Slide 1: Chipbond 2019 Q4
CHIPIBOND 2019 Q4
Slide 2: Founded in 1997
Founded in 1997 Capital: USD 200Mn Staff: 5000
Slide 3: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 4: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 5: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 6: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 7: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 8: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 9: Panel Industry
PANEL INDUSTRY All Panels uses Driver ICs 100% of Driver IC use Gold Bumping No exceptions
Slide 10: Supply Chain
SUPPLY CHAIN Design House Foundry Packaging Panel Maker LCM
Slide 11: Global Capacity
GLOBAL CAPACITY Chipbond LB Semicon 48% |6% Nepes Others 9%
Slide 12: Competitive Strength
COMPETITIVE STRENGTH Equipment design capability - Much lower equipment cost - Better understanding of process Dominating market share - Price bargaining power - ASP stability
Slide 13: Product offering by application
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v Film v
Slide 14: Slide 14
Slide 15: LCD, Rigid OLED, Flex OLED packaging types
LCD COG COF Rigid OLED COG COF Flex OLED COP COF / COP
Slide 16: COP Demand
COP Demand = COP Demand Source: IHS Markit
Slide 17: LTPS LCD and AMOLED COF Demand
100 it) ™LTPS LCD COF Demand ™AMOLED COF Demand Source: IHS Markit
Slide 18: Applications
APPLICATIONS Non Driver