Slide 1: Investor Presentation March 2020
Investor Presentation March 2020
Slide 2: Safe Harbor
Safe Harbor This presentation contains forward-looking statements concerning Atomera Incorporated (““Atomera,” the “Company,” “we,” “us,” and “our”). The words “believe,” “may,” “will,” “potentially,” “estimate,” “continue,” “anticipate,” “intend,” “could,” “would,” “project,” “plan,” “expect” and s
Slide 3: Investment Overview
Investment Overview • Mears Silicon Technology (MST®) is a thin film used to enhance semiconductors • Results in higher performance, lower power, and lower costs for ICs • Capital-light IP licensing business • Robust and growing patent portfolio • Engaged with 50% of world’s top semiconductor makers
Slide 4: A better way for industry R&D
A better way for industry R&D Industry Consortia Equipment OEMs In house R&D Atomera Little control No longer available Large scale, long term Targeted Innovation Expensive and Inefficient Tied to equipment sales investment Inexpensive and low risk 4
Slide 5: MST Technology
MST Technology Potential Benefits • Improved Efficiency • Higher transistor performance • Lower power consumption • Better reliability • Lower cost • Reduced die size • Improved yield • Higher throughput • Same benefits as a node shrink 5
Slide 6: Patent Portfolio
Patent Portfolio 234 Patents Granted and Pending Discoverable 84 US Patents 57 95 Foreign 38 Pending US 55 These distinctive layers are visible Foreign on products using MST Patents Extensive know-how Core MST Method and Device Extends life and value of patents MST Enabled Devices/Architecture Next-
Slide 7: Semiconductor Ecosystem
Semiconductor Ecosystem Integrated Device Manufacturers Foundry Fabless Tool Suppliers 7
Slide 8: Customer engagements
Customer engagements Number of Customer Engagements 27 24 21 18 15 12 9 6 3 0 IPO 3Q 16 4Q 16 1Q 17 2Q 17 3Q 17 4Q 17 1Q 18 2Q 18 3Q 18 4Q 18 1Q 19 2Q 19 3Q 19 4Q 19 Phase 1 Phase 2 Phase 3 • 19 customers, 25 engagements • Working with 50% of the world’s top semiconductor makers* * 10 of the top 20
Slide 9: Customer engagement model
Customer engagement model v Customer Wafer Manufacturing Atomera MST® Deposition Customer MST® Deposition 1. Planning 2. Setup 3. Integration 4. Installation 5. Qualification 6. Production Phase • MST deposition on customer wafers Engineering Service Fees • Integration consulting • Integration licen
Slide 10: Royalty potential per wafer ($)
Royalty potential per node 200mm wafers 300mm wafers Royalty potential per wafer ($) Royalty SAM $0.3B $0.7B $0.9B $5.1B $1.1B Source: The McClean Report - 2019 10Q
Slide 11: MST customer business opportunity
MST customer business opportunity Standard industry fab wafer pricing, GM, and cost 15% performance improvement option raises price by $150 Wafer GM$ selling Increase Fab wafer Price GM% over base Cost* 28nm HP wafer - base $ 3,000 45% $ - $ 1,650 28nm HP+ wafer $ 3,150 45% $ 68 $ 1,733 15% improvem
Slide 12: Royalty opportunity
Royalty opportunity • ~370 wafer fabs operating worldwide • Adoption of MST in one fab, at 50% of capacity, can make Atomera profitable from royalties alone • 2020 non-GAAP OPEX guidance is $12.5-13.5M Example 1. Worldwide Average Fab Example 2. Leading Foundry, 28nm Fab Monthly Fab Capacity1 Monthl
Slide 13: Financial review
Financial review Q4 '18 Q1 '19 Q2 '19 Q3 '19 Q4 '19 FY 2019 Balance Sheet 12/31/19 GAAP Results Cash $14.9M Revenue $0.15M $0.07M $0.07M $0.25M $0.14M $0.53M Debt - Gross Profit $0.12M $0.07M $0.05M $0.05M $0.11M $0.28M Shares Outstanding 17.1M Operating Expense R&D $2.0 $2.1 $2.1 $1.7 $1.8 $7.7 G&A
Slide 14: Summary
Summary High margin, recurring revenue financial model Solid cash position Strong technology and patent position Traction with many top industry players and growing licensee base Ramping commercial license revenues 14
Slide 15: Thank You
oft © atomera Thank You
Slide 16: Atomera Licensees
Atomera Licensees Large fabless RF semiconductor company 16
Slide 17: Phosphorus diffusion blocking by MST
Phosphorus diffusion blocking by MST After Epi Deposition After 1000˚C 20 sec After 1050˚C 20 sec Surface Depth into Silicon (nm) Surface Depth into Silicon (nm) Surface Depth into Silicon (nm) MST minimizes up-diffusion of Phosphorus through typical manufacturing thermal cycles Ideally dopant conce
Slide 18: RF-SOI Improvement data
RF-SOI Improvement data Breakdown Voltage vs Ron RF Switch Power Handling LNA Ioff improvement • MST improves BV vs Ron • MST improves RF switch power • MST improves LNA performance • Up to 50% BV increase at same Ron handling • 8 x better Ioff • 15-20% Ron improvement at same • Greater than 25% • R
Slide 19: MST1 vs MST2
MST1 vs MST2 MST1 Blanket technology Easy to integrate Deposited at beginning of mfg process Degraded by high heat in STI/Well module Faster time to market for low heat processes Used for FinFET, RFSOI, newer process nodes MST2 Selective technology Integrated after STI/Well so avoids highest heat Mo
Slide 20: 5V Analog Breakthrough
5V Analog Breakthrough 3. Breakthrough performance achieved on 5V analog products Large segment of the overall analog market Atomera has targeted ~20% improvement on 5V devices In April Atomera demonstrated a 50%+ improvement Using MST-SP technology Relatively fast and easy to implement Expected to
Slide 21: MST-SP progress
MST-SP progress MST SP Progress 3.0 2.5 Combine with previous 2.0 RSP 1.5 2 (mΩ-mm ) 1.0 Industry 0.5 top-runners 0.0 May 2019 Result Current Result Projected Current Result Feb-19 Atomera May-19 R&D fab Aug-19 Dec-19 Atomera R&D fab Mar-20 Jun-20 Advanced fab Sep-20 Control MST SP Industry Top Runn
Slide 22: MST matching performance
MST matching performance 35 Transistor mismatch is an industry problem Si control 30 Certain circuit designs benefit from mismatch MST process reduction 25 better matching A-D convertors 20 SRAM σΔVth [mV] Flash 15 DRAM sense amplifiers 10 MST can reduce mismatch by more than 50% 5 Details available