Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Infineon Tech — Q3 2025 Earnings Presentation

96 slides from Infineon Technologies's earnings presentation, Aug 5, 2025

  1. Slide 1: Third Quarter FY 2025 Quarterly Update

    Third Quarter FY 2025 Quarterly Update Infineon Technologies AG Investor Relations 1

  2. Slide 2: Infineon at a glance

    Infineon at a glance Addressing long-term high-growth trends FY24 revenue by segment Automotive (ATV) 10% Green Industrial Power (GIP) 21% Power & Sensor Systems (PSS) 56% Connected Secure Systems (CSS) Energy Mobility IoT 13% green and efficient clean and safe smart and secure Financials FY24 reven

  3. Slide 3: Well-balanced portfolio among segments and key applications

    Well-balanced portfolio among segments and key applications, highest growth coming from Decarbonization and Digitalization FY24 revenue of €14,955m by segment and key application CSS E-mobility Other 10% 16% 20% Renewables BPA/Power Tools 7% 1% PSS 21% Automation & Drives 4% ATV 7% Software- 5% 56%

  4. Slide 4: Infineon is a global player, clear #1 in power semiconductors and automotive

    Infineon is a global player, clear #1 in power semiconductors, Automotive semis and automotive microcontroller markets Power discretes and modules Automotive semiconductors 2024 total global market: $32.3bn1 2024 total market: $68.4bn2 Infineon 17.7% Infineon 13.5% NXP 10.5% onsemi 8.7% STMicro 8.8%

  5. Slide 5: Our Target Operating Model

    Our Target Operating Model: committing to ambitious financial goals and being the sustainability leader Target Operating Model through cycle Revenue growth >10% Segment Result Margin 25% Adj. Free Cash Flow Margin1 10-15% Sustainability leader CO2 neutrality 2030 1 Excluding major frontend buildings

  6. Slide 6: Modular investment approach allows ramp-up in line with market demand

    Modular investment approach allows ramp-up in line with market demand to ensure long-term value creation Infineon investments1 FY 23-25 [EUR m] -27% ~3.000 ~2.700 ~2.200 Strategic investments – shell construction ‒ Dresden M4 Capacity investments – key growth areas ‒ SiC/GaN: transition to 200 mm/30

  7. Slide 7: Outlook for Q4 FY25 and FY25

    Outlook for Q4 FY25 and FY25 Outlook Outlook Q4 FY251 FY251 Revenue ~€3.9bn ~€14.6bn Adj. Gross Margin at least 40% Segment Result Margin high-teens % high-teens % FCF ~€1.0bn / ~€-1.2bn2 Adj. FCF ~€1.7bn Investments ~€2.2bn D&A ~€1.9bn3 1 Based on an assumed average exchange rate of $1.15 for €1.00

  8. Slide 8: Undisputed power systems leadership mastering all three key materials

    Undisputed power systems leadership mastering all three key materials Reliable multi sourcing Application of raw materials Si/SiC/GaN understanding Packaging know-how and World-scale fabs hybridization competence Controller Driver IC Power switch Software + Algorithms Leadership in Power Systems acr

  9. Slide 9: Infineon is the leader across all power semiconductor technologies

    Infineon is the leader across all power semiconductor technologies – unparalleled portfolio and know-how World’s thinnest silicon power World’s most competitive World’s first 300 mm wafer with 20 µm on 300 mm 200 mm silicon carbide power fab gallium nitride power wafer ‒ Broadest Si-power portfolio

  10. Slide 10: Infineon presents the world's thinnest silicon power wafer

    Infineon presents the world’s thinnest silicon power wafer paving the way for more energy efficient power systems Infineon reduces wafer thickness from 40 µm to 20 µm [µm] 180 ‒ Infineon pioneers 20 µm process at high-scale production 160 ‒ Halving thickness also 140 halves resistance, reducing powe

  11. Slide 11: With opening Kulim 3, Infineon on track to most competitive SiC provider

    With opening Kulim 3, Infineon is on track to becoming the industry's most competitive provider of SiC technology SiC raw material supplier network ‒ More than 6 qualified SiC wafer and boule suppliers ‒ Globally diversified and resilient Superior trench technology ‒ 30% more chips per wafer than pl

  12. Slide 12: Smart phase-over and ramp-up of 200mm volume production with SiC

    Smart phase-over and ramp-up of 200mm volume production to enable next level of innovation for customer value with SiC Villach Kulim CoolSiC 200 mm Pilot projects on track Smart 200 mm phase-over Timeline ‒ Qualification on selected ‒ Volume production in Villach ‒ Product roll-out based on high-vol

  13. Slide 13: Infineon is a leader in GaN technology

    Infineon is a leader in GaN technology and can build on the industry’s broadest IP portfolio and application expertise Leading GaN product Broadest IP portfolio MV and HV portfolio in the market applications (~350 patent families) World’s first 300 mm GaN manufacturing Leadership process strengthens

  14. Slide 14: Transition to WBG differs by application

    Transition to WBG vastly differs by application with Si expected to remain technology of choice for many of them 2020 2030 xEV High power EV Charging SiC with advantage in high power switching Energy Solar Storage performance and power density Systems On-board Charger GaN superior switching performa

  15. Slide 15: Infineon at the core of IoT

    Infineon at the core of IoT – driving digitalization by serving strongly growing multi-application markets Consumer IoT Industrial IoT Automotive IoT Products: MCU – Connectivity (Wi-Fi, BLE, NFC) – Sensors – Security – Power supply & switches Coin cell- at the core o Battery- powered ineon f Io Pow

  16. Slide 16: ESG: Targets and achievements

    ESG: Targets and achievements 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 16

  17. Slide 17: SBTi has approved our CO2 emission reduction targets

    Important milestone achieved: The Science Based Targets initiative (SBTi) has approved our CO2 emission reduction targets SBTi validation of Infineon’s 2030 CO2 reduction targets marks a major step in our decarbonization journey − Scope 1 and 2 targets align with the Paris Agreement, limiting global

  18. Slide 18: Our 2030 carbon neutrality goal is aligned with the Paris Agreement

    Our 2030 carbon neutrality goal is aligned with the Paris Climate Agreement’s 1.5°C target CO2 burden1 CO2 savings2 2.9 million tons of CO2 equivalents 130 million tons of CO2 equivalents Ratio ~1:45 On the road to carbon neutrality3 we achieved Infineon’s CO2 target3 by 2025 and 2030 significant mi

  19. Slide 19: External recognitions confirm our engagement in sustainability

    External recognitions confirm our engagement in contributing to a sustainable society Rating/Score Scale Date MSCI ESG AAA CCC to AAA 05/2025 B climate scoring CDP F to A 02/2025 B water scoring Ecovadis 99th percentile “Platinum” award 0 to 100 06/2024 Dow Jones Sustainability Index 76 Dow Jones Su

  20. Slide 20: Automotive

    Automotive 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 20

  21. Slide 21: ATV at a glance

    ATV at a glance ATV revenue and Segment Result Margin FY24 revenue split by product group [EUR m] CAGR 24% (FY20 – FY24) power (discretes, 8,242 8,423 modules) control & connectivity 6,516 4,841 3,521 29% 26% 23% 16% 4% Revenue Segment result margin analog & sensors Key customers 2025-08-05 Copyrigh

  22. Slide 22: Shift of EV growth and lower momentum of car production

    Shift of EV growth and lower momentum of car production Applications Market outlook for CY25 ‒ In CY25 car demand is assumed to be flattish. However, tariffs and trade tensions pose a risk for additional volume loss. Automotive ‒ While LV production in China is forecasted to increase, North America

  23. Slide 23: Top market position built on system competence

    Infineon’s top market position is built on system competence based on an industry-leading product portfolio Automotive semiconductors (2024 total market: $68,382m; -1.2% y-y) Infineon’s 2024 market share and position by region 17.7% Infineon 13.5% 13.5% 14.1% 13.9% 13.2% NXP 10.5% 10.4% STMicro 8.8%

  24. Slide 24: Strong content growth drivers in xEV and software-defined vehicles

    Several strong content growth drivers for Infineon in xEV and software-defined vehicles, even at flat LV production Structural trends fueling our growth Overview of growth vectors until 2030 2024 2030 xEV ‒ Strong volume growth of BEVs and PHEVs Share of xEVs ‒ Increasing share of SiC in traction in

  25. Slide 25: World leader in automotive semis benefiting from content growth

    Infineon is the world leader in automotive semis, serving all key applications and benefiting strongly from content growth Average semiconductor bill-of-material per car in 2024 and 2030 Semiconductors covered by Infineon Drivetrain applications: ~$1,650 per BEV (up to ~$2,500 for high-end car) ‒ Tr

  26. Slide 26: Broad portfolio with >300 product families

    A very broad portfolio with >300 product families is backing the market leadership of Infineon in Automotive Infineon ATV division revenue by product families: ... Major categories1: AURIX families, CoolSiC , IGBT 750V, IGBT 1200V, MOSFETs, PROFET , Radar, TRAVEO – none more than ~10% Unmatched cust

  27. Slide 27: Number of power MOSFETs per car continues to increase

    Number of power MOSFETs per car continues to increase, and drives accelerated growth for the leading portfolio Examples of MOSFET applications Latest portfolio with constant innovation Technologies, packages and voltages OptiMOS 7 40 V Power door Power Brake Electric power BMS Transmission Windshiel

  28. Slide 28: Active suspension system developed by ClearMotion

    Outstanding electrical characteristics of Infineon products drive innovations, e.g. most advanced active suspension system World-class active suspension system developed by ClearMotion ‒ Designed for 48-Volt high-current application ‒ Currently featured exclusively in luxury vehicles ‒ Referred as “

  29. Slide 29: Electromobility

    Electromobility 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 29

  30. Slide 30: xEV is a strong content growth driver for Infineon

    xEV is a strong content growth driver for Infineon, even at flat LV production Power semi content per vehicle for drivetrain only Infineon’s power semiconductor offering $600 ‒ Only player offering Si, SiC and GaN $400 ‒ Addressing traction inverter, OBC, DC-DC converter, BMS, aux. ‒ Fusion modules

  31. Slide 31: Several design-wins at BYD

    Several design-wins at BYD for MCUs, PMICs, MOSFETs and sensors covering zone control units and steering applications Supporting the latest car models of China’s #1 NEV OEM with our broad range of leading semiconductors AURIX MCUs Voltage regulators OptiMOS 7 MOSFETs TRAVEO MCUs PROFET family TMR-ba

  32. Slide 32: Broad product portfolio and system understanding

    Infineon’s broad product portfolio and system understanding enable higher BoM and allows for compact designs and fast T2M Infineon inverter reference design, covering up to 95% of value P2S (product-to-system approach) ‒ Reference design for up to 300 kW, further customization possible OPTIREG 32-bi

  33. Slide 33: Unmatched portfolio breadth leads to accelerated growth in SiC

    Competitive setup, unmatched portfolio breadth and our worldwide customer base lead to accelerated growth in SiC Leading SiC technology and production efficiency Most scalable SiC auto portfolio 650 V 750 V 1,200 V ‒ Unrivaled productivity with most competitive fab and most diversified supplier netw

  34. Slide 34: AURIX TC4x brings AI-on-the-edge to the battery

    Infineon AURIX TC4x with integrated PPU brings AI-on-the-edge to the battery AURIX TC4x Efficient battery cell utilization Battery cost ‒ Higher capacity PPU ‒ Less cells Battery health (parallel processing unit) ‒ Lower battery cost Faster charging High computing performance with complex Charging s

  35. Slide 35: Software-defined vehicle

    Software-defined vehicle 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 35

  36. Slide 36: Software-defined vehicles enabled by computing, networks and power distribution

    Software-defined vehicles are enabled by safe/secure computing, high-speed in-vehicle networks, and intelligent power distribution new features in monetization of safety and security functions & data Advantages of standardization of new features in comfort, software-defined components connectivity a

  37. Slide 37: Opportunity to strengthen number one position in automotive MCUs

    A unique opportunity to further strengthen our number one position in automotive MCUs and boost system capabilities #1 automotive semiconductor company #1 automotive Ethernet leader and with complete portfolio global leader in automotive MCUs for in-vehicle network Automotive Ethernet business owned

  38. Slide 38: Marvell is the automotive Ethernet leader

    Marvell is the automotive Ethernet leader with complete portfolio of PHYs, bridges and switches for in-vehicle network Strong global presence at 8 of 10 top OEMs and all major Tier 1s Brightlane product focus #1 market position based on long history of dedicated R&D Brightlane – key products: in aut

  39. Slide 39: Ethernet capabilities allow larger scope in SDVs

    Ethernet capabilities allow for larger scope in SDVs, higher BoM, faster T2M for customers – strongly supporting our P2S play Components of hierarchical E/E architectures: Key benefits of the transaction for Infineon: ‒ Strengthens Infineon’s market-leading MCU business and enhances offerings for zo

  40. Slide 40: Compelling financial profile of the acquisition

    Compelling financial profile of the acquisition: highly accretive to ATV and supporting profitable growth of Infineon Key benefits of the transaction – highly accretive to ATV: Revenue synergies enabled by Standalone 2025e revenue: Gross margin: ~60% reach and cost synergies by scale $225m to $250m

  41. Slide 41: AURIX family matches requirements in high-end applications

    The Infineon AURIX family matches ideally all requirements in today’s high-end applications Map of application complexity and latency requirements AURIX without PPU AURIX with PPU real-time edge AI trajectory control Requirements on real-time and latency and planning sensor fusion for AD L2+ AURIX i

  42. Slide 42: PROFET smart switches replacing physical fuses

    Infineon PROFET , the semiconductor-based smart switches, are replacing physical fuses in modern zonal E/E architectures With smart switches, referred to as ‘eFuses’, the power distribution (= electrical energy supply from the battery to the load) is digitized and supports more complex functions in

  43. Slide 43: Smart semiconductors in power distribution key enabler for SDV

    Smart semiconductors in power distribution systems is key enabler for SDV while ensuring high availability and resilience Infineon PROFET Wire Guard enables SDV Relay replacement Switch PROFET Wire Guard Fuse Iso 26262 replacement Protect compliant Load status Fast failure isolation Diagnose (< 500

  44. Slide 44: PROFET family in next-generation E/E architecture platforms

    Infineon PROFET family – analog semiconductors used in premium OEMs’ next-generation E/E architecture platforms On average >€100 BoM from PROFET family per vehicle: ‒ PROFETTM +2 ‒ Short-circuit detection several milliseconds earlier than fuses → peak current capped ‒ Power PROFET → cross section of

  45. Slide 45: 48 V enables higher power demand features

    48 V enables higher power demand features for future E/E architectures and automated driving Demand of in-vehicle loads is sharply increasing and requires 48 V architectures LED Lighting Cooling fan LED Lighting ‒ More high-power applications and the introduction of zonal E/E architectures Brake Blo

  46. Slide 46: Growth of L1/L2/L2+ main driver of ADAS semiconductor content

    Growth of L1/L2/L2+ is the main driver of ADAS semiconductor content until 2030 Car production by degree of automation (SAE level) Radar is essential to meet decisive requirements of ADAS/AD Distance L0 5 4,5 4 L0 3,5 Lane Detection Speed 3 2,5 L1 2 1,5 1 0,5 0 L1/L2/L2+ Traffic signs Angle L1 to re

  47. Slide 47: Green Industrial Power

    Green Industrial Power 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 47

  48. Slide 48: GIP at a glance

    Gate driver ICs GIP revenue and Segment Result Margin FY24 revenue split by product group [EUR m] CAGR 8% power (FY20 – FY24) (discretes) 2,205 1,934 1,790 1,542 1,406 30% 22% Gate driver ICs1 18% 18% 21% power (modules) Revenue Segment result margin 1 Gate driver ICs, currently allocated to the Gre

  49. Slide 49: Cautious signs of improving sentiment in GIP market outlook

    Cautious signs of improving sentiment, structural drivers lift GIP market outlook; growth in Power Infrastructure and Transportation Applications % of FY24 segment revenue Market outlook for CY25 ~30% ‒ While value chain inventories improve, price pressure persists and limits growth. However PV inst

  50. Slide 50: Huge potential along entire green energy chain until 2030

    Huge potential along entire green energy chain until 2030 according to IEA Net Zero scenario Generation Infrastructure Consumption $600bn annual Photovoltaic +4,600 GW Grid network Heat pump +420m units investments +200k FC EV Wind power +1,900 GW Grid storage +900 GW H2 Fuel cell1 +200k FC Trucks +

  51. Slide 51: Green energy generation provides large business opportunities

    Green energy generation provides large business opportunities Power semiconductor content by application 6000 [EUR per MW] [EUR per installation] Mainly SiC 5000 5000 5000 Mainly IGBT 4000 3500 3500 3000 2000 2000 2500 2000 1000 1500 1000 0 60 600 500 0 0 100 40 Fossil, nuclear, Wind Solar Grid-scal

  52. Slide 52: EV charging is a key strategic application

    EV charging is a key strategic application for Infineon We cover the full ecosystem from AC to high power DC charging Connectivity solutions Automotive systems High power industrial systems Wirless Charging DC High Power Charging Infineon targets the complete EV charging ecosystem from AC to high-po

  53. Slide 53: Power & Sensor Systems

    Power & Sensor Systems 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 53

  54. Slide 54: PSS at a glance

    PSS at a glance PSS revenue and Segment Result Margin FY24 revenue split by product group [EUR m] control & connectivity CAGR 4% (FY20 – FY24) 4,070 3,798 3,268 3,088 2,650 25% 28% power (discretes, 23% modules) 11% 24% analog & sensors Revenue Segment result margin Key customers 2025-08-05 Copyrigh

  55. Slide 55: Improving visibility in end-markets in CY25

    Improving visibility end-markets in CY25; upside potential driven by improving macro conditions and AI Applications % of FY24 segment revenue1 Market outlook for CY25 ~20% ‒ Server AI strength to continue in CY25 and will be complemented by cloud computing growth. Computing ‒ PC market is expected t

  56. Slide 56: AI will be a strong driver of server business revenue

    AI will be a strong driver of revenue increase for Infineon’s server business Large North American CPU/GPU manufacturer B In FY25 AI revenue Infineon AI server revenue Large North Further major platform win with leading North in our server business Large North American cloud American CPU/GPU provide

  57. Slide 57: Serving all AI-related power conversion from grid-to-core

    With its energy efficient power semiconductors Infineon is serving all AI-related power conversion from grid-to-core Power delivery network losses in an average AI data center AC/DC 277 V AC – 48 V DC DC/DC 48 V – 12 V DC/DC 12 V – 1 V 1  AC 277 V 42 – 54 V . PFC 48 V/ 12V→5V 48V→12V . 12 V 208 AC

  58. Slide 58: We power AI – today and in the future

    We power AI – today and in the future Architectural evolution beyond 250kW, and up to 1MW per rack 1 Today 2 2027+ 3 2029+ PSUs within server rack 3-Ф HVDC Power Sidecar Hybrid microgrid <250kW/rack ~500kW+/Rack 1MW/Rack IT payload Power delivery Power delivery & IT payload Power delivery IT payload

  59. Slide 59: Infineon and NVIDIA collaboration

    Infineon and NVIDIA collaboration Future GW-scale data center architecture with centralized power generation using fewest power conversion stages Infrastructure Hall Row / IT rack Serverboard 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 59

  60. Slide 60: Infineon BOM per AI server rack

    Leading performance high density AI Server for accelerated compute – Infineon BOM per AI server rack up to between $12k and $15k Top of rack switches x1 $200-215 PSU (Power Supply Unit) x24 ~$120 x36 GPU Board (2 GPU + 1 CPU) Compute Tray ~$130 x10 Power x18 48 V Bus Switch Tray Delivery Converter x

  61. Slide 61: State-of-the-art PSU solutions for AC/DC

    Infineon is tackling the rising power requirements of AI systems with its state-of-the-art PSU solutions for AC/DC Power Supply Unit (PSU) solutions ranging from 3 kW to 12 kW and beyond >12 kW 3-phase 12 kW η ~97,5% 8 kW 113 W/in3 η ~97,5% 1-phase 3.3 kW 100 W/in3 η 97,4% 1-phase 3 kW 98 W/in3 η 97

  62. Slide 62: Addressing the challenge of increasing battery cells

    Addressing the Challenge of Increasing Battery Cells with innovative solutions for High Power Density BBU Module Functions 1. Converter Power Density to enable more battery cells per BBU 2. Protect AI servers from power fluctuations (peak power shaving) 3. Prevents data loss and system downtime 4. E

  63. Slide 63: OptiMOS 6 80 V MOSFET in DC-DC converter

    OptiMOS 6 80 V MOSFET in DC-DC converter sets new benchmark for AI server power efficiency in leading AI server platform Key Facts Package Applications Optimized for 48 V IBCs Offers optimized switching performance in hard switching topologies Efficiency increase of around 0.4% compared to previousl

  64. Slide 64: Evolution of power modules doubling power density

    Evolution of power modules by doubling power density with smaller form factors Dual-Phase power Dual-Phase power Quad-Phase power TDM2354xD, TDM2254xD TDM2354xT TDM24545S Discrete Chip Embedded Powerstage Substrate Chip Embedded Powerstage Substrate Chip Embedded Powerstage 3x die embedded 6x die em

  65. Slide 65: Vertical power delivery reduces power losses in AI data centers

    Vertical power delivery reduces power losses in AI data centers Why backside mounting of our ultra-high current density power module? ~85% Reduction of power delivery network losses compared to lateral “down” solution ~55% Reduction in size compared to lateral “down” solution Vertical power delivery

  66. Slide 66: Sensor business in one organization

    Sensor business in one organization will create clear benefits for the customers as 3rd pillar besides Power & Embedded Control Infineon joins forces to become a leader in the sensor market PSS Business Unit SURF (Sensor Units & RF) Customer centricity Comprehensive portfolio Innovation-to-customer

  67. Slide 67: Connected Secure Systems

    Connected Secure Systems 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 67

  68. Slide 68: CSS at a glance

    CSS at a glance CSS revenue and Segment Result Margin FY24 revenue split by product group [EUR m] CAGR 12% (FY20 – FY24) 2,046 1,822 1,397 1,506 974 21% 24% connectivity / security ICs 13% microcontroller 13% 12% Revenue Segment result margin Key customers 2025-08-05 Copyright © Infineon Technologie

  69. Slide 69: Outlook for CY25 influenced by macro uncertainties

    Outlook for CY25 influenced by continuing macro uncertainties and low consumer sentiment Applications % of FY24 segment revenue Market outlook for CY25 Industrial IoT Risks persist; potential recovery slowing down due to changing macro economic situation, including tariffs. Home Gradual improvement

  70. Slide 70: Essential building blocks: compute, connectivity, security, software

    Providing the essential building blocks compute, connectivity, security, and software Consumer Industrial Automotive Compute Software PSOC and XMC DEEPCRAFT Studio and micro-controllers allow ModusToolbox software customers to enable smart, simplifies and accelerates Sense Actuate connected products

  71. Slide 71: MCUs at the heart of every IoT and Edge AI application

    Infineon’s MCUs at the heart of every IoT and Edge AI application New compelling MCU platforms PSOC Edge – Enables a new generation of responsive machine learning devices PSOC PSOC PSOC Edge Control Connect − Broad application range in Edge AI, IoT, Consumer, and Industrial − Strength in low power,

  72. Slide 72: Software with maximal ease of use

    Software with maximal ease of use DEEPCRAFT Studio ModusToolbox − Infineon’s Edge AI development platform − Infineon’s modern, extensible − Data collection & pre- development system processing, model training, model conversion & − Collection of development deployment tools, libraries, and embedded r

  73. Slide 73: Broad wireless portfolio for IoT, industrial and automotive

    Enabling connectivity with Infineon’s broad wireless portfolio for IoT, industrial, and automotive applications Wireless connectivity portfolio & advancements in UWB Wi-Fi AIROC Bluetooth® AIROC − Comprehensive Portfolio: Wi-Fi 4,5,6/6E − Full-featured Bluetooth® portfolio and connected MCUs with So

  74. Slide 74: Comprehensive end-to-end embedded AI solution

    Infineon provides a comprehensive end-to-end embedded AI solution - CSS provides most essential building blocks Edge AI solution offering Customers‘ benefits Customer application − Software perfectly tailored to Infineon In-house AI Software hardware ensures peak performance DEEPCRAFT Studio and sim

  75. Slide 75: Trusted advisor for the PQC landscape

    Infineon is a trusted advisor for the PQC landscape with the rise of quantum computers leading to high security risks Computing power of quantum computers Infineon‘s Post-quantum cryptography approach Computing power First universal quantum Infineon is the first company to Infineon TEGRION product c

  76. Slide 76: Selected financial figures

    Selected financial figures 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 76

  77. Slide 77: Strong presence in all regions; balanced customer portfolio

    Strong presence in all regions; well-balanced customer portfolio; no customer represents more than 10% of total sales FY24 revenue by region Revenue by sales channel Distribution Top-10 direct customers1 partners1 Americas EMEA (excl. Germany) 13% 15% Japan Germany 10% 11% Top-10 direct Distribution

  78. Slide 78: Group financial performance

    Group financial performance Revenues and Segment Result USD exchange rate [EUR m] Segment Result Revenues Segment Result Margin Average revenue exchange rate +0% Q3 Q2 Q3 +3% FY24 FY25 FY25 3,919 ø USD/EUR 1.08 1.05 1.14 3,702 3,704 3,591 3,424 Order backlog1 [EUR bn] 22 19 20 20 18 19.8% 21.2% 18.0

  79. Slide 79: Automotive (ATV)

    Automotive (ATV) Revenues1 Segment Result1 [EUR m] Revenues [EUR m] Segment Result Segment Result Margin -3% +1% 1,927 1,969 1,870 1,858 1,752 498 510 385 371 343 25.8% 25.9% 19.6% 20.7% 19.8% ‒ Revenue slightly improved as customer destocking trends eased. ‒ Slight segment result decline due to cur

  80. Slide 80: Green Industrial Power (GIP)

    Green Industrial Power (GIP) Revenues Segment Result [EUR m] Revenues [EUR m] Segment Result Segment Result Margin -9% +9% 503 475 431 397 340 111 88 61 22.1% 38 18.5% 34 14.2% 10.0% 9.6% ‒ Revenue increase, double digit at constant currency, driven by normalizing inventories and growth in key appli

  81. Slide 81: Power & Sensor Systems (PSS)

    Power & Sensor Systems (PSS) Revenues1 Segment Result1 [EUR m] Revenues [EUR m] Segment Result Segment Result Margin +13% +8% 1,041 1,053 934 987 979 198 169 146 138 109 17.1% 18.8% 11.7% 14.0% 14.1% ‒ Revenue growth momentum driven by the strength of power solutions for AI servers. ‒ Segment result

  82. Slide 82: Connected Secure Systems (CSS)

    Connected Secure Systems (CSS) Revenues Segment Result [EUR m] Revenues [EUR m] Segment Result Segment Result Margin -5% -2% 406 366 356 349 344 62 42 40 39 30 15.3% 11.5% 8.7% 11.2% 11.2% ‒ Revenue decrease driven by adverse currency effects. ‒ Segment result margin stable. ‒ IoT and security marke

  83. Slide 83: Gross margin and Opex

    Gross margin and Opex Gross profit1 R&D1 SG&A [EUR m] [EUR m] [EUR m] 1,621 1,534 1,515 1,343 1,391 553 544 559 560 522 390 393 395 410 376 41.4% 41.4% 39.2% 38.7% 40.9% 14.9% 13.3% 15.9% 15.6% 15.1% 10.5% 10.0% 11.5% 10.5% 11.1% Gross margin as reported Gross profit as reported* R&D expenses as % o

  84. Slide 84: Investments, Depreciation & Amortization and Free Cash Flow

    Investments, Depreciation & Amortization and Free Cash Flow Investments Depreciation & Amortization Free Cash Flow [EUR m] [EUR m] [EUR m] 1,145 722 731 700 487 470 473 483 393 463 288 470 174 422 -237 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 84

  85. Slide 85: Working capital, in particular trade working capital components

    Working capital, in particular trade working capital components Working capital1 Inventories [EUR m] [EUR m] [days2] 3,477 3,464 3,424 3,716 4,429 3,990 4,385 4,333 4,280 2,946 184 190 177 156 176 Trade receivables Trade payables [EUR m] [days] [EUR m] [days2] 2,142 2,250 2,059 2,017 2,052 1,953 1,9

  86. Slide 86: Development of liquidity and debt

    Development of liquidity and debt Capital structure [EUR m] Gross Cash Gross Debt Net Cash/Debt 2,345 2,201 1,957 1,687 1,539 -4,811 -2,610 -5,386 -3,041 -4,943 -2,986 -5,516 -3,829 -4,984 -3,445 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 86

  87. Slide 87: Return on capital employed

    Return on capital employed Historical development 20.5% 16.6% 12.2% 12.6% 8.4% 8.5% 3.0% 2025-08-05 Copyright © Infineon Technologies AG 2025. All rights reserved. 87

  88. Slide 88: Earnings-per-share and total cash return

    Earnings-per-share and total cash return Development of earnings-per-share (EPS) from continuing operations [EUR cent] 43 49 31 29 33 34 37 18 18 22 EPS basic EPS adjusted Total cash return to shareholders via dividends [EUR m] 456 455 417 ‒ Dividend for 336 351 283 305 286 FY24: €0.35 per share 248

  89. Slide 89: Maturity profile

    Maturity profile Calendar years 2025 to 2033 [EUR m; USD m; nominal values] $350 €750 $350 €600 €750 €750 €650 €500 €400 $350 $235 $350 $250 2025 2026 2027 2028 2029 2030 2031 2032 2033 Corporate bonds under the EMTN program US PP 2016 Notes Hybrid bond1 US PP 2021 Notes (Jun 2027, (Jun 2026, Feb 20

  90. Slide 90: Conservative financial policy and investment-grade rating

    Conservative financial policy and strict commitment to investment-grade rating are the basis for through-cycle flexibility Financial Policy Targets Status Quo (LTM 30 June 2025) Gross Cash1 At least 10% of revenue3 11% of revenue → €1.5bn Gross Debt2 ≤ 2.0x EBITDA 1.4x EBITDA Comfortable ‒ Flexibili

  91. Slide 91: Cinfineon

    Cinfineon

  92. Slide 92: Disclaimer

    Disclaimer Disclaimer This presentation contains forward-looking statements and/or assessments about the business, financial condition performance and strategy of the Infineon Group. These statements and/or assessments are based on assumptions and management expectation resting upon currently availa

  93. Slide 93: Glossary

    Glossary AC alternating current IGBT insulated gate bipolar transistor ACC adaptive cruise control IoT internet of things AD automated driving IPM intelligent power module ADAS advanced driver assistance system LED light-emitting diode AEB autonomous emergency braking MCU microcontroller unit AI art

  94. Slide 94: Notes and ESG footnotes

    Notes and ESG footnotes Investments = 'Purchase of property, plant and equipment' + 'Purchase of intangible assets and other assets' incl. capitalization of R&D expenses Capital Employed = 'Total assets' – 'Cash and cash equivalents' – 'Financial investments' – 'Assets classified as held for sale –

  95. Slide 95: Financial calendar

    Financial calendar Date Event Location 25 – 26 August 2025 Jefferies Global Semiconductor, IT Hardware & Communications Technology Conference Chicago 28 August 2025 Deutsche Bank Technology Conference Dana Point, California 3 September 2025 Deutsche Bank Access European TMT Conference London 3 Septe

  96. Slide 96: Investor Relations contacts

    Investor Relations contacts Alexander Foltin Daniel Györy Executive Vice President Senior Director Finance, Treasury & Investor Relations Team lead Investor Relations +49 89 234-23766 +49 89 234-35078 alexander.foltin@infineon.com daniel.gyoery@infineon.com Isabell Diel Alexander Groschke Senior Man

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