Qnity Electronics, Inc. · NYSE:Q
Qnity Electronics — Investor Day (September 2025)
76 slides from Qnity Electronics's investor day presentation, Sep 18, 2025
Slide 1: Investor Day 2025
Investor Day 2025 To Make Tomorrow’s Technologies Possible TM
Slide 2: Welcome and Opening Remarks
Welcome and Opening Remarks Nahla Azmy VP, Investor Relations TM
Slide 3: Forward Looking Statements & Non-GAAP Financial Measures
Forward Looking Statements & Non-GAAP Financial Measures Forward Looking Statements Non-GAAP Financial Measures On January 15, 2025, DuPont de Nemours, Inc. ("DuPont") announced it is targeting November 1, 2025, to complete the intended This presentation includes information that does not conform to
Slide 4: Today's Speakers & Agenda
Today’s Speakers & Agenda Welcome and Opening Remarks 2:00 PM Nahla Azmy | Vice President, Investor Relations Delivering Critical Solutions to Jon Kemp Semiconductor Value Chain Chief Executive Officer Jon Kemp | Chief Executive Officer 15+ years Accelerating Growth through Innovation Electronics Ex
Slide 5: Delivering Critical Solutions to Semiconductor Value Chain
Delivering Critical Solutions to Semiconductor Value Chain Jon Kemp Chief Executive Officer TM
Slide 6: Qnity: A Broad Pure-Play Technology Leader for the Fast-Growing Semiconductor Market
Qnity: A Broad Pure-Play Technology Leader for the Fast-Growing Semiconductor Market End-to-end portfolio breadth for solutions to the semiconductor value chain; >65% of portfolio tied directly to semiconductors1 Leading the transition to advanced nodes with 90% unit-based consumables Decades-long p
Slide 7: Qnity Investment Highlights
Qnity Investment Highlights Who What Where Why Target We Are We Do We’re Going We Win Outcomes Established, …providing …that enables …built on deep and …positioned to deliver pure-play unparalleled sustainable lasting customer on strong total technology leader… portfolio breadth above-market relatio
Slide 8: Our Purpose and Strategy
Our Purpose and Strategy Making Tomorrow’s Technologies Possible To be a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity • Innovative portfolio built on decades of leading-edge products and solutions • M
Slide 9: Qnity: A Premier Global Solutions Provider for the Semiconductor Value Chain
Qnity: A Premier Global Solutions Provider for the Semiconductor Value Chain Financials 2025E1 End-Markets Regions Net Sales 2024 Net Sales 2024 ~30% Communication ~$4.6B ~10% Infrastructure ~13% Americas Net Sales Adjusted Pro Forma ~15% Automotive ~8% EMEA Operating EBITDA Margin AI / HPC / ~15% D
Slide 10: Qnity Investment Highlights
Qnity Investment Highlights Who What Where Why Target We Are We Do We’re Going We Win Outcomes Established, …providing …that enables …built on deep and …positioned to deliver pure-play unparalleled sustainable lasting customer on strong total technology leader… portfolio breadth above-market relatio
Slide 11: Established Track Record of Delivering Innovative, Breakthrough Technologies
Established Track Record of Delivering Innovative, Breakthrough Technologies 1960 – 2000 2000 – 2020 Today and Beyond CMP Pads & Slurry Polymide films CMP Pad OLED Materials Advanced Node Micro Bumps for SUBA and IC 1000 Kapton® and Pyralux Ikonic and Vision Gracel CMP Materials Advanced Packaging L
Slide 12: Qnity Portfolio Providing Critical Integrated Solutions Across the Value Chain
Qnity Portfolio Providing Critical Integrated Solutions Across the Value Chain Chip Advanced PCB Assembly & Fabrication1 Packaging Building Display Design & Encase and Design and Embed Manufacture Connect the Produce Printed Circuit Boards Semiconductor Chip to Circuitry Circuit Boards into Devices
Slide 13: Bringing Solutions at Every Stage of Manufacturing & Assembly
Bringing Solutions at Every Stage of Manufacturing & Assembly Value Chain Our Product Solutions CMP Pads CMP Slurries Chip Fabrication Advanced Cleans Lithographic Solutions Metallization Substrates Advanced Packaging Dielectrics Thermal Interface Materials Circuit Metallization PCB Photoresists PCB
Slide 14: Qnity Stands out with Leading Positions
Qnity Stands out with Leading Positions Market Position U.S.-Based Peers Diversified or Non-U.S. Based Materials Peers Peer 1 Peer 2 Peer 3 Peer4 Peer 5 Peer 6 Peer 7 Lithographic Materials Advanced Cleans & Slurries1 Semiconductor Technologies CMP Pads Technologies Advanced Display Materials Semico
Slide 15: Qnity Investment Highlights
Qnity Investment Highlights Who What Where Why Target We Are We Do We’re Going We Win Outcomes Established, …providing …that enables …built on deep and …positioned to deliver pure-play unparalleled sustainable lasting customer on strong total technology leader… portfolio breadth above-market relatio
Slide 16: Powering the Next Leap in Electronics
Powering the Next Leap in Electronics High-Performance Computing Advanced Connectivity Demand Drivers AI & Cloud Data Device Edge Autonomous Machine Learning Computing Proliferation Interconnectivity Computing Driving Systems New Technology Trends Driving Demand for New Material Solutions 16
Slide 17: Strong Secular Growth Trends Are Expected to Continue
Strong Secular Growth Trends Are Expected to Continue $1.3T Global Semiconductor Sales $1.1T $1.0T $0.73T $0.54T Growth Drivers $0.50T Artificial Intelligence High Performance Computing $0.35T Connectivity / IoT/ 5G Auto Electrification / ADAS 2015 2020 2023 2025 20302030 Source: SEMI, McKinsey & Co
Slide 18: Partnering with Customers to Accelerate Innovation in Attractive, High Growth End-Markets
Partnering with Customers to Accelerate Innovation in Attractive, High Growth End-Markets End Consumer Industrials / AI / Automotive Communication Market Electronics Other1 Data Center Infrastructure Key Edge Automation Cloud Autonomous Internet and Drivers computing and robotics computing driving s
Slide 19: Large and Growing Addressable Market
Large and Growing Addressable Market % of Market CAGR Current 2024 Net Sales (2024 – 2029) TAM1, 2 ~50% Chip Fabrication MSD $15B ~10% Advanced Packaging HSD $4B ~20% PCB Building LSD – MSD $6B ~20% Assembly & Display MSD $8B ~4-5%3 >$30B Sources: Prismark and Yole NOTE: LSD = Low single digits; MSD
Slide 20: Our Strategy to Outperform the Underlying Market
Our Strategy to Outperform the Underlying Market ~6-7% Targeted Annualized Organic Net Sales CAGR through 2028 OUTPERFORM MARKET TAM Content Customer ~2 % Expansion Growth Gain + ~4-5 % End Market Digitization / New Underlying Demand Connectivity Technologies Market Tailwinds NOTE: All growth rates
Slide 21: Qnity Investment Highlights
Qnity Investment Highlights Who What Where Why Target We Are We Do We’re Going We win Outcomes Established, …providing …that enables …built on deep and …positioned to deliver pure-play unparalleled sustainable lasting customer on strong total technology leader… portfolio breadth above-market relatio
Slide 22: Partner of Choice to Many of the World's Most Innovative Companies
Partner of Choice to Many of the World’s Most Innovative Companies Customer Segmentation ~35 Years Average top 10 customer tenure Significant presence with leading companies, representing ~80% of total market1 Remaining Customers Top 10 Customers 43% 34% 7 of top 10 customers buy from both Semicondu
Slide 23: Strategic Global Network with a Strong Local-for-Local Presence
Strategic Global Network with a Strong Local-for-Local Presence Network Advantages APAC Americas EMEA Customer Intimacy and Speed • Global production and R&D footprint close to customer facilities Supply Chain Resiliency • >80% production sourced in region • >70% raw material spend purchased in regi
Slide 24: Delivering Customized Solutions that Improve Customer Value
Delivering Customized Solutions that Improve Customer Value As customers scale Customers depend on new technologies… partners who can… …small increases in yield Co-innovate with R&D and drive big increases in value engineers through development and scale-up process Execute with exceptionally high co
Slide 25: Executing with a Best-in-Class Operating Model
Executing with a Best-in-Class Operating Model Innovation Depth Operations Excellence Commercial Leadership • Prioritize high-impact R&D aligned with • Global supply chain executed locally • Long standing customer relationships customer roadmaps for speed, quality, and resiliency leading to increase
Slide 26: Customer Centric Innovation with a Seat at the Design Table
Customer Centric Innovation with a Seat at the Design Table Customer Development Process Strategy of Highly Strategy Customized of Highly Solutions Customized Solutions Early Engagement Customer CustomerEngagement Engagement Early understanding Early ofof understanding customer roadmap customer 2-3
Slide 27: Technology Investments Driving Strong Returns
Technology Investments Driving Strong Returns Innovation Engine Drives… …Customer Wins with More to Come CMP Pads, Slurries, and Cleans >401 new CMP pads, slurries, and cleans Advanced Photoresists for Lithography >301 new advanced photoresists Thermal Management Materials >301 new thermal managemen
Slide 28: Accelerating Growth through Innovation
Accelerating Growth through Innovation Randy King Chief Technology and Sustainability Officer TM
Slide 29: Core Innovation Tenets
Core Innovation Tenets Focused innovation to capture and respond to technology inflections Breadth and depth of portfolio creates competitive differentiation Deep customer intimacy gives visibility into customer and industry roadmaps TM 29
Slide 30: Powering the Next Leap in Electronics
Powering the Next Leap in Electronics High-Performance Computing Advanced Connectivity Demand Drivers AI & Cloud Data Device Edge Autonomous Machine Learning Computing Proliferation Interconnectivity Computing Driving Systems Technology More than Moore’s Law 3D Stacking Heterogeneous Integration Min
Slide 31: Integrated Solutions with Leading Portfolio Breadth
Integrated Solutions with Leading Portfolio Breadth Assembly & Chip Fabrication Advanced Packaging PCB Building Display Light Thermal EMI Leading Edge Connectors Assembly Shielding Reticle Mask Lithography Materials Materials Passive Component Focusing Optics (inductors) Photoresist Coated Wafer The
Slide 32: Portfolio Providing Leading Solutions Across the Manufacturing Cycle
Portfolio Providing Leading Solutions Across the Manufacturing Cycle Deposition Chemical Mechanical Advanced PCB Planarization Packaging Building Patterning Building (CMP) Displays Semi Equipment Chip Cleaning Blank Fabrication Silicon Wafer Doping Etching Semiconductor Interconnect Assembly Technol
Slide 33: Technology Leadership in Fast Growing Advanced Packaging
Technology Leadership in Fast Growing Partnering with Advanced Packaging Leading-Edge Customers Advanced Packaging at Intersection of Global Advanced Packaging Semiconductor and Interconnects Background End-Market, USD1 Technology Roadmap Generative AI requires high bandwidth memory (HBM) ~11% ~$75B
Slide 34: Our Top Innovation Programs Drive Future Growth
Our Top Innovation Programs Drive Future Growth Chip Fabrication Advanced Packaging PCB Building Assembly & Display Yield-Enhancing Pads Adv. Node Photoresists High-Res Metallization, Fineline Metallization Thermal/EMI and Sublayers Low-Loss Dielectrics for Chemistries Management Solutions Wafer-Lev
Slide 35: Accelerating Innovation through Data Science and AI
Accelerating Innovation through Data Science and AI What We Are Doing Today Results We Are Achieving Harnessing decades Faster product development cycle of proprietary experimental data New ideas and solutions Increased efficiency Automating data Utilizing algorithms analysis with iterative to build
Slide 36: Innovation Breakthroughs in Thermal Management for AI-Optimized Servers
Innovation Breakthroughs in Thermal Management Customer Case Study for AI-Optimized Servers Global Server End-Market1 Background (shipment units) OEMs require solutions to address Innovation Leader in excessive heat generation in Deep Application data centers Thermal Management Engineering Expertise
Slide 37: New Architectures Create Significant Opportunities for CMP Portfolio
New Architectures Create Significant Opportunities Customer Win for CMP Portfolio Logic and Memory Volume (MSI) Qnity pads improve fab yield, critical in high-CMP layer Background architectures Customers require ultra-precise pad innovation to reliably produce cutting edge Number of CMP Layers, by T
Slide 38: Key Takeaways
Key Takeaways Focused innovation to capture and respond to technology inflections Breadth and depth of portfolio creates competitive differentiation Deep customer intimacy gives visibility into customer and industry roadmaps TM 38
Slide 39: Two Segments Delivering End-to-End Leading-Edge Solutions
Two Segments Delivering End-to-End Leading-Edge Solutions Semiconductor Interconnect Technologies (ST) Solutions (ICS) TM 39
Slide 40: Semiconductor Technologies Segment Overview
Segment Overview Semiconductor CMP Pads Technologies Technologies Advanced Cleans & Slurries Technology Advanced solutions for integrated circuit fabrication; materials for digital displays Lithographic Materials and semiconductor equipment Advanced Display Materials Specialty Seals (Kalrez®) TM 40
Slide 41: Semiconductor Technologies: Building on a Strong Foundation
Semiconductor Technologies: Building on a Strong Foundation Net Sales Estimated Net Sales by End Market $2,450 ~$2,600 $2,251 ~12% Communication Infrastructure ~42% Consumer Electronics 2023 2024 2025E ~15% Automotive Adjusted Pro Forma Operating EBITDA and Margin1 ~35% ~36% ~36% $882 $900+ $785 ~19
Slide 42: Significant Industry Investment Drives Volume Growth
Significant Industry Investment Drives Volume Growth Global Silicon Shipments Forecast Global Semiconductor (12-in Equivalent, MSI)1 Capital Spending Trend2 16,716 16,716 $204B $203B $204B $203B $183B $183B 15,019 15,019 14,678 14,678 12,187 12,187 $111B $111B $81B $74B 9,869 9,869 $65B $65B $65B $5
Slide 43: Continuously Shifting Portfolio Towards Advanced Nodes
Continuously Shifting Portfolio Towards Advanced Nodes Global Market Composition4 2019 2024 2024 Advanced1,2 Advanced1,2 Anticipated 2030+ Advanced2 Trend 31% 35% ~45% 31% Legacy1,3 Legacy1,3 Legacy3 69% 65% 69% 1) % of Sales. 2) Advanced refers to ≤ 7nm process for Logic and all Memory. 3) Legacy r
Slide 44: Core Semiconductor Products Positioned for Growth
Core Semiconductor Products Positioned for Growth CMP CMP Cleans & Lithographic Specialty Seals Display Pads Slurries Materials (Kalrez®) Materials Strategic Role Enables precision wafer Critical to defect control Supports patterning for Specialized seals for Specialty play in polishing for advanced
Slide 45: Interconnect Solutions Segment Overview
Segment Overview Interconnect Advanced Packaging Solutions Advanced Circuit Materials Advanced materials and engineering solutions for advanced packaging, high Thermal and EMI (Laird ) density interconnect, and circuit assembly Advanced Flex Technologies TM 45
Slide 46: Interconnect Solutions: Enabling AI through Advanced Packaging and Thermal Solutions
Interconnect Solutions: Enabling AI through Advanced Packaging and Thermal Solutions Net Sales Estimated Net Sales by End Market $1,885 ~$2,000 $1,784 ~3% Communication Infrastructure ~17% ~42% 2023 2024 2025E Automotive Consumer Electronics Adjusted Pro Forma Operating EBITDA and Margin1 ~11% AI /
Slide 47: Well-Positioned to Capture Growing Customer Demand
Well-Positioned to Capture Growing Customer Demand Megatrends Growing Interconnect Demand By Technology Applications: By End Market Segments: Units: $B Units: $B AI / HPC / ▬ : Electronic Systems value 550 2050 Data Center ▬ : IC Packaging assembly value AI/Data Center Industrials 300 ~11.2% ~5.5% ~
Slide 48: Broad Solutions and Deep Expertise as Trusted OEM Design Partner
Broad Solutions and Deep Expertise as Trusted OEM Design Partner Advanced Circuit Thermal Management Advanced Flex and Packaging and EMI (Laird ) Technologies Strategic Role Leading solutions to support Critical solutions for thermal Leading solutions for smart devices advanced packaging and managem
Slide 49: Primed to Capture Significant Value from Spin-Off
Primed to Capture Significant Value from Spin-Off Growth Deliver strong, above-market growth Outperformance Sharpened Drive leadership position for Strategic Focus technology inflections Optimized Right-size for cost, complexity Operating Model and impact Calibrate Centered around customers, Culture
Slide 50: Qnity Investment Highlights
Qnity Investment Highlights Who What Where Why Target We Are We Do We’re Going We Win Outcomes Established, …providing …that enables …built on deep and …positioned to deliver pure-play unparalleled sustainable lasting customer on strong total technology leader… portfolio breadth above-market relatio
Slide 51: Driving Long-Term Value Creation
Driving Long-Term Value Creation Matt Harbaugh Chief Financial Officer TM
Slide 52: Disciplined, Returns-Focused Strategy to Optimize Long-Term Value Creation
Disciplined, Returns-Focused Strategy to Optimize Long-Term Value Creation Build on strong history of growth Leverage operational excellence to accelerate sustainable, profitable growth Generate robust free cash flow for balanced capital allocation TM 52
Slide 53: Strong Foundation of Financial Performance
Strong Foundation of Financial Performance Net Sales ($M) Adjusted Pro Forma Adjusted Free Cash Flow2 ($M) Operating EBITDA1 ($M) ~$4,600 ~26% ~29% ~30% $600+ $4,335 $598 $4,035 ~$1,400 $1,252 $1,038 $388 2023 2024 2025E 2023 2024 2025E 2023 2024 2025E 1) Qnity Adjusted Pro Forma Operating EBITDA is
Slide 54: 2025 Full Year Positioned for Continued Growth Momentum
2025 Full Year Positioned for Continued Growth Momentum 2024A 2025E Change Drivers Strength in AI driven applications Net Sales $4.3B ~$4.6B ~7% across advanced nodes, advanced packaging, and thermal management Adjusted Pro Forma ~$1.25B ~$1.4B ~11% Operating EBITDA1 Higher net sales and cost produc
Slide 55: 3-Year Financial Objectives
3-Year Financial Objectives ~6-7% Above-Market Strong ~7-9% Organic Net Sales Growth Profitability Adj. EBITDA CAGR Growth CAGR Disciplined Organic Growth Opportunistic M&A Capital Solid Free Cash <3.0x Flow Generation Capital Returns Allocation Target Net Debt Leverage1 Targets are on average over
Slide 56: Our Strategy to Outperform the Market
Our Strategy to Outperform the Market ~6-7% Targeted Annualized Organic Net Sales CAGR through 2028 OUTPERFORM MARKET TAM Content Customer ~2 % Expansion Growth Gain + ~4-5 % End Market Digitization / New Underlying Demand Connectivity Technologies Market Tailwinds NOTE: All growth rates projected o
Slide 57: Balance Sheet Strength Underpins Financial Flexibility for Future Growth
Balance Sheet Strength Underpins Financial Flexibility for Future Growth Senior Secured Term $4.1B Loan B Facility $2.35B Gross Debt (7 year, ~6%1,2) $4.1B Gross Debt ~$3.5B Net Debt Senior Senior Unsecured Note Secured Note $750M $1B (8 year, 6.250%) (7 year, 5.750%) ~2.5x 2025E Net Leverage4 NOTE:
Slide 58: Solid Free Cash Flow Supports Balanced Capital Deployment
Solid Free Cash Flow Supports Balanced Capital Deployment Organic Reinvestment R&D and ongoing capital investments to support growth Capital Returns Target dividend payout ratio ~10%1 Leverage Management Target net leverage <3.0x Opportunistic M&A Selective, focused acquisitions with high return pro
Slide 59: Strategic Capital Investments Aligned with Customer Roadmaps
Strategic Capital Investments Aligned with Customer Roadmaps Future R&D Investments Future Capex Investments ~7% 60% Top 30% Supporting 10% Break- ~6% 70% Growth 30% Maintenance Programs Existing through of net sales Customers Technologies of net sales Full support for top programs in advanced nodes
Slide 60: M&A to be Part of Our Future for Accelerating Long-Term Shareholder Returns
M&A to be Part of Our Future for Accelerating Long-Term Shareholder Returns Potential Focus Areas Strategic Criteria Advanced Packaging and Expands portfolio in fast-growing Thermal Management adjacencies Leading technologies in next-generation electronics Accelerates technology leadership with Comp
Slide 61: Managing Near-Term Transition while Driving Broader Transformation
Managing Near-Term Transition while Driving Broader Transformation Near-Term Transition Broader Transformation Initial one time IT stand-up cost Right size for complexity, cost, incurred over 2 years and footprint Most TSAs running through year Drive quality and productivity end 2027 improvements th
Slide 62: Qnity's Industry Leading Financial Profile
Qnity’s Industry Leading Financial Profile Net Sales Growth1,2 EBITDA Margin2,3 FCF Conversion2,3,4,5 (FY23 – FY25E CAGR) (FY25E) (FY25E) ~7% ~83% 77% ~30% 65% 26% 25% 2% 1% U.S.-Based Competitors Diversified or Non-U.S. Based Materials Competitors Source: FactSet market data and Internal Company An
Slide 63: On-Track for November 2025 Spin
On-Track for November 2025 Spin Jan Apr June June-Oct Aug Sep 18 Nov 1 Nov 3 Nov Nov-Dec Qnity spin-off Initial SEC Completes Form 10 Debt Inaugural Targeted NYSE regular Business NDRs / accelerated to Form 10 leadership amendments financing Investor spin way trading update conferences November 1, f
Slide 64: Key Takeaways
Key Takeaways Build on strong history of growth Leverage operational excellence to accelerate sustainable, profitable growth Generate robust free cash flow for balanced capital allocation TM 64
Slide 65: Closing Remarks
Closing Remarks Jon Kemp Chief Executive Officer TM
Slide 66: Qnity: A Broad Pure-Play Technology Leader for the Fast-Growing Semiconductor Market
Qnity: A Broad Pure-Play Technology Leader for the Fast-Growing Semiconductor Market Broad portfolio with end-to-end horizontal integration from chip manufacturing to advanced packaging to device assembly > 65% of the portfolio is tied directly to Semiconductors, including chip fabrication, advanced
Slide 67: Break and Q&A
Break and O&A 2 Qnity.
Slide 68: Appendix
APPENDIX 2 Qnity.
Slide 69: Executive Leadership Bios
Executive Leadership Bios Jon Kemp Matt Harbaugh Randy King Chuck Xu Sang Ho Kang Chief Executive Chief Financial Chief Technology and President, President, Officer Officer Sustainability Officer Interconnect Solutions Semiconductor Technologies • Previously President of • Previously CFO of • Previo
Slide 70: Composition of Semiconductor Technologies Portfolio as Compared with Industry
Composition of Semiconductor Technologies Portfolio as Compared with Industry Global Market Composition4 2019 2024 2024 Memory1 Memory1 Memory 29% 20% 28% Logic1 Logic1 Logic 71% 80% 72% Advanced1,2 Advanced1,2 Advanced2 31% 35% 31% Legacy1,3 Legacy1,3 Legacy3 69% 65% 69% 1) % of Sales. 2) Advanced
Slide 71: Reconciliations
Reconciliations 2 Qnity.
Slide 72: 2025E: ElectronicsCo Segment to Qnity Adjusted Pro Forma Operating EBITDA Bridge
2025E: ElectronicsCo Segment to Qnity Adjusted Pro Forma Operating EBITDA Bridge ($ Millions) ~ $1,520 ElectronicsCo ~ $1,450 Segment Operating Qnity ~ $1,400 EBITDA Adjusted (DuPont)* Qnity Carve Out Operating Adjusted EBITDA** Pro Forma Operating EBTIDA ** Segment FY Corp Costs Depr Adj Other Carv
Slide 73: Adjusted Operating EBITDA – Carve Out Operating EBITDA ($M)
Adjusted Operating EBITDA – Carve Out Operating EBITDA ($M) 1) Qnity Carve-Out Adjusted Operating 2023 2024 ~ 2025E EBITDA is a non-GAAP financial measure and is defined as earnings (i.e., “Income before income taxes") before interest, depreciation, Carve Out Net Sales $4,035 $4,335 $4,600 amortizat
Slide 74: Adjusted Operating EBITDA – Pro Forma Operating EBITDA ($M)
Adjusted Operating EBITDA – Pro Forma Operating EBITDA ($M) 1) Pro forma Other Expenses includes 2023 2024 ~ 2025E litigation/environmental/legal costs, and non- operating pension credit. Carve Out Net Sales $4,035 $4,335 $4,600 2) Reflects the management adjustment expected to be incurred following
Slide 75: Adjusted Free Cash Flow - Pro Forma & Recurring Management Adjusted ($M)
Adjusted Free Cash Flow - Pro Forma & Recurring Management Adjusted ($M) 1) Indirect legacy costs relate to cost sharing 2023 2024 ~ 2025E arrangements executed between DuPont and Qnity at the time of the separation. Such costs include certain litigation and environmental-related shared costs and Ca
Slide 76: Trademarks and Separation Notice
Qnity , the Qnity Node Logo, and all products, unless otherwise noted, denoted with TM or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc. *The intended separation of Qnity Electronics, Inc., targeted for completion on November 1, 2025, is subject to sa