Slide 1: Company Profile
Company Profile World-class leading edge with MOCVD 1
Slide 2: Core Technology
Core Technology MOCVD（有機金屬氣相沉積法） - Metal Organic Chemical Vapor Deposition 2
Slide 3: Core Technology
Core Technology Production MOCVD Metal Organic Chemical Vapor Deposition Reactor Through the organic metal chemical vapor deposition method, the Way to semiconductor film is grown on the substrate, and the epitaxial Produce layer is accurately controlled through the real-time monitoring of the machi
Slide 4: Semiconductor (by Material)
Semiconductor（by Material） Element Si ,Ge Semiconductor IV-IV SiC, SiGe III-V GaAs, InP, GaN, GaP, GaSb... Compound II-VI ZnSe, ZnS, CdS, etc. Period Column II III IV V VI Be 鈹 B硼 C碳 N氮 O氧 2 Beryllium Boron Carbon Nitrogen Oxygen 二元化合物 Binary : GaAs, InP, GaP,GaN, etc. Mg 鎂 Al 鋁 Si 矽 P磷 S硫 3 Magnesi
Slide 5: Chemical Reaction During Epitaxy
Chemical Reaction During Epitaxy 化學反應式： 主要原物料: MO Source + Hydride + Carrier Gas：H2 AsH3 : Arsine TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al PH3 : Phosphine TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH4 : Silane TMIn : Tri-Methyl-Indium ( CH3 )3In Si2H6 : Disiline DETe : Di-ethyl-Tellurium ( C2H5 )2Te H2Se
Slide 6: Advantages of Compound Semiconductor
Advantages of Compoundsemiconductor 1. High Electron Mobility高電子移動速率(5.7x higher than CM0S) 2. High Frequency Response高頻率響應 3. Wide Band Width 寬幅之頻寬 4. High Linearity高線性度 5. High Power高功率 6. Alternative Choice of Material材料選擇多元性 7. 抗輻射 適用於微電子產品－HBT、pHEMT、BiHEMT、GaN on XX 光電子產品－ PIN（PD、APD）、VCSEL、LD、
Slide 7: GaAs in Wireless Communication Supply Chain
GaAs in Wireless Communication Supply Chain IDM：Qorvo, Skyworks Sumitomo, Freiberg, AXT Fabless ：Avago, 2~6 ”GaAs Substrate Qualcomm, Richwave, GaAs Epi- Wafer Microelectronics 磊晶片 IC Process Wireless Communication Substrate VPEC is a Pure Foundry： MOCVD Reactor Epi Provider WIN, AWSC IC Package & T
Slide 8: 2021-2024 Q3 Financial Result
2021-2024 Q3 Financial Result 8
Slide 9: 2024 Outlook
2024 Outlook 的内容入您的内容输入您的内 5G Mobile 01 容输入您的内容输入您的内容 Penetration 内容输入您的内容. WiFi 7 02 Wireless RF 03 V2X 04 IoT Smart Link (4G PA) 9
Slide 10: 2024 Outlook
2024 Outlook Data Center PD for 800G 01 High Speed VCSEL for 400G Connectivity 02 3D-sening VCSEL / PD Opto electronics AR/VR VCSEL 03 VCSEL for 800G LEO Solar Cell 04 Future Driving Engines P-sensor 、 3D Sensing & ToF Car LiDAR (LD/PD) AI glass Silicon 10 10 Photonics