Nanoveu Ltd. · ASX:NVU

Nanoveu — Pitt Street Research Semiconductor Conference 2026

27 slides from Nanoveu's conference presentation, Mar 25, 2026

  1. Slide 1: Pitt Street Research Semiconductor Conference Presentation

    Nanoveu Limited ACN 624 421 085 Level 45, 108 St Georges Terrace Perth WA, 6000 Australia +61 8 6244 9095 www.nanoveu.com ASX RELEASE 25 March 2025 ASX: NVU Pitt Street Research Semiconductor Conference Presentation Nanoveu Limited (ASX: NVU, OTCQB: NNVUF) (“Nanoveu” or the “Company”), a technology

  2. Slide 2: About Nanoveu Limited

    About Nanoveu Limited Further details on the Company can be found at https://nanoveu.com/. EMASS is a pioneering technology company specialising in the design and development of advanced systems-on-chip (SoC) solutions. These SoCs enable ultra-low-power, AI-driven processing for smart devices, IoT a

  3. Slide 3: Pitt Street Research Semiconductor Conference 2026

    Pitt Street Research Semiconductor Conference 2026 www.nanoveu.com 1

  4. Slide 4: Disclaimer

    Disclaimer IMPORTANT INFORMATION These presentation materials and any accompanying verbal presentation (together, the Presentation Materials) have been prepared by Nanoveu Limited (Company, NVU, Nanoveu) as at 23 March 2026 and statements are current only as at that date. Information in the Presenta

  5. Slide 5: www.nanoveu.com

    0.12 0.1 0.08 0.06 0.04 0.02 0 1. As at close 23 March ‘26. www.nanoveu.com 3 2

  6. Slide 6: Board and Management

    Board and Management Dr. David Pevcic Dr. Mohamed Sabry Alfred Chong Executive Chairman EMASS Founder and Director Group CEO and Director • Experienced professional and • Founder of Nanoveu, has 30+ years investor in the resources and • CTO, Founder of EMASS technology sector of experience in scalin

  7. Slide 7: Semiconductor Leadership Team

    Semiconductor Leadership Team Mark Goranson Dr. Mohamed Sabry Scott Smyser CEO of Semiconductor Technology CTO, Founder of EMASS VP, Sales & Marketing • VP of Global Ops, TE Connectivity • Associate Professor, NTU Singapore • EVP Marketing & BD, Si-Ware Systems • SVP of Fab Ops, ON Semi • Postdoc, S

  8. Slide 8: EMASS Introduction

    EMASS Introduction Fabless Semiconductor Innovator in Edge AI Processing • Ultra-low-power Edge AI SoCs for always-on intelligence in battery constrained devices • Flagship ECS-DoT chip up to 20x more energy efficient than peers • Usable across drones, wearables, IoT devices and other Edge AI applic

  9. Slide 9: Semiconductor & SoC Market Opportunity

    Semiconductor & SoC Market Opportunity System On Chip Market Size SoC Market Growth: Applications demanding continuous By Type 2020-2030 (USD Billion) sensing, context awareness, and real-time decision-making Source: Grand View Research © 2025 Nanoveu All Rights Reserved www.nanoveu.com 7

  10. Slide 10: Revolutionising Edge AI

    Revolutionising Edge AI Edge AI Opportunities EMASS Solution Robust AI models require increased Executes AI inference directly at the computation power and battery sensor under 1 mW power Current chips are not designed for Provides up to 20x energy efficiency efficient edge AI use cases vs leading c

  11. Slide 11: Target Edge AI Sectors

    Target Edge AI Sectors Hearables IoT Sensory $USD 138.5B by 2029 $USD 168.69B by 2030 Source: Marketsandmarkets Source: Mordor Intelligence Wearables AR Glasses $USD 368.4B by 2035 $USD 8.26B by 2030 Source: Fact.MR Source: Grand View Reasearch AI Cameras Drones $USD 22.1B by 2028 $USD 223.66B by 20

  12. Slide 12: Redefining What's Possible in Ultra-Low-Power Edge AI

    Redefining What’s Possible in Ultra-Low-Power Edge AI Fully Programmable System on Chip (SoC) • Processor • AI engines • IPs for compressed AI Local decision-making at the Edge • Always-on AI Inference • Sensor fusion • Support CNNs, ML, Data Processing, etc. Key Architecture Features • <1 to 5 mW p

  13. Slide 13: Exceptional AI Computation

    Exceptional AI Computation 20X Lower Energy 20X Lower Energy 20X Lower Energy MLCommons, 2025 © 2025 Nanoveu All Rights Reserved www.nanoveu.com 11

  14. Slide 14: Breakthrough in Drone Endurance

    Breakthrough in Drone Endurance Longer Flight Times AI Ready Platform Live Trials Underway +60% increase in flight time Enables onboard intelligence Bridging simulation to reality. without any hardware changes for mission-critical use cases Results expected in April 2026 • Precision Landing • Predic

  15. Slide 15: ECS-DoT Achieves Major Drone Performance Gains

    ECS-DoT Achieves Major Drone Performance Gains Drone Type Quadcopter Hexacopter Octocopter Graph • Agriculture • Industrial inspection • Consumer Use-cases • Enterprise • Logistics • Defense • Terrain Mapping • Professional Achieved up to 80% improvement in Delivered consistent flight endurance up P

  16. Slide 16: Live Drone Trials Update

    Live Drone Trials Update Status update: Live drone data log captured AI model trained with live drone data ECS-DoT Hardware integration with the drone Performing Hardware-in-the-loop testing with custom simulator provided by partner Expected live drone trials March end- April 2026 © 2025 Nanoveu All

  17. Slide 17: Next Generation ECS-DoT-16

    Next Generation ECS-DoT-16 Strengthening Leadership in Ultra-Low-Power Edge AI Enhancement Highlights Fully integrated New Adaptive Low Energy Bluetooth (BLE) Power Management Dedicated AI module for object detection Expanded on-chip memory Integrated Floating-Point Unit (FPU) © 2025 Nanoveu All Rig

  18. Slide 18: Next Generation ECS-DoT 16nm

    Next Generation ECS-DoT 16nm Enhancement Benefits Integrated Floating-Point Unit (FPU) Dedicated AI Acceleration Module for Object Detection • Accelerate DSP • YOLO (You Only Look Once)-Nano-class • Enable mixed-precision AI workflows architectures; • Improved developer experience • MobileNet-SSD st

  19. Slide 19: Award Winning SoC Performance

    Award Winning SoC Performance ECS-DoT won best in show for AI and Machine Learning • At two of the largest shows in the industry – CES & embedded world • Major accolades for innovative architecture and superior performance • Ultra-low-power, RISC-V based SoC delivering real-time edge AI processing f

  20. Slide 20: Strong Commercial Momentum

    Strong Commercial Momentum Customer & Partner What the Market Engagements is Responding To OEM engagements – eval boards shipped Ultra-low power AI inference • Wearables – AR glasses, hearables • < 10 ms vs. 150-300 ms for competitors • Dash cam • Up to 20X lower energy consumption vs. • Predictive

  21. Slide 21: Arrow Electronics Collaboration

    Arrow Electronics Collaboration Arrow Electronics (NYSE: ARW) • Global technology distributor and engineering partner • 2024 global sales of US$28 billion Collaboration with EMASS • Enhanced SDKs, developer tools, reference designs Predictive maintenance first reference design • Cold asset tracking

  22. Slide 22: Semtech Collaboration

    Semtech Collaboration Semtech Corporation (Nasdaq: SMTC) • Global semiconductor provider • 2024 global sales of US$800 million plus Collaboration with EMASS • Combine Semtech’s LoRaWAN wireless transceiver with ECS-DoT (demo showcased at CES 2026) Reference designs • Predictive maintenance • Securit

  23. Slide 23: Advancing Hearables

    Advancing Hearables Reference design integrating STMicroelectronics inertial sensing with EMASS ECS-DoT ECS-DoTs Highlights on the Reference Design Sub-10ms No Cloud Local inference means voice commands are acted on in Keyword recognition runs entirely on-device, real time. eliminating latency Alway

  24. Slide 24: Scaling Commercial Operations

    Scaling Commercial Operations USA EU Asia Continued Customer Setting up EU Application-Led Engagement Operations Engagement • Added sales director & field • Sales director • Added sales rep applications engineer • New distribution partner • New distribution partner • Continued OEM engagement © 2025

  25. Slide 25: Upcoming Technical Catalysts

    Upcoming Technical Catalysts ECS-DoT 16nm and beyond Live-drone flight validation Drone Technology Expansion • Strengthening leadership in • Validate performance gains from • Building on recent drone ultra-low-power Edge AI simulations technology licensing • Integration of key chip • Assess power co

  26. Slide 26: Upcoming Commercial Catalysts

    Upcoming Commercial Catalysts Expanding Use-cases and More partner engagements Environments for ECS-DoT • Reference designs with ECS-DoT • Improvements across evaluations and • Comarketing demos with ECS-DoT including: • Easier customer adoption • Predictive maintenance • Security detection • Wrist-

  27. Slide 27: Thank You

    Thank You Head Office Singapore Office Level 45, 108 St Georges Terrace Symbiosis 3 Fusionopolis Way Perth WA, 6000 Australia # 13-21 Singapore 138633 +61 8 6244 9095 www.nanoveu.com +65 6557 0155

Nanoveu — Pitt Street Research Semiconductor Conference 2026 on 6ix