Obducat Ab Class B · NGM:OBDU.B
Obducat Ab Class B — Investor Presentation (January 2007)
36 slides from Obducat Ab Class B's investor presentation, Jan 29, 2007
Slide 1: Creating Greater Capacity on Smaller Spaces
Creating Greater Capacity on Smaller Spaces Presentation 2007-01-29 1 Slide 1 © Obducat, 2007
Slide 2: Presentation Outline
PRESENTATION OUTLINE • World unique launch • Obducat today • Obducat application areas • Benefit with Obducat technologies • Application areas and market potential • Conclusion Presentation 2007-01-29 1 Slide 2 © Obducat, 2007
Slide 3: World Unique Launch
WORLD UNIQUE LAUNCH •First NIL system to have a real production capacity •In-line stamp and substrate replication •Fully automated process control Presentation 2007-01-29 1 Slide 3 © Obducat, 2007
Slide 4: Company Background
OBDUCAT TODAY Company Background • Founded in 1989 • Approx. 16 000 shareholders • Facilities in Sweden (HQ) and in Cambridge UK • Raised approx. 40 MEUR • Listed on Nordic Growth Market, Sweden – Ticker: OBDU B (NGM) – Ticker: OBDCF (Nasdaq OTC) – ISIN CODE: SE0000514705 Presentation 2007-01-29 1 S
Slide 5: Obducat's Business Concept
OBDUCAT TODAY Obducat’s Business Concept Obducat´s business concept is to develop and supply lithography solutions for production and replication of advanced micro- and nano structures for mass production as well as for R&D purposes. The company’s sales encompass equipment, stampers, licenses, and p
Slide 6: Technology and product portfolio
OBDUCAT TODAY Technology and product portfolio NIL E-Beam NIL Equipment Process solutions EBR and SEM Equipment Stampers - ∅2,5-inch, ∅3-inch, - Process know-how - 30kV and 50kV lithography systems - Quartz - ∅6-inch and 8-inch - Consumables - Nickel - Mass production solution - Silicon - Polymer Pr
Slide 7: Commercial position and status
OBDUCAT TODAY Commercial position and status • World market leader with 65 installations world wide • We have a unique and patented technology – 193 ongoing patents and applications • Industrial customer base includes: – Intel – General Electric Plastics – LG Electronics – Dai Nippon Printing – TDK
Slide 8: Market segments and penetration status
OBDUCAT TODAY Market segments and penetration status Academic Institute Commercial Commercial R&D R&D Development Manufacturing Revenue sources Revenue sources Revenue sources Revenue sources Equipment Equipment Equipment Equipment Stampers Stampers Stampers Stampers Penetrated Penetrated Penetrated
Slide 9: Competitive position
OBDUCAT TODAY Competitive position Obducat is the only lithography solution provider that has complete process and equipment know-how in-house. Presentation 2007-01-29 1 Slide 9 © Obducat, 2007
Slide 10: Current market size for lithography equipment
OBDUCAT TODAY Current market size for lithography equipment Lithography equipment supplied to semiconductor industry – annual market size US$ 4-5 billion. The implementation of NIL has the potential to broaden this market further. Presentation 2007-01-29 1 Slide 10 © Obducat, 2007
Slide 11: Growth strategy
OBDUCAT TODAY Growth strategy • Focus on applications where NIL generates high added value • Start with the “simple” applications and evolve together with the customers into more demanding applications • Creating development consortiums with customers • Team up with the right partners for OEM, mater
Slide 12: OEM partners
OBDUCAT TODAY OEM partners • Equipment – German company with 1200 employees with proven track record as a manufacturer of high throughput mass production equipment for electronic devices • Key materials such as polymers – specialized materials developed for our processes by partners which have large
Slide 13: Personnel and organisation
OBDUCAT TODAY Personnel and organisation • 51 Full time employees including… – 7 PhD´s – 38 University graduates …and dedicated to… – Marketing and Sales 11 (incl. Agents/distributors: 28) – R&D 22 – Production, Procurement and Service&Support 10 – Administration 8 Presentation 2007-01-29 1 Slide 13
Slide 14: Possibilities for expansion
OBDUCAT TODAY Possibilities for expansion • Locations in Malmö/Lund and Cambridge offers excellent recruitment base for further expansion – Örestad region has approx 140 000 students – Lund University has the leading Nano research center in Europe with 200 employees – Approx 250 students in a tailor
Slide 15: Global Presence
OBDUCAT TODAY Global Presence Obducat AB Headquarter Obducat CamScan Ltd. Sales R&D Assembly Distributor China Administration Advanced Scientific Distributor Japan Canon Marketing Japan Distributor South Korea Tricomtek Obducat North America Distributor Taiwan Advanced Scientific Distributor Singapo
Slide 16: Highlights 2006
OBDUCAT TODAY Highlights 2006 • First customer to use NIL for manufacturing of opto electronic components forming a part of a consumer electronic product • Investment program of 1 MUS$ – HVM prototype – Additional process capabilities and higher throughput capabilities • Signed MoU with Canon MJ for
Slide 17: Application areas: Opto electronics
APPLICATION AREAS FOR OBDUCAT Opto electronics • Portable large screen • Road sign reflection • Polarizer for RPTV’s • Optics for optical media players • Optical components for data communication systems Presentation 2007-01-29 1 Slide 18 © Obducat, 2007
Slide 18: Application areas: Magnetic storage media
APPLICATION AREAS FOR OBDUCAT Storage Media Magnetic media • Multimedia applications drive growth in HDD industry • Area density will increase which creates a need for a new generation of technology • Pattern media needs both EBR and NIL • Products to reach the market in 2009 Presentation 2007-01-29
Slide 19: Application areas: Optical media
APPLICATION AREAS FOR OBDUCAT Storage media Optical Media • Market launch of HD-DVD and Blu-ray 2006 anticipates 2 billion media 2010 • 2 hours of HD movie needs 25GB of storage capacity – creates a need for a cost efficient solution for production of dual layer discs • Increased storage capacity me
Slide 20: Application areas: Display
APPLICATION AREAS FOR OBDUCAT Display • The display industry is facing a continued rapid growth however in order to support this projection; – Total cost of manufacturing must be decreased – Yield must be improved This opens opportunities for NIL Presentation 2007-01-29 1 Slide 21 © Obducat, 2007
Slide 21: Application areas: High Density Interconnects
APPLICATION AREAS FOR OBDUCAT High Density Interconnects • The need for NIL solutions are mainly being driven by – Developments in mobile phones – Portable computers and PDA’s • NIL will enable – The addition of functionality in the products – Yield improvement – Overall manufacturing cost decrease
Slide 22: Obducat NIL lithography solution
BENEFITS WITH OBDUCAT TECHNOLOGIES Obducat NIL lithography solution • Lower Cost of Ownership • Extendibility of technology – facilitates replication of sub-10nm structures in R&D already today • Proven technology and track record in manufacturing mode Presentation 2007-01-29 1 Slide 23 © Obducat, 2
Slide 23: Conclusions
Conclusions Obducat is the leading company within its field with a world leading market position already today and we will continue to lead the industrialisation of NIL-technology Presentation 2007-01-29 1 Slide 24 © Obducat, 2007
Slide 24: Obducat HVM System
OBDUCAT HVM SYSTEM - Drive the Industrialization phase of NIL - Competitive manufacturing solution - Deliver high quality imprint - Enable high throughput - Can be used in different applications Presentation 2007-01-29 1 Slide 25 © Obducat, 2007
Slide 25: Obducat HVM System
OBDUCAT HVM SYSTEM - Proof of concept for industrial use - Further develop and verify our NIL technology solution in targeted application areas - Live demo to customers - Exhibitions Nanotech Japan – SPIE USA – Semicon West USA Semicon Europa in Frankfurt – MNE in Copenhagen Presentation 2007-01-29
Slide 26: Starting time of Industrialisation
Starting time of Industrialisation Optoelectronics 2006 - 2007 Magnetic storage media 2007 - 2008 Optical storage (HD-DVD & Blu-Ray) 2007 - 2008 Displays 2008 - 2009 High density interconnect 2008 - 2009 Polymer electronic 2008 - 2009 Bio applications 2008 - 2009 Semiconductor – High end 2012 - 2013
Slide 27: NIL technological segmentation – FP Displays
NIL technological segmentation – FP Displays Applications Potential device for NIL Function Large area imprint Improve contrast Plastic sheet Plasma TV Wave plates Plastic film Brightness enhancement LCD TV films Flexible glass Anti-reflection films Yield improvement of production for plastic Metal
Slide 28: Market potential – NIL for Displays
Market potential – NIL for Displays LCD and PLASMA TVs Volume production forecast : Film for displays 2007 = 60 Million units 2008 = 80 Million units 2009 = 95 Million units Large Area Imprints 2010 = 100+ Million units Glass panels Presentation 2007-01-29 1 Slide 30 © Obducat, 2007
Slide 29: NIL technological segmentation - Data storage
NIL technological segmentation - Data storage Applications Potential device for NIL Function Optical disks Patterning optical media Optical data Stampers for optical storage disk players Focusing light Blu ray Dual layers Storage capacity increase HD-DVD Discrete Track Track isolation Magnetic Recor
Slide 30: Market potential - Data storage
Market potential - Data storage Multi media applications are driving the need of increased data density • Market size 2006 is approx. 600 million substrates – anticipates 1 billion discs 2010 • New technology DTR is planned to be implemented by 2009 • DTR needs new technology for production • EBR an
Slide 31: NIL technological segmentation - Optoelectronic
NIL technological segmentation - Optoelectronic Optoelectronic Applications Potential device for NIL Function Light Emitting Diodes Brightness Screens Photonic crystals enhancement backlighting Nano wire grid polarizer Large displays IR-filter Filtering Micro lenses Wireless telecom Image sensor (Sa
Slide 32: Market potential - optoelectronic
Market potential - optoelectronic More performance is requested in the market of multi- media devices and portable electronics Camera filters Polarizer Micro lenses Image sensors Presentation 2007-01-29 1 Slide 34 © Obducat, 2007
Slide 33: NIL technological segmentation - HDI
NIL technological segmentation - HDI µelectronics Applications Potential NIL Devices Function Printed Circuit Boards Conducting lines ( PCB ) Interconnects Fiber optics telecom Planar waveguides Light guiding, switching … (ring resonators, Bragg gratings, AWG) Presentation 2007-01-29 1 Slide 35 © Ob
Slide 34: Market potential - High density interconnect
Market potential - High density interconnect Developments in mobile phones Portable computers and PDA’s Manufacturing cost decrease Presentation 2007-01-29 1 Slide 36 © Obducat, 2007
Slide 35: Conclusions
Conclusions Time to market for respective application areas using Nano Imprint Lithography HVM is forecasted to be 2007 and 2008 and Together with our customers we will use the time window to optimize our lithography solution to fit their needs using our NIL HVM system Presentation 2007-01-29 1 Slid
Slide 36: Thank You for Your Valuable Time!
Thank You for Your Valuable Time! Presentation 2007-01-29 1 Slide 38 © Obducat, 2007