Qnity Electronics, Inc. · NYSE:Q
Qnity Electronics — Investor Presentation (November 2025)
30 slides from Qnity Electronics's investor presentation, November 2025
Slide 1: To Make Tomorrow's Technologies Possible: Investor Meetings
TM To Make Tomorrow’s Technologies Possible Investor Meetings November 2025
Slide 2: Forward looking statements & non-GAAP financial measures
Forward looking statements & non-GAAP financial measures Forward Looking Statements Non-GAAP Financial Measures On November 1, 2025, DuPont de Nemours, Inc. ("DuPont") completed the separation of its electronics business (the This presentation includes information that does not conform to accounting
Slide 3: Executive Leaders Overview and Agenda
Executive Leaders Overview Agenda Jon Kemp Chief Executive Officer Qnity At-A-Glance 15+ years Electronics Experience Semiconductor Secular Trends Industry Accelerating Growth Drivers • Previously President of Electronics & Industrials division • Held variety of roles including M&A, Strategy, Busine
Slide 4: Qnity At-A-Glance: A premier global technology solutions provider for the semiconductor value chain
Qnity At-A-Glance: A premier global technology solutions provider for the semiconductor value chain Making Tomorrow’s Technologies Possible End-Markets Regions • Innovative portfolio built on decades of leading-edge Net Sales 2024 Net Sales 2024 products and solutions Communication • Mission-critica
Slide 5: Powering the next leap in electronics
Powering the next leap in electronics High-Performance Computing Advanced Connectivity Demand Drivers AI & Cloud Data Device Edge Autonomous Driving Machine Learning Computing Proliferation Interconnectivity Computing Systems Technology More than Moore’s Law 3D Stacking Heterogeneous Integration Min
Slide 6: New architectures create significant opportunities for content gains and TAM expansion
New architectures create significant opportunities for content gains and TAM expansion Logic and Memory Volume (MSI) Number of CMP Layers, by Technology Node and Architecture (#) ~17k Legacy nodes Advanced nodes ~13k ~15 ~30 ~3% (FinFETs 14nm) (GAA + BSPD) CAGR ~15 ~30 (2D DRAM, 1xnm) (3D DRAM) ~7%
Slide 7: Large and growing total addressable market
Large and growing total addressable market % of Market CAGR Current 2024 Net Sales (2024 – 2029) TAM1, 2 ~50% Chip Fabrication MSD $15B ~10% Advanced Packaging HSD $4B ~20% PCB Building LSD – MSD $6B ~20% Assembly & Display MSD $8B ~4-5% 3 >$30B Sources: Prismark and Yole NOTE: LSD = Low single digi
Slide 8: Deep customer partnerships and critical integrated solutions across the value chain
Deep customer partnerships and critical integrated solutions across the value chain ~50% ~10% ~20% ~20% Chip Advanced PCB Assembly & Fabrication1 Packaging Building Display Design & Encase and Design and Embed Manufacture Connect the Produce Printed Circuit Boards Semiconductor Chip to Circuitry Cir
Slide 9: Leading positions across the supply chain
Leading positions across the supply chain Market Position U.S.-Based Peers Diversified or Non-U.S. Based Materials Peers Peer 1 Peer 2 Peer 3 Peer4 Peer 5 Peer 6 Peer 7 Lithographic Materials Advanced Cleans & Slurries1 Semiconductor Technologies CMP Pads Technologies Advanced Display Materials Semi
Slide 10: Strategic operating network with strong local-for-local presence
Strategic operating network with strong local-for-local presence Japan Taiwan APAC Americas EMEA 21 manufacturing sites 17 manufacturing sites 1 manufacturing site 10 R&D facilities 6 R&D facilities 1 R&D facility 10
Slide 11: Bringing solutions across the circuit board
Bringing solutions across the circuit board Value Chain Our Product Solutions CMP Pads CMP Slurries Chip Fabrication Advanced Cleans Lithographic Solutions Metallization Substrates Advanced Packaging Dielectrics Thermal Interface Materials Circuit Metallization PCB Photoresists PCB Building Laminate
Slide 12: Core semiconductor products positioned for growth
Core semiconductor products positioned for growth CMP CMP Cleans & Lithographic Specialty Seals Display Pads Slurries Materials (Kalrez®) Materials Strategic Role Enables precision wafer Critical to defect control Supports patterning for Specialized seals for Specialty play in polishing for advanced
Slide 13: Broad solutions and deep expertise as trusted OEM design partner
Broad solutions and deep expertise as trusted OEM design partner Advanced Circuit Thermal Management Advanced Flex and Packaging and EMI (Laird ) Technologies Strategic Role Leading solutions to support advanced Critical solutions for thermal Leading solutions for smart devices and packaging and min
Slide 14: Outperformance to the underlying market
Outperformance to the underlying market ~6-7 % Targeted Annualized Organic Net Sales CAGR through 2028 OUTPERFORM MARKET TAM Expansion Content Customer ~2 % Growth Gain + ~4-5% End Market Digitization / New Underlying Demand Connectivity Technologies Market Tailwinds NOTE: All growth rates projected
Slide 15: 3-Year financial objectives through 2028
3-Year financial objectives through 2028 ~6-7% ~2% Above- Market Strong ~7-9% Organic Net Sales1 Growth Profitability Adj. EBITDA CAGR Growth2 CAGR Organic Growth Disciplined Investment Opportunistic M&A Capital Solid Free Cash <3.0x Flow Generation Capital Returns Allocation Target Net Debt Leverag
Slide 16: A broad pure-play technology leader for the fast-growing semiconductor market
A broad pure-play technology leader for the fast-growing semiconductor market End-to-end portfolio breadth for solutions to the semiconductor value chain; >65% of portfolio tied directly to semiconductors1 Leading the transition to advanced nodes with ~90% unit-based consumables Decades-long partner
Slide 17: Appendix
APPENDIX 2 Qnity.
Slide 18: Integrated solutions with leading portfolio breadth
Integrated solutions with leading portfolio breadth Assembly & Chip Fabrication Advanced Packaging PCB Building Display Light Thermal Assembly EMI Leading Edge Connectors Materials Shielding Reticle Mask Lithography Materials Passive Component Focusing Optics (inductors) Photoresist Coated Wafer The
Slide 19: Delivering customized solutions that improve customer value
Delivering customized solutions that improve customer value As customers scale Customers depend on new technologies… partners who can… …small increases in yield Co-innovate with R&D and drive big increases in value engineers through development and scale-up process Execute with exceptionally high co
Slide 20: Top innovation programs to drive future growth
Top innovation programs to drive future growth Chip Fabrication Advanced Packaging PCB Building Assembly & Display Yield-Enhancing Pads Adv. Node Photoresists High-Res Metallization, Low- Fineline Metallization Thermal/EMI Management and Sublayers Loss Dielectrics for Wafer- Chemistries Solutions Le
Slide 21: Composition of Semiconductor Technologies portfolio as compared with industry
Composition of Semiconductor Technologies portfolio as compared with industry Global Market Composition4 2019 2024 2024 Memory1 Memory1 Memory 29% 20% 28% Logic1 Logic1 Logic 71% 80% 72% Advanced1,2 Advanced2 Advanced1,2 Legacy1,3 31% 35% 65% 31% Legacy1,3 Legacy3 69% 69% 2030+ Anticipated Trend ~45
Slide 22: Technology leadership in fast growing advanced packaging
Technology leadership in fast growing advanced packaging Partnering with Leading-Edge Customers Advanced Packaging at Intersection of Global Advanced Packaging Semiconductor and Interconnects Technology Background End-Market, USD1 Roadmap Generative AI requires high bandwidth memory (HBM) ~11% ~$75B
Slide 23: Innovation breakthroughs in thermal management for AI-optimized servers
Innovation breakthroughs in thermal management for AI- Customer Case Study optimized servers Global Server End-Market1 Background (shipment units) OEMs require solutions to address excessive Innovation Leader in heat generation in Deep Application data centers Thermal Management Engineering Expertis
Slide 24: Strategic capital investments aligned with customer roadmaps
Strategic capital investments aligned with customer roadmaps Future R&D Investments Future Capex Investments ~7% 60% Top 30% Supporting 10% Break-through ~6% 70% Growth 30% Maintenance Programs Existing Technologies of net sales Customers of net sales Full support for top programs in advanced nodes,
Slide 25: M&A to be part of future to accelerate long-term shareholder returns
M&A to be part of future to accelerate long-term shareholder returns Potential Focus Areas Strategic Criteria Advanced Packaging and Expands portfolio in fast-growing Thermal Management adjacencies Leading technologies in next-generation electronics Accelerates technology leadership with Complementa
Slide 26: Balance sheet strength underpins financial flexibility for future opportunistic growth
Balance sheet strength underpins financial flexibility for future opportunistic growth Senior Secured Term Loan $4.1B B Facility $2.35B Gross Debt (7 year, ~6%1,2) $4.1B Gross Debt ~$3.5B Net Debt Senior Senior Unsecured Note Secured Note $750M $1B (8 year, 6.250%) (7 year, 5.750%) ~2.5x 2025E Net L
Slide 27: Pro forma 2025 full year estimates
Pro forma 2025 full year estimates Prior Updated 2024A Drivers 2025E 2025E Strength across advanced nodes, advanced packaging, Net Sales1 $4.3B ~$4.6B ~$4.7B and thermal management, including growth in AI driven applications. Adjusted Pro Forma ~$1.25B ~$1.4B ~$1.4B Operating EBITDA2 Higher net sale
Slide 28: Reconciliations
Reconciliations 2 Qnity.
Slide 29: Full Year Adjusted Operating EBITDA – Carve Out & Pro Forma Operating EBITDA
Note: 2025E represent estimated results as of November 6, 2025. Full Year Adjusted Operating EBITDA – Carve Out & Pro Forma Operating EBITDA ($M) 1) Net Sales has been derived from our historical combined financial statements, which were prepared on a carve-out Carve-Out 2024 & Estimated 2025 Result
Slide 30: Nahla A. Azmy, VP, Investor Relations
Nahla A. Azmy VP, Investor Relations Email: Nahla.azmy@qnityelectronics.com Cell: +1 (302) 518-1001
Qnity Electronics — Investor Presentation (November 2025) on 6ix