 8
Slide 9: Product Application (GCE)
Y2019 Y2020 Y2021 Y2022 Y2023 Y2024 Y2025 = Others | 7% 8% 9% 7% 5% 7% 3% NB 22% 20% 22% 13% 14% 10% 8% = Networking 22% 21% 19% 20% 17% 15% 15% Server 49% 51% 50% 60% 64% 68% 74%
Slide 10: Q&A
Q&A 10
Slide 11: Thank you for your attention !
Thank you for your attention ! 11