Yamaha Motor Co., Ltd. · TSE:7272
Yamaha Motor — Investor Presentation (September 2026)
25 slides from Yamaha Motor's investor presentation, Sep 10, 2026
Slide 1: SEMI Business Briefing Session (Semiconductor Back-End Manufacturing Equipment)
SEMI Business Briefing Session (Semiconductor Back-End Manufacturing Equipment) Growth Strategy Toward Becoming a World-Class Total Solutions Provider September 10, 2026 Yamaha Motor Co., Ltd. Yamaha Robotics Co., Ltd.
Slide 2: Agenda
Agenda Ayako Egashira Executive Officer and Chief General Manager ■ 1: Overview of the Robotics Business of Solution Business Operations Yamaha Motor Co., Ltd. Ryosuke Nakamura President & Representative Director ■ 2: Yamaha Robotics’ SEMI Business Growth Strategy Yamaha Robotics Co., Ltd. • About Y
Slide 3: Overview of the Robotics Business
Overview of the Robotics Business Ayako Egashira Executive Officer and Chief General Manager of Solution Business Operations Yamaha Motor Co., Ltd. Copyright © Yamaha Motor Co., Ltd. All Rights Reserved. 3
Slide 4: Robotics Business Overview
Robotics Business Overview Robotics 4% Main Products Consolidated Revenue SMT Systems Factory Automation SEMI (Industrial Robots) Semiconductor Manufacturing Systems 2025 Revenue ¥2,534.2 bil. Others 96% Robotics Business SEMI 2025 ■ Surface Mounters ■ Linear Conveyor Modules ■ Bonding equipment Rev
Slide 5: From Semiconductor Back-End Processing to Assembly and Inspection
From Semiconductor Back-End Processing to Assembly and Inspection Offer new solutions and FA products bridging the SMT market and the semiconductor back-end market Streamlining the entire process and the entire factory with one of the industry's most comprehensive lineups Semiconductor/Electronic Co
Slide 6: Robotics Business Medium-Term Management Plan Framework
Robotics Business Medium-Term Management Plan Framework Supporting a rapidly digitalizing world and transforming mobility with our One-Stop Smart Solution Flip Chip Bonding Copyright © Yamaha Motor Co., Ltd. All Rights Reserved. 6
Slide 7: Yamaha Robotics' Vision for the Future
Yamaha Robotics’ Vision for the Future As professionals leveraging advanced robot technologies and all- inclusive solutions, we deliver on the automation needs of the global manufacturing industry with elegance and efficiency Copyright © Yamaha Motor Co., Ltd. All Rights Reserved. 7
Slide 8: Yamaha Robotics' SEMI Business Growth Strategy
Yamaha Robotics’ SEMI Business Growth Strategy Ryosuke Nakamura President and Representative Director Yamaha Robotics Co., Ltd. Copyright © Yamaha Motor Co., Ltd. All Rights Reserved. 8
Slide 9: SEMI Business Overview
SEMI Business Overview Established August 6, 1959 *Renamed from Shinkawa Ltd. on July 1, 2019 *Renamed to Yamaha Robotics Co., Ltd. on July 1, 2025 Yamaha Motor Co., Ltd. following the integration of 4 companies Solutions Business Operations Yamaha Robotics Co., Ltd. Robotics Business Unit Surface M
Slide 10: Total Solutions
Yamaha Robotics Co., Ltd. Total Solutions Die/Wire Molding Electronic Device Flip Chip Bonder Bonder Equipment Assembly Equipment 1: The development capabilities to meet diverse needs 2: The flexibility to work with global clientele SEMI Operations 3: The ability to propose targeted total solutions
Slide 11: Semiconductor Back-End Processes
Semiconductor Back-End Processes SEMI business provides one-stop equipment, solutions for high-speed, high-precision back-end semiconductor processes Dicing Front-End Circuit Formation Cut Wafers with circuits are separated into individual semiconductor chips with a cutting device Processes silicon
Slide 12: SEMI Business Solutions
SEMI Business Solutions Connecting Cutting-Edge Semiconductors with Leading Bonding Technologies SHINKAWA Series ➢ Die Bonders ➢ Wire Bonders Connect Inspect ➢ Flip Chip Bonders series Assembly Solutions Locations West Tokyo Site Hamamatsu Site Providing a Wide Range of FA Equipment for Semiconducto
Slide 13: Yamaha Robotics Co., Ltd.: Domestic Locations
Yamaha Robotics Co., Ltd.: Domestic Locations Saitama Site West Tokyo Site (Sakado) Tokyo (Musashimurayama) Saitama Ibaraki Nagano Site | Yoshino Plant Prefecture Prefecture APIC YAMADA Precision Corporation Chikuma, Nagano Pref. Tokyo Kyushu Service Center Fukuoka, Fukuoka Pref. Kanagawa Chiba Pref
Slide 14: Yamaha Robotics Co., Ltd.: Global Network
Yamaha Robotics Co., Ltd.: Global Network China South Korea SKW California, USA YIMS (Suzhou/Shenzhen) YRK USA YMUS Georgia, USA YME Germany Europe Japan North India America YMIS Asia YRTW Taiwan Thailand YRMA YRTH Manufacturing facility Malaysia Singapore Vietnam Philippines YRMY YRAP YREA YRPH Sof
Slide 15: Semiconductor Market Revenue Breakdown
Semiconductor Market Revenue Breakdown *Yamaha Motor data (2022–2024) Developments with advanced, power, and our core-market mainstream semiconductors Back-end solutions are supporting the further evolution of semiconductors Power Semiconductors Power Sensor/LED Discrete Memory Mainstream Advanced S
Slide 16: Semiconductor Market Trends: Back-End Market Growth
Structural Changes Driving Semiconductor Market Trends: Back-End Market Growth The arrival of the AI era is sending the semiconductor market upward faster than expected Expected to exceed $1 trillion in 2026 ahead of the 2029 forecast Semiconductor Revenue Forecast Advanced Semiconductors Power Semi
Slide 17: Focus Markets: Early Investments to Capture AI-Driven Growth
Focus Markets Early Investments to Position Yamaha to Capture AI-Driven Growth Advanced semiconductors driving the semiconductor market Investment in AI data centers expected to continue Source: TechInsights Inc. Yamaha Robotics Revenue Breakdown Revenue from advanced semiconductor applications (gro
Slide 18: SEMI Business Initiatives for Long-Term Growth
SEMI Business Initiatives for Long-Term Growth Earn in Core Areas, Grow via Growth Areas, and Create the Future in New Areas 2019– 2022– 2025– 203X 2021 2024 2027 Restore Financial Strength Strengthen Five Customer-Centric Capabilities Maximize Synergies World-Class Semiconductor Processing Strength
Slide 19: Business Growth: Core Area (Mainstream Semiconductors)
Business Growth: Core Area (Mainstream Semiconductors) Launch Progress of New Platform Models UTC-RZ1: High-Speed, High-Precision Wire Bonder MS-R Series: Multi-Process Molding System ➢ Compact design with high productivity ➢ High productivity and ultra-high precision (37% higher productivity per un
Slide 20: Business Growth: Growth Areas (Advanced Semiconductors)
Business Growth: Growth Areas (Advanced Semiconductors) Focusing Investments on Technology Development for Growth Areas Aligning with the industry shift from round wafers to panels Handling Next-Generation Panel-Level Packaging Flip-chip bonders and molding systems ×５ ×９ Round wafer Panel Handling N
Slide 21: Business Growth: New Areas (Silicon Photonics)
Business Growth: New Areas (Silicon Photonics) Silicon Photonics Adapting Active Alignment Technology to Achieve Highly Precise Optical Connections Contributing to lower power consumption by shifting from electrical to optical connections High-speed active alignment technology Strengths in high-prec
Slide 22: Business Growth: New Areas
Business Growth: New Areas (Pushing the Development of Future Technologies and New Businesses) Collaboration and Co-Creation with Partners, Universities, and Research Institutions CEATEC AWARD 2025: Innovation Award Joined the Semiconductor Assembly Test Automation and Standardization Research Assoc
Slide 23: Strengthening Competitiveness to Support Profitable Growth
Strengthening Competitiveness to Support Profitable Growth More high-value-added offerings, manufacturing reforms, greater revenue from services, and talented personnel will support growth and improved profitability ■ Enhancing Profitability ■ Bolstering the Personnel Base for Growth 1) Focused Inve
Slide 24: Key Takeaways
Key Takeaways 1 Capturing AI-Driven Growth in Semiconductor Back-End Processes to Drive Revenue Gains • Growing demand from generative AI, HBM, and optical transceiver markets • Expanding orders through targeted investments in growth areas • Solutions for advanced semiconductor applications driving
Slide 25: The information contained in this message may be confidential and legally protected under applicable
本文書に含まれる技術内容は当社の秘密情報です。当社の許諾無く第三者への開示はできません。 The information contained in this message may be confidential and legally protected under applicable law. The message is intended solely for the addressee(s). If you are not the intended recipient, you are hereby notified that any use, forwarding, dissemi
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