Infineon Technologies AG · XETR:IFX

Infineon Technologies — Corporate Update (February 2006)

20 slides from Infineon Technologies's corporate update, Feb 10, 2006

  1. Slide 1: The future of communications

    The future of communications February 10, 2006 Infineon Prof. Dr. Hermann Eul Member of the Infineon Management Board Business Group Communication Solutions Future of communications Feb 10, 2006 Slide 1 Copyright © Infineon Technologies 2006. All rights reserved.

  2. Slide 2: Disclaimer

    Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that

  3. Slide 3: Four Hot Topics in the Wireless Communication Market – Infineon Drives Them All

    Four Hot Topics in the Wireless Communication Market – Infineon Drives Them All HSDPA Cellular ULC „ HSDPA enabled mobile „ ULC ("Ultra-Low-Cost") phones to increase from 10 phones to represent 12% of million in 2007 to more than worldwide mobile phone 300 million by 2010* sales by 2010 compared to

  4. Slide 4: Growth Drivers: HSDPA, WCDMA, EDGE and ULC

    Growth Drivers: HSDPA, WCDMA, EDGE and ULC Mobile phone market development [Units m] 1170 1222 1109 945 1038 823 HSDPA / WCDMA / EDGE 681 WCDMA / EDGE EDGE GSM / GPRS CDMA CY04 CY05 CY06 CY07 CY08 CY09 CY10 Source: Strategy Analytics, January 2006 Mobile phone sales by price-tier 100% High 80% Mid 6

  5. Slide 5: 3GSM 2006: Infineon Provides All Key Elements of HSDPA Solution

    3GSM 2006: Infineon Provides All Key Elements of HSDPA Solution HSDPA multimedia baseband S-GOLD 3H One-chip 3 „ „ One-chip HSDPA HSDPA // WCDMA WCDMA // EDGE EDGE solution solution „ „ 7.2 7.2 Mbit/s Mbit/s baseband baseband „ Video „ Video telephony telephony and and streaming streaming without wi

  6. Slide 6: Infineon Introduces HSDPA Platform

    Infineon Introduces HSDPA Platform HSDPA multimedia platform „ HSDPA data rates up to 7.2 Mbit/s „ „ Enabling broadband multimedia „ applications: – Video streaming – High-speed audio/video download „ Infineon provides complete „ solution: 3 All key hardware components HSDPA market development 3 Ref

  7. Slide 7: Panasonic and Vodafone Selected Infineon's 3G Platform

    Panasonic and Vodafone Selected Infineon's 3G Platform Infineon's 3G platform „ Ramp-up expected 2H CY06 „ „ Infineon provides multimedia „ baseband, RF transceiver, power management, connectivity solutions, reference design and software „ < 200 electronic components „ „ Low eBoM „ 3G market develop

  8. Slide 8: Several OEMs Selected Infineon's EDGE Platform

    Several OEMs Selected Infineon's EDGE Platform Infineon's EDGE platform „ Ramp-up expected 2H CY06 „ „ Infineon provides multimedia „ baseband, RF transceiver, power management, connectivity solutions, reference design and software „ PCB footprint < 12.5cm² „ „ Low eBoM „ EDGE market development Des

  9. Slide 9: Several Design Wins for RF / Baseband Single-Chip EGOLDradio

    Several Design Wins for RF / Baseband Single-Chip "EGOLDradio" Infineon's ULC1 platform „ Ramp-up expected 1H CY06 „ „ Infineon provides RF / Baseband „ single-chip, power management, reference design and software „ < 100 electronic components „ „ PCB footprint < 9cm² „ „ ULC phone BoM < 20USD „ ULC

  10. Slide 10: Infineon's New Single-Chip Generation Drives Further BoM Reduction

    Infineon‘s New Single-Chip Generation Drives Further BoM Reduction ULC1 ULC2 EGOLDvoice: EGOLDradio: RF + Baseband RF+Baseband + Power Management single-chip + SRAM single-chip ≥ 20% BoM reduction < 9 cm2 PCB size area 4 cm2 < 100* PCB components < 50 < $ 20 Phone BoM < $ 16 Future of communications

  11. Slide 11: Competitive Mobile Phone Platform Offering Leads to Several Design Wins

    Competitive Mobile Phone Platform Offering Leads to Several Design Wins Complete offering from 2G to 3.5G Design wins Software Customer Platform Ramp- up APOXI reference MMI Applications APOXI framework OEM GSM ULC 1H CY06 Protocol stack OEM GSM ULC 2H CY06 Realtime operating Hardware driver system

  12. Slide 12: Expanding RF Customer Base Through RF CMOS Leadership

    Expanding RF Customer Base Through RF CMOS Leadership „ „ No. 1 in RF with approximately 200 million RF chips sold in CY05 „ „ Several 3G and EDGE mobile phone platforms ramping up in 2H CY06 will be based on our CMOS transceivers SMARTi SMARTi 3GE 3GE SMARTi SMARTi 3G 3G SMARTi SMARTi PM PM HSDPA H

  13. Slide 13: Growth Driver: Connectivity

    Growth Driver: Connectivity Growth driver Infineon's position Increasing demand for Bluetooth connectivity in mobile phones: „ Customers: BenQ, Panasonic 60% „ Bluetooth 2.0 + EDR solution [% of worldwide mobile sampling since early 2005 phone shipments] „ Design win at OEM 50% A-GPS 40% „ World's f

  14. Slide 14: Growth Driver: Digital Terrestrial TV and Mobile TV

    Growth Driver: Digital Terrestrial TV and Mobile TV Digital terrestrial TV Growth Drivers: Infineon's Position: „ Introduction of digital terrestrial „ Leading share worldwide in TV in many regions tuners for digital terrestrial TV „ Analog terrestrial TV to be „ Infineon tuners are fully switched o

  15. Slide 15: Growth Driver: DSL

    Growth Driver: DSL DSL market development Infineon's position Triple play services and network VDSL2 leadership replacement drive DSL demand „ We offer the first fully standard For example: compliant VDSL2 chip solution „ Deutsche Telekom intends to provide „ Several major OEMs decided to start Germ

  16. Slide 16: Critical Factors for VDSL2 – Infineon Has it All

    Critical Factors for VDSL2 – Infineon Has it All 9 Early availability VINAX: 1st fully standard compliant VDSL2 chip solution „ „ IFX: Sole company meeting all regional requirements 9 Experience „ More than 4 million VDSL1 lines powered by Infineon chip solutions „ Fully ADSL backwards compatible 9

  17. Slide 17: Infineon Communication Solutions Drive the Convergence of Communication Technologies

    Infineon Communication Solutions Drive the Convergence of Communication Technologies Mobile Phone Broadband RF Solutions Platforms „ Access „ RF Engine „ Feature Phone „ Tuner Systems „ Entry Phone „ Connectivity „ Mobile Software „ RF transceivers and BAW filters for 3G and 2G mobile phones and wir

  18. Slide 18: Infineon Successfully Produced First 65nm Samples

    Infineon Successfully Produced First 65nm Samples „ Successfully produced first sample chips in our 65nm technology „ Leveraging results of 65nm / 45nm ICIS alliance „ Wafer production was done at multiple fabs „ Volume production intended to start in Q4 CY06 at Chartered „ 65nm technology is expect

  19. Slide 19: Infineon's Advanced Logic Manufacturing Strategy

    Infineon's Advanced Logic Manufacturing Strategy Strategy Advantage „ „ Use Use existing existing in-house in-house capacity capacity to to 100% 100% „ „ Proven Proven and and low low cost cost 130nm manufacturing manufacturing technology technology „ „ Surplus Surplus volume volume in in foundry fo

  20. Slide 20: Never stop thinking.

    Never stop thinking. Future of communications Feb 10, 2006 Slide 20 Copyright © Infineon Technologies 2006. All rights reserved.

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