Chipbond Technology Corporation · TPEX:6147
Chipbond Technology — Investor Conference 2015
19 slides from Chipbond Technology's conference presentation, Mar 17, 2015
Slide 1: Chipbond
CHIPIOND INNS (C)
Slide 2: Founded in 1997
Founded in 1997 Capital: USD 200Mn Staff: 5000
Slide 3: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 80% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 4: Gold Bumping
GOLD BUMPING Au Applications >90% LCD driver IC RFID Smart Card Finger Print Sensor
Slide 5: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 6: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 7: Chip on Film
CHIP ON FILM PCB Glass PCB board Used for medium/large panels TV, Monitors
Slide 8: Chip on Glass
CHIP ON GLASS Glass PCB board Used for small panels Handsets, Tablets, NB
Slide 9: Driver IC
Driver IC 8 ch Driver
Slide 10: Driver IC
Driver Driver Driver Driver Driver Driver
Slide 11: Retina Display
Retina Display $i tibsee tats =z bit essetss ¥ * as *
Slide 12: Applications
APPLICATIONS Phones TV Tablets PC/NB
Slide 13: PPI
PPI 500 420 340 260 180 100 2008 2010 2012 2014 Phones Tablets
Slide 14: White Box Price
Samsung 1440 LG G3 S6 Samsung iPhone 1080 HTC S5 M9 6+ White 720 Box 360 0 200 400 600 800 Price
Slide 15: China Smartphone
CHINA SMARTPHONE Others WVGA HD720 FHD 100 75 50 25 0 13Q2 Q3 Q4 14Q1 Q2 Q3 Q4
Slide 16: FHD vs 4K
FHD 4K Cost 1x 1.15x Retail 1x 1.5x # IC required 11~14 30~40
Slide 17: Out Cell
OUT CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Driver IC
Slide 18: On & In Cell
ON & IN CELL Cover Glass TFT LCD Touch Display Touch Sensor Driver IC
Slide 19: TDDI
TDDI Benefits - Reduce power consumption - Improve speed - Less load on CPU Chipbond - Larger Die Size -> more wafers - Longer Test Time