Nanoveu Ltd. · ASX:NVU
Nanoveu — Ignite Investment Summit Hong Kong 2025
19 slides from Nanoveu's conference presentation, Oct 16, 2025
Slide 1: Ignite Investment Summit Hong Kong Presentation
Nanoveu Limited ACN 624 421 085 Level 45, 108 St Georges Terrace Perth WA, 6000 Australia +61 8 6244 9095 www.nanoveu.com ASX RELEASE 16 October 2025 ASX: NVU Ignite Investment Summit Hong Kong Presentation Nanoveu Limited (ASX: NVU, OTCQB: NNVUF) (“Nanoveu” or the “Company”), a technology innovator
Slide 2: IGNITE Investment Summit Presentation 2025
IGNITE Investment Summit Presentation 2025 www.nanoveu.com 1
Slide 3: Disclaimer
Disclaimer IMPORTANT INFORMATION These presentation materials and any accompanying verbal presentation (together, the Presentation Materials) have been prepared by Nanoveu Limited (Company, NVU, Nanoveu) as at 10 October 2025 and statements are current only as at that date. Information in the Presen
Slide 4: www.nanoveu.com
$0.120 $0.100 $0.080 $0.060 $0.040 $0.020 $- www.nanoveu.com 3 2
Slide 5: Board and Management
Board and Management Dr. David Pevcic Alfred Chong Executive Chairman Group CEO and Director • Experienced professional and investor in the resources and • Founder of Nanoveu, has 30+ years of technology sector experience in scaling companies and • Non-Executive Chairman at Battery Age Minerals Ltd
Slide 6: Semiconductor Leadership Team
Semiconductor Leadership Team Mark Goranson Dr. Mohamed Sabry Scott Smyser CEO of Semiconductor Technology CTO, Founder of EMASS VP, Sales & Marketing • VP of Global Ops, TE Connectivity • Associate Professor, NTU Singapore • EVP Marketing & BD, Si-Ware Systems • SVP of Fab Ops, ON Semi • Postdoc, S
Slide 7: EMASS Introduction
EMASS Introduction Fabless Semiconductor Innovator in Edge AI Processing • Ultra-low-power Edge AI SoCs for always-on intelligence in battery constrained devices • Flagship ECS-DoT chip up to 20x more energy efficient than peers • Usable across drones, wearables, IoT devices and other Edge AI applic
Slide 8: Semiconductor & SoC Market Opportunity
Semiconductor & SoC Market Opportunity System On Chip Market Size SoC Market Growth: Applications demanding continuous By Type 2020-2030 (USD Billion) sensing, context awareness, and real-time decision-making Source: Grand View Research © 2025 Nanoveu All Rights Reserved www.nanoveu.com 7
Slide 9: Revolutionising Edge AI
Revolutionising Edge AI Edge AI Opportunities Edge AI Solution Robust AI models require increased Executes AI inference directly at the computation power and battery sensor under 1 mW power Current chips are not designed for Provides up to 20x energy efficiency efficient edge AI use cases vs leading
Slide 10: Introducing the ECS-DoT
Introducing the ECS-DoT Superior Performance, Low Power, Small Form Factor © 2025 Nanoveu All Rights Reserved www.nanoveu.com 9
Slide 11: Redefining What's Possible in Ultra-Low-Power Edge AI
Redefining What’s Possible in Ultra-Low-Power Edge AI Fully Programmable System on Chip • Processor • AI engines • IPs for compressed AI Local decision-making at the Edge • Always-on AI Inference • Sensor Fusion • Support CNNs, ML, Data Processing etc. Key Architecture Features • <1 to 5 mW power co
Slide 12: Next Generation ECS-DoT
Next Generation ECS-DoT Tape-out of Advanced 16nm Architecture Built on TSMC’s 16nm Fin Field Effect Integrating Wireless Connectivity Transistor (FinFET) • Higher Perf. & Lower Power • Smaller Die Size • Production Ready Bluetooth 5.x + Wi-fi Lora for low-power, Bluetooth Mesh long-range (optional)
Slide 13: Exceptional AI Computation
Exceptional AI Computation 20X Lower Energy, Same Performance MLCommons, 2025 © 2025 Nanoveu All Rights Reserved www.nanoveu.com *MLCommons, 2025 12
Slide 14: ECS-DoT Differentiation
ECS-DoT Differentiation Full AI capability, true always-on operation Key Attribute ECS-DoT Typical Alternatives Compute Architecture RISC-V + Dual Deep Learning Accelerators General MCU, DSP, or fixed-function NNs Memory Architecture Fully on-chip (up to 8MB) — No external DRAM External DRAM often r
Slide 15: Target Edge AI Sectors
Target Edge AI Sectors Hearables IoT Sensory $USD 138.5B by 2029 $USD 168.69B by 2030 Source: Marketsandmarkets Source: Mordor Intelligence Wearables AR Glasses $USD 368.4B by 2035 $USD 8.26B by 2030 Source: Fact.MR Source: Grand View Reasearch AI Cameras Drones $USD 22.1B by 2028 $USD 223.66B by 20
Slide 16: ECS-DoT Achieves Major Drone Performance Gains
ECS-DoT Achieves Major Drone Performance Gains Drone Type Quadcopter Hexacopter Octocopter Graph • Agriculture • Industrial inspection • Consumer Use-cases • Enterprise • Logistics • Defense • Terrain Mapping • Professional Achieved up to 80% improvement in Delivered consistent flight endurance up P
Slide 17: Building Commercial Momentum
Building Commercial Momentum OEM Sales Network Buildout What Market Is Responding To: Ultra-low power AI inference • < 10 ms vs. 150-300 ms for competitors • Up to 20X lower energy consumption vs. competitors AI Model Portability • Supports a wide range of AI Models • Fast and easy development cycle
Slide 18: Upcoming Catalysts
Upcoming Catalysts 16nm Tape-out projected in Q4 Smaller with higher performance Increased AI Performance • ~200% smaller and 1.3x less power • Dynamic 1-16 bit precision with less power • Our highest performing ECS-DoT • Increased AI model support Ongoing OEM engagement for 22nm technology New Eval
Slide 19: Thank You
Thank You Head Office Singapore Office Level 45, 108 St Georges Terrace 20 Ayer Rajah Crescent Perth WA, 6000 Australia # 08-09 Singapore 139964 +61 8 6244 9095 www.nanoveu.com +65 6557 0155