Lpkf Laser & Electronics Se · XETR:LPK
Lpkf Laser & Electronics — Investor Presentation (October 2026)
35 slides from Lpkf Laser & Electronics's investor presentation, October 2026
Slide 1: Advanced Packaging Solutions for AI Growth
OCTOBER 2026 INVESTOR PRESENTATION: ADVANCED PACKAGING SOLUTIONS FOR AI GROWTH Dr. Klaus Fiedler, CEO | Peter Mümmler, CFO
Slide 2: The Management Board
THE MANAGEMENT BOARD Dr. Klaus Fiedler Peter Mümmler Chief Executive Management BoardOfficer member (CEO) since January 2022; contract extended Chief Financial Management Officer Board member(CFO) since April 2025; appointed until early, appointed until 31 December 2028 March 2028 Responsible for St
Slide 3: Five Things to Remember About LPKF
FIVE THINGS TO REMEMBER ABOUT LPKF A proven suppler of production laser systems for 50 years – now essential to AI advanced 01 02 03 packaging 04 05 PROVEN SUPPLIER AI ADVANCED ACTIVE ACROSS ALL ENGAGED WITH POSITIONED FOR WITH LEADING PACKAGING IS GLASS APPLICATIONS TIER-1 CUSTOMERS GROWTH ON A MAR
Slide 4: An Established Supplier to Multiple Industries
AN ESTABLISHED SUPPLIER TO MULTIPLE INDUSTRIES Fifty years supplying production laser systems across four industries — and now advanced packaging 1976 Development #1 worldwide Circuit-board prototyping 1993 Electronics #1 ex-China Depaneling and SMT stencils 2000 Solar #1 worldwide Thin-film scribin
Slide 5: LPKF Product Offering
LPKF PRODUCT OFFERING The [EUR 1.7bn] 2030 market is priced on two systems already available for sale — NEXAR LIDE structuring and NEXAR Ablate ABF ablation FOCUS AREA TODAY'S CORE BUSINESS Advanced AI Packaging Development Electronics Solar Welding Initial systems already shipping; Circuit-board pr
Slide 6: Why AI Advanced Packaging Is Moving to Glass Substrates
WHY AI ADVANCED PACKAGING IS MOVING TO GLASS SUBSTRATES LPKF Laser & Electronics SE Proprietary & Confidential
Slide 7: LPKF Owns the Enabling Process for the Shift to Glass
LPKF OWNS THE ENABLING PROCESS FOR THE SHIFT TO GLASS AI is changing advanced packaging and moving it to 600 TWh glass substrates AI data centre energy consumption in 2026, of which c.16% is substrate-induced loss1 1 30-80% 2 Existing substrates are reaching their physical limits and glass is becomi
Slide 8: AI Is Forcing a Structural Shift in Chip Packaging
1 AI IS FORCING A STRUCTURAL SHIFT IN CHIP PACKAGING… Compute now comes from how dies are assembled, not from shrinking the transistor 1 More compute per package/Tighter substrates 2 Optics moves inside Laser Structuring with NEXAR LIDE 5000, Waveguide writing with NEXAR Write 5000 (on Roadmap) RDL
Slide 9: …With the Packaging Market Revised Upwards
1 …WITH THE PACKAGING MARKET REVISED UPWARDS Compute gains now come from packaging COMPUTE PERFORMANCE, INDEXED TO 2011 (SPEED x DENSITY)1 HIGH-END PERFORMANCE PACKAGING REVENUE (US$bn)2 300 30 250 25 200 20 150 15 100 10 50 5 0 2011 2020 2022 2025 2027 0 Front end only Advanced packaging '20 '21 '2
Slide 10: Existing Substrates Are Reaching Their Limits
2 EXISTING SUBSTRATES ARE REACHING THEIR LIMITS… Every substrate generation has been replaced when it stopped scaling — organic is at that point now BGA Flip Chip 2.5 D 2.5 D + Glass Co-Packaged Optics technology Packaging 1960 1980 1990 2000 2010 2020 2030 2040 technology Substrate Lead- Ceramic Or
Slide 11: …Breaking on Size, Speed and Cost
2 …BREAKING ON SIZE, SPEED AND COST… Three separate physical limits, all reached at once — and glass is the only material that answers all three SIZE SPEED COST Reticle-scale c.16% Costly at large area AI packages are now reticle-scale and of AI data centre power is lost in the Silicon interposers p
Slide 12: …Enabling Glass to Become the Critical Technology
2 …ENABLING GLASS TO BECOME THE CRITICAL TECHNOLOGY Same three constraints, answered by one material change ORGANIC TODAY GLASS PACKAGE SIZE Near-zero warpage Warps as area grows — flatness, not wiring, sets the yield limit Panel-level processing to 600 x 600 mm with flatness under 2 µm BANDWIDTH 1:
Slide 13: The Industry Has Already Committed…
2 THE INDUSTRY HAS ALREADY COMMITTED… Patent filings to 2024 — the 2025 number is not yet available — and the names filing are the largest packaging players in the industry GLASS SUBSTRATE PATENT PUBLICATIONS (NEW APPLICATIONS PER YEAR)1 450 400 350 300 250 200 150 100 50 0 10 11 12 13 14 15 16 17 1
Slide 14: …With Recent Announcements From Major Players
2 …WITH RECENT ANNOUNCEMENTS FROM MAJOR PLAYERS 2 July 2026 16 December 2025 22 January 2026 3 February 2026 Seoul Economic Daily TOPPAN INC. TechPowerUp news Samsung Electro-Mechanics Sets Up Glass TOPPAN to Install Pilot Line for Advanced Intel Unveils Glass Core Substrate with EMIB Samsung Report
Slide 15: LPKF Supplies Two of the Three New Process Steps
2 LPKF SUPPLIES TWO OF THE THREE NEW PROCESS STEPS A glass core line needs three new process steps that a legacy line does not have LPKF STEP LPKF STEP Through Hole Formation Metallization RDL Buildup Substrate Singulation Substrate Legacy IC Laser Ablation Via Plating Abrasive Cutting 2 of 3 NEW Ex
Slide 16: TAM for LIDE Solutions Expands Significantly With AI
3 TAM FOR LIDE SOLUTIONS EXPANDS SIGNIFICANTLY WITH THE ACCELERATION OF AI… AI-driven growth in HPC materially broadens the addressable market for LIDE solutions In million EUR 228 ESTIMATED TAM FOR 2030 100 EUR 1.7 BILLION Future estimated growth by new Advanced Packaging products 1.400 LIDE TGV GC
Slide 17: LPKF Is Positioned to Supply a Very Large Market Opportunity
3 … AND LPKF IS POSITIONED TO SUPPLY A VERY LARGE MARKET OPPORTUNITY Four products on the roadmap, three already commercial — each on a dated path to high volume 2025 2026 2027 2028 2029 2030 Laser Structuring Positioning Ramp-up High-Volume RDL Ablation Positioning Ramp-up High-Volume Laser Bonding
Slide 18: LPKF Already Leads the Glass Substrate Value Chain
4 LPKF ALREADY LEADS THE GLASS SUBSTRATE VALUE CHAIN… A dominating win rate across every key customer engagement, excluding local Chinese players (USA) (USA) (KOR) (USA) (USA) OEM (USA) (USA) (USA) (TWN) (CHN) Player 1 (KOR) Player 4 (USA) IC SUBSTRATE Player 2 (EU) Player 5 (KOR) Player 14 (JPN) BU
Slide 19: A Lead That Compounds Rather Than Erodes
4 …A LEAD THAT COMPOUNDS RATHER THAN ERODES Process maturity, market leadership and process-level IP give LPKF an unmatched position THE PROCESS IS THE TECHNOLOGY, AND IT IS VISIBLE IN THE GLASS 1:50 via aspect ratio at production throughput — the only cost- effective process for defect-free glass m
Slide 20: It Is Protected and Qualified…
4 IT IS PROTECTED AND QUALIFIED… A patent on the process itself, a multi-year qualification cycle, and LPKF's own glass foundry PATENTED QUALIFIED OPERATED IN-HOUSE The process, not the tool Multi-year R&D and qualification effort LPKF's own glass foundry Core LIDE process patent — the most valuable
Slide 21: …On One Platform That Scales From Pilot to Volume
4 …ON ONE PLATFORM THAT SCALES FROM PILOT TO VOLUME Process parameters developed at R&D transfer straight into production — only the automation level changes THREE PROCESS FAMILIES NEXAR LIDE NEXAR ABLATE NEXAR BOND Forms the vias Removes the RDL Bonds glass to glass 5 µm via diameter, aspect ratios
Slide 22: Key Customer Win
4 KEY CUSTOMER WIN A customer that already runs LPKF equipment has selected the Company for its first production ramp ANNOUNCEMENT Leading Asian advanced semiconductor packaging manufacturer selects LPKF’s glass processing equipment for production ramp-up Corporate News — 23 September 2026 WHAT WAS
Slide 23: Operations and Scale-Out
OPERATIONS AND SCALE-OUT LPKF Laser & Electronics SE Proprietary & Confidential
Slide 24: LPKF Manufacturing Footprint
LPKF MANUFACTURING FOOTPRINT Fürth production closed and Suhl ramped — the footprint was consolidated before the ramp, not during it Global Footprint Active in 60 + countries 8 subsidiaries in Europe, Asia and North America Suhl | Germany Garbsen | Germany Tualatin (OR) | USA Fürth | Germany Seoul |
Slide 25: LPKF Already Has the Infrastructure to Scale
LPKF ALREADY HAS THE INFRASTRUCTURE TO SCALE Capex-light assembly, production reconfigured ahead of the ramp, LPKF's own glass foundry and service where LPKF customers build Capex-light assembly Production already reconfigured LPKF's own glass foundry Service wherever the fabs are LPKF integrates la
Slide 26: Current Financial Update
CURRENT FINANCIAL UPDATE LPKF Laser & Electronics SE Proprietary & Confidential
Slide 27: Revised 2026 Guidance and Mid-Term Aspiration
5. Financials & Outlook REVISED 2026 GUIDANCE AND MID-TERM ASPIRATION MID-TERM ASPIRATION ACTUALS REVISED GUIDANCE The Management Board aims to achieve a sustainable double- 2025 FY 2026 digit EBIT margin for the group by 2028 • Semiconductor Market: Strong strategic positioning with Revenue: Revenu
Slide 28: North Star Update
NORTH STAR UPDATE North Star was structured in Wave 1 and Wave 2 with the overall target to reach double digit EBIT Wave 1: Urgent, fast track cost savings Wave 2: LPKF fundamentals, improvement in efficiency focus on operational processes and product development excellence Wave 1 Wave 2 Defined Mea
Slide 29: LPKF's Ambition
LPKF'S AMBITION Double-digit EBIT margin by 2028, with the cost base already reset PIONEERING WITH A FOCUS ON LARGE VOLUME AI GROWTH MARKETS • A pioneering spirit is in LPKF's genes. Through creativity, perseverance and a passion for innovation, LPKF has repeatedly opened up new markets and gained l
Slide 30: Core Business Deep Dive
Appendix CORE BUSINESS DEEP DIVE LPKF Laser & Electronics SE Proprietary & Confidential
Slide 31: Development: Market Leader With 50 Years of Experience
DEVELOPMENT: MARKET LEADER WITH 50 YEARS OF EXPERIENCE MARKET OFFERING REVENUE ADJ. EBIT Provides in-house solutions for Rapid PCB Prototyping, without wet chemistry 27,1 Mio. 2025 1,3 Mio. 2025 26,2 Mio. 2024 0,9 Mio. 2024 Develops and sells mechanical and laser-based 29,0 Mio. 2023 3,1 Mio. 2023 s
Slide 32: Electronics: SMT Solutions
ELECTRONICS: SMT SOLUTIONS – RAISING PRODUCTIVITY AND QUALITY IN ELECTRONICS MANUFACTURING MARKET OFFERING REVENUE ADJ. EBIT Bundles laser solutions for series production of electronic modules, focusing on SMT processes 35,9 Mio. 20251 -2,6 Mio. 20251 in high-Volume Manufacturing. 36,9 Mio. 20241 -0
Slide 33: Welding: Clean, Precise Plastic Joining
WELDING: CLEAN, PRECISE PLASTIC JOINING FOR HIGH- PERFORMANCE APPLICATIONS MARKET OFFERING REVENUE ADJ. EBIT Provides turnkey laser plastic welding solutions for joining components precisely, cleanly and 24,0 Mio. 2025 0,5 Mio. 2025 without additional chemicals or particles 18,6 Mio. 2024 -4,8 Mio.
Slide 34: Solar: Enabling Next-Generation Thin-Film and Perovskite Solar Manufacturing
SOLAR: ENABLING NEXT-GENERATION THIN-FILM AND PEROVSKITE SOLAR MANUFACTURING MARKET OFFERING REVENUE ADJ. EBIT Develops and manufactures laser systems to structure thin-film solar cells on large 28,3 Mio. 2025 1,6 Mio. 2025 glass substrates with high precision 41,2 Mio. 2024 5,7 Mio. 2024 39,5 Mio.
Slide 35: Disclaimer
DISCLAIMER • This presentation is intended exclusively for the purpose of providing information to the respective recipient • Use for personal purposes, publication, duplication and/or forwarding the presentation and its contents is permissible only with the written consent from LPKF Laser & Electro
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