Chipbond Technology — Online Investment Forum by Credit Suisse Virtual Meetings 2021

14 slides from Chipbond Technology's conference presentation, Sep 6, 2021

Slide 1: Chipbond
CHIPIBOND 20212
Slide 2: Packaging Industry
PACKAGING INDUSTRY Most I ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bump Au CPU and Graphic Gold Bum Intel and TSMC LCD Driver IC, RFI Chipbond, Nepe C p s s D
Slide 3: Gold Bumping
GOLD BUMPING Au Application Display Driver I RF Front En Smart Car Finger Print Sensor d s d C
Slide 4: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 5: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrat Has to be gold for driver IC e
Slide 6: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 7: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 8: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 9: Product coverage by end market: TV, Phone, NB/PC, RF
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v Film v
Slide 10: 2018 2019 2020 2021
2018 2019 2020 2021
Slide 11: Applications
APPLICATIONS Non Driver
Slide 12: 2021F outlook by region
2019 2020 2021F 220 220 220 US SEA, EU 4K → 8K 8K
Slide 13: 2021F TDDI
2019 2020 2021F 160 220 240 TDDI TDDI
Slide 14: 2021F OLED TDDI
2019 2020 2021F 1,350 1,270 1,385 OLED 470 450 500 TDDI 650 750 850 DDI 230 70 35