Lpkf Laser & Electronics Se · XETR:LPK
Lpkf Laser & Electronics — Investor Presentation (September 2026)
54 slides from Lpkf Laser & Electronics's investor presentation, September 2026
Slide 1: Tomorrow's Technology Today – Equity Story 2026
EQUITY STORY 2026 TOMORROW’S TECHNOLOGY TODAY Dr. Klaus Fiedler, CEO | Peter Mümmler, CFO
Slide 2: Our Ambition: Pioneering with a focus on large volume markets
OUR AMBITION PIONEERING WITH A FOCUS ON LARGE VOLUME MARKETS ▪ A pioneering spirit is in our genes. Through creativity, perseverance and a passion for innovation, we have repeatedly opened up new markets and gained leading positions in laser processing solutions. ▪ We will continue to do so in the f
Slide 3: Five Things to Remember About LPKF
A proven suppler of production FIVE THINGS TO REMEMBER ABOUT LPKF laser systems for 50 years – now essential to AI advanced packaging 01 02 03 04 05 PROVEN SUPPLIER AI ADVANCED ACTIVE ACROSS ALL ENGAGED WITH POSITIONED FOR WITH LEADING PACKAGING IS GLASS APPLICATIONS TIER-1 CUSTOMERS GROWTH ON A MAR
Slide 4: Agenda
AGENDA 1 COMPANY OVERVIEW 2 GLASS SUBSTRATES AS ENABLER OF ADVANCED PACKAGING 3 LIDE & LPKF GLASS PORTFOLIO 4 CORE BUSINESS OVERVIEW 5 FINANCIALS & OUTLOOK 4 LPKF Laser & Electronics SE
Slide 5: The Management Board
THE MANAGEMENT BOARD Dr. Klaus Fiedler Peter Mümmler Chief Executive Management Officer Board member(CEO) since January 2022; contract extended Chief Financial Management Officer Board member(CFO) since April 2025; appointed until early, appointed until 31 December 2028 March 2028 Responsible for St
Slide 6: 1. Company Overview
1. COMPANY OVERVIEW
Slide 7: LPKF at a Glance: Trusted Partner to the Industry
1. Company Overview LPKF AT A GLANCE TRUSTED PARTNER TO THE INDUSTRY High-tech company with deep expertise in the combination of laser processing and microsystems technology. Key enabler to its customers production processes or R&D roadmaps LPKF holds #1 positions in its various end-markets and is t
Slide 8: Leading Niche Markets with Cutting-Edge Laser Technology
1. Company Overview LEADING NICHE MARKETS WITH CUTTING-EDGE LASER TECHNOLOGY ELECTRONICS MANUFACTURING RAPID PCB PROTOTYPING MARKET LEADER • LPKF holds multiple #1 market positions in attractive niche Stencil markets that offer organic growth opportunities Depaneling • LPKF will preserve its core id
Slide 9: Global Reach, Local Support in All Key Regions
1. Company Overview GLOBAL REACH, LOCAL SUPPORT IN ALL KEY REGIONS EMPOWERING CUSTOMERS WORLDWIDE WITH A GLOBAL OPERATIONS FOOTPRINT Headquarters LPKF Group with 3 production sites in EU Distributors Garbsen | GER Suhl | GER Seoul | KOR Tualatin (OR) | USA Fürth | GER Tianjin | CHN Naklo | SVN Globa
Slide 10: 2. Glass Substrates – Enabler of Advanced Packaging
2. GLASS SUBSTRATES - ENABLER OF ADVANCED PACKAGING
Slide 11: Packaging History
2. Glass Substrates – Enabler of Advanced Packaging PACKAGING HISTORY FROM ”PROTECTING THE DIE” TO „ARCHITECT THE SYSTEM” TODAY Advanced chip architecture plays a key 1980’S role in the system’s performance. The housing is designed to protect the chip. 11 LPKF Laser & Electronics SE
Slide 12: Backend Packaging Emerges as Primary Driver of Compute Performance
2. Glass Substrates – Enabler of Advanced Packaging BACKEND PACKAGING EMERGES AS THE PRIMARY DRIVER OF COMPUTE PERFORMANCE COMPUTE PERFORMANCE (SPEED X DENSITY) 300x ADVANCED PACKAGING Compute 250x Performance 200x demand driven by AI 150x 100x Performance 50x improvement x increasingly 2011 2020 20
Slide 13: From Organic to Glass: A Structural Shift in Substrate Technology
2. Glass Substrates – Enabler of Advanced Packaging FROM ORGANIC TO GLASS: A STRUCTURAL SHIFT IN SUBSTRATE TECHNOLOGY GLASS SUBSTRATES – THE NEXT DISRUPTION: SUBSTRATE AND PACKAGING TECHNOLOGIES HAVE CO-EVOLVED OVER THE LAST 70 YEARS WITH GLASS PANELS BEING THE NEXT GENERATION SUBSTRATES. BGA Flip C
Slide 14: Advanced Packaging: A High Growth Structural Revenue Opportunity
2. Glass Substrates – Enabler of Advanced Packaging ADVANCED PACKAGING: A HIGH GROWTH STRUCTURAL REVENUE OPPORTUNITY HIGH-END PERFORMANCE PACKAGING REVENUE (FROM 2020 TO 2030 IN $M) $30 000M $25 000M $20 000M Revenue $15 000M $10 000M $5 000M $0 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030
Slide 15: Glass Is a Key Enabler for AI
2. Glass Substrates – Enabler of Advanced Packaging GLASS IS LARGER PACKAGE SIZE A KEY ENABLER End of Moores Law Silicon chip size increases FOR AI Growth of substrate size Warpage/stress on silicon chips ADVANTAGES OF GLASS HIGHER BANDWIDTH FOR ADVANCED PACKAGING High Performance Computing (HPC): c
Slide 16: Challenges of Glass Processing
2. Glass Substrates – Enabler of Advanced Packaging CHALLENGES OF GLASS PROCESSING GLASS SUBSTRATE MANUFACTURING NEW EQUIPMENT AND REQUIREMENTS PROCESS INVESTMENTS High-precision via formation in glass TO WORK AT SCALE for high-density interconnect ARE REQUIRED Clean, defect-free laser processing fo
Slide 17: Glass Processing Breakthrough Innovation
2. Glass Substrates – Enabler of Advanced Packaging CHALLENGES OF GLASS PROCESSING LIMITS OF CONVENTIONAL GLASS UNLOCKING GLASS AS PROCESSING A SUBSTRATE REQUIRES Brittle and difficult to machine BREAKTHROUGH Thermally induced stress causes INNOVATION micro cracks Low accuracy and yield Chipping, de
Slide 18: Surging Glass Substrate Patents Signal a Market Inflection Point
2. Glass Substrates – Enabler of Advanced Packaging SURGING GLASS SUBSTRATE PATENTS SIGNAL A MARKET INFLECTION POINT PATENT PUBLICATIONS MULTIPLIED IN 2024 VS. 2018 DEMONSTRATE THAT GLASS AS INTERPOSER/SUBSTRATE IS AT A TIPPING POINT. Patent publications by patent assignees (# New Patent Application
Slide 19: Selected Media Coverage on Advanced Glass Packaging
2. Glass Substrates – Enabler of Advanced Packaging SELECTED MEDIA COVERAGE ON ADVANCED GLASS PACKAGING 2 July 2026 16 December 2025 22 January 2026 3 February 2026 Seoul Economic Daily TOPPAN INC. TechPowerUp news Samsung Electro-Mechanics Sets Up Glass TOPPAN to Install Pilot Line for Advanced Int
Slide 20: Changes in IC Substrate Process Flow
2. Glass Substrates – Enabler of Advanced Packaging CHANGES IN IC SUBSTRATE PROCESS FLOW A NEW PROCESS FOR GLASS CORE SUBSTRATES IS NECESSARY. THAT OPENS OPPORTUNITIES FOR NEW EQUIPMENT PLAYERS Through Hole Formation Metallization RDL Buildup Substrate Singulation Substrate Legacy IC Laser Ablation
Slide 21: 3. LIDE & LPKF Glass Processing Portfolio
3. LIDE & LPKF GLASS PROCESSING PORTFOLIO
Slide 22: LIDE: World-Leading Technology for Microfeatures in Glass
3. LIDE & LPKF Glass Processing Portfolio LIDE: WORLD-LEADING TECHNOLOGY FOR MICROFEATURES IN GLASS Laser Induced Deep Etching = LIDE Flawless, highly reproducible hole formation foundation for subsequent Two Step Manufacturing Process: TGV metallization Laser + Etching Through Glass Vias = TGV: Ver
Slide 23: LPKF – The Reference in Advanced Packaging with Glass
3. LIDE & LPKF Glass Processing Portfolio LPKF – THE REFERENCE IN ADVANCED PACKAGING WITH GLASS PROCESS MATURITY, MARKET LEADERSHIP, AND STRONG IP GIVE LPKF AN UNMATCHED POSITION The only cost-effective process for Unrivaled process maturity, backed by defect-free glass microstructures 8 years of fi
Slide 24: LPKF Leads the Glass Substrate Value Chain
3. LIDE & LPKF Glass Processing Portfolio LPKF LEADS THE GLASS SUBSTRATE VALUE CHAIN Dominating win rate across all key customer engagements (excluding local Chinese players) (USA) (USA) (KOR) (USA) (USA) OEM (USA) (USA) (USA) (TWN) (CHN) Player 1 (KOR) Player 4 (USA) IC SUBSTRATE Player 2 (EU) Play
Slide 25: LIDE – Foundation for the Entire Glass Value Chain
3. LIDE & LPKF Glass Processing Portfolio LIDE – FOUNDATION FOR THE ENTIRE GLASS LASER STRUCTURING (LIDE) VALUE CHAIN Defect-free through-glass vias at production speed LPKF’s proven LIDE® technology creates flawless TGVs with aspect ratios up to 1:50 and sub-micrometer accuracy, defect-free, zero c
Slide 26: Glass Substrate Singulation
3. LIDE & LPKF Glass Processing Portfolio GLASS SUBSTRATE SINGULATION A TWO-STAGE PROCESS ENABLED BEI RDL LASER ABLATION By By LPKF LPKF Partner RDL GLASS CORE ABLATION SINGULATION 26 LPKF Laser & Electronics SE
Slide 27: LPKF's Offering of Laser Glass Bonding
3. LIDE & LPKF Glass Processing Portfolio LPKF’S OFFERING OF LASER GLASS BONDING PANEL-LEVEL GLASS BONDING, COMPLETING END-TO-END GLASS SUBSTRATE MANUFACTURING ON ONE PLATFORM Adhesive-free glass-to-glass bonding No glass frit, no high-voltage field Direct bonding with no intermediate layer Local he
Slide 28: Co-Packaged Optics (CPO) with Glass Substrates – The Next Step
3. LIDE & LPKF Glass Processing Portfolio CO-PACKAGED OPTICS (CPO) WITH GLASS SUBSTRATES THE NEXT STEP FUTURE PACKAGING ARCHITECTURES NEED TO ALLOW PHOTONIC DATA TRANSMISSION inside the package and to the outside WHAT IS CPO (CO-PACKAGED OPTICS)? Integrates optical components directly into the same
Slide 29: Co-Packaged Optics with Glass Substrates as the Next Step
3. LIDE & LPKF Glass Processing Portfolio CO-PACKAGED OPTICS (CPO) WITH GLASS WHY GLASS SUBSTRATES MATTER IN CPO SUBSTRATES AS THE Glass has excellent optical properties NEXT STEP Glass can be processed to guide light through embedded waveguide Thermally/dimensionally stable with constant optical pr
Slide 30: Strategic Roadmap: Market Positioning and Growth Phases 2025–2030
3. LIDE & LPKF Glass Processing Portfolio STRATEGIC ROADMAP: MARKET POSITIONING AND GROWTH PHASES 2025 – 2030 ADVANCED 2025 2026 2027 2028 2029 2030 PACKAGING Glass Structuring NEXAR LIDE Positioning Ramp-up High-Volume Glass Substrate Singulation Positioning Ramp-up High-Volume NEXAR Ablate Laser G
Slide 31: TAM for LIDE Solutions Expands Significantly with Acceleration of AI
3. LIDE & LPKF Glass Processing Portfolio TAM FOR LIDE SOLUTIONS EXPANDS SIGNIFICANTLY WITH THE ACCELERATION OF AI AI-DRIVEN GROWTH IN HPC MATERIALLY BROADENS THE ADDRESSABLE MARKET FOR LIDE SOLUTIONS In million EUR 228 ESTIMATED TAM FOR 2030 100 EUR 1.7 BILLION Future estimated growth by new Advanc
Slide 32: 4. Core Business Segments
4. CORE BUSINESS SEGMENTS
Slide 33: 4.1 Development
Segment 4.1 DEVELOPMENT
Slide 34: Development: Market Leader with 50 Years of Experience
4. Core Business Overview – Segment: Development MARKET LEADER WITH 50 YEARS OF EXPERIENCE MARKET OFFERING REVENUE ADJ. EBIT We provide in-house solutions for Rapid PCB Prototyping, without wet chemistry. 27,1 Mio. 2025 1,3 Mio. 2025 26,2 Mio. 2024 0,9 Mio. 2024 We develop and sell mechanical and 2
Slide 35: Market Leader with 50 Years of Experience
4. Core Business Overview – Segment: Development MARKET LEADER WITH 50 YEARS OF EXPERIENCE CHEMICAL-FREE PCB PRODUCTION EMPOWERING Since 1976: Development and sales GLOBAL R&D WITH of chemical-free PCB prototyping systems for global customers in research, FAST, CLEAN PCB education, and industry PROT
Slide 36: 4.2 Electronics
Segment 4.2 ELECTRONICS WITHOUT ADVANCED PACKAGING
Slide 37: SMT Solutions – Raising Productivity and Quality in Electronics Manufacturing
4. Core Business Overview – Segment: Electronics SMT SOLUTIONS – RAISING PRODUCTIVITY AND QUALITY IN ELECTRONICS MANUFACTURING MARKET OFFERING REVENUE ADJ. EBIT We bundle laser solutions for series production of electronic modules, focusing on SMT 35,9 Mio. 20251 -2,6 Mio. 20251 processes in high-Vo
Slide 38: Depaneling: Outgrowing the Market through Tensor-Powered Technology Leadership
4. Core Business Overview – Segment: Electronics DEPANELING: OUTGROWING THE MARKET THROUGH TENSOR-POWERED GLOBAL TECHNOLOGY AND MARKET LEADER IN LASER DEPANELING TECHNOLOGY Consistently gaining market share – growth structurally above market CAGR Order intake 2022 – 2025: > 20% LEADERSHIP Tensor-bas
Slide 39: 4.3 Welding
Segment 4.3 WELDING
Slide 40: Clean, Precise Plastic Joining for High-Performance Applications
4. Core Business Overview – Segment: Welding CLEAN, PRECISE PLASTIC JOINING FOR HIGH-PERFORMANCE APPLICATIONS MARKET OFFERING REVENUE ADJ. EBIT We provide turnkey laser plastic welding solutions for joining components precisely, 24,0 Mio. 2025 0,5 Mio. 2025 cleanly and without additional chemicals o
Slide 41: Engineering the Next Generation of High-Performance Plastic Welds
4. Core Business Overview – Segment: Welding ENGINEERING THE NEXT GENERATION OF HIGH-PERFORMANCE THERMOPRO TECHNOLOGY PLASTIC WELDS Our unique temperature monitoring system enables 100% inline quality control, WELDING OF ABSORBING TO ABSORBING elevating quality assurance and (ATA) PLASTIC PARTS trac
Slide 42: 4.4 Solar
Segment 4.4 SOLAR i
Slide 43: Enabling Next-Generation Thin-Film and Perovskite Solar Manufacturing
4. Core Business Overview – Segment: Solar ENABLING NEXT-GENERATION THIN-FILM AND PEROVSKITE SOLAR MANUFACTURING MARKET OFFERING REVENUE ADJ. EBIT We develop and manufacture laser systems to structure thin-film solar cells on large 28,3 Mio. 2025 1,6 Mio. 2025 glass substrates with high precision.
Slide 44: The Future of Solar
4. Core Business Overview – Segment: Solar THE FUTURE OF SOLAR THE WHOLE PV MARKET IS EXPECTED TO GROW SIGNIFICANTLY IN THE COMING YEARS • Global clean energy trend continues to gain momentum • Forecast: The global market will double by 2030 compared to today driven by technological shifts, industri
Slide 45: Perovskite Solar Modules: Driving the Next Wave of Clean Energy Innovation
4. Core Business Overview – Segment: Solar PEROVSKITE SOLAR MODULES: DRIVING THE NEXT WAVE OF CLEAN ENERGY INNOVATION Si mono-crystalline cell PEROVSKITE HAS MULTIPLE IMPACTS ON THINFILM MARKET CIGS cell Perovskite tandem modules making them a promising next-generation solution: Disruptive technolog
Slide 46: The Future of Perovskite/Perovskite Tandem
4. Core Business Overview – Segment: Solar THE FUTURE OF PEROVSKITE/PEROVSKITE TANDEM PEROVSKITE MARKET POTENTIAL • The improvement in efficiency of perovskite in recent years has been significantly greater than that of any other thin-film technology • The characteristics of perovskite open up new p
Slide 47: 5. Financials & Outlook
FINANCIALS 5. & OUTLOOK Sef f —
Slide 48: Revised 2026 Guidance and Mid-Term Aspiration
5. Financials & Outlook REVISED 2026 GUIDANCE AND MID-TERM ASPIRATION MID-TERM ASPIRATION ACTUALS REVISED GUIDANCE The Management Board aims to achieve a sustainable double- 2025 FY 2026 digit EBIT margin for the group by 2028 • Semiconductor Market: Strong strategic positioning with Revenue: Revenu
Slide 49: Key Group Figures after 6 Months 2026
5. Financials & Outlook KEY GROUP FIGURES AFTER 6 MONTHS 2026 in Mio. EUR 6 Months | 2026 6 Months | 2025 ∆% Revenue 36.5 59.2 -38% SALES, PROFITS AND ORDERS Adjusted EBIT -10.4 -0.7 -1386% Adjusted EBIT margin (%) -28.5 -1.2 • H1 revenue and earnings declined as planned, mainly due to significantly
Slide 50: Business Development in Q2 2026
5. Financials & Outlook BUSINESS DEVELOPMENT IN Q2 2026 MARKET BUSINESS OPERATIONS SITUATION DEVELOPMENT • Overall environment: persistent macroeconomic • Advanced Packaging / LIDE: strong strategic • North Star program: first restructuring wave and geopolitical uncertainty, wars/fragile supply posi
Slide 51: Revenue and EBIT by Segment
5. Financials & Outlook REVENUE AND EBIT BY SEGMENT Revenue Adjusted EBIT 0 6 Months 6 Months 6 Months 6 Months ∆% ∆% in EUR million 2026 2025 2026 2025 0 Electronics 12.8 12.2 5% -4.0 -4.6 13% Development 11.1 11.7 -5% -0.8 -1.0 20% Welding 8.2 13.1 -37% -2.8 1.8 -256% Solar 4.4 22.2 -80% -2.8 3.1
Slide 52: Working Capital as per 30 June 2026
5. Financials & Outlook WORKING CAPITAL AS PER 30 JUNE 2026 in EUR million 30.06. | 2026 31.12. | 2025 ∆% Inventories 23.9 19.6 22% WORKING CAPITAL Trade Receivables 11.3 13.5 -16% • Inventory: significant increase Contract Liabilities -7.9 -4.1 93% is basis for ramp-up revenue for H2. Trade Payable
Slide 53: Q&A
Q&A
Slide 54: Disclaimer
DISCLAIMER This presentation has been prepared by LPKF Laser & Electronics SE (“LPKF”) for informational purposes only. It does not constitute an offer to sell or a solicitation of an offer to buy any securities of LPKF, nor does it constitute a recommendation regarding any securities. The informati
LPKF Laser & Electronics — Investor Presentation (September 2026) on 6ix