Slide 1: Egis Technology Inc. 2025Q3 Investor Conference
Egis Technology Inc. 2025Q3 Investor Conference ir@egistec.com 2025.12.22 | © 2025 Egis Technology Inc. CONFIDENTIAL 1
Slide 2: Revenue and GM trend
Revenue and GM trend 1,600 45% 1,400 40% 40% 40% 40% 39% 41% 35% 35% 1,200 30% 1,000 29% 30% NT$ Million 25% 800 1,582 1,462 20% 600 1,246 1,203 1,127 1,016 1,072 15% 951 400 10% 200 5% 0 0% Q4 23 Q1 24 Q2 24 Q3 24 Q4 24 Q1 25 Q2 25 Q3 25 Net Sales(Consolidated) Gross Margin Rate | © 2025 Egis Techn
Slide 3: Operating Expenses
Operating Expenses 1,200 60% 50% 50% 1,000 40% 30% 800 29% 27% 20% NT$ Million 600 7% 10% 0% 400 -5% 1% -2% -10% 640 509 523 509 507 -20% 200 396 429 405 -30% -26% 0 -40% Q4 23 Q1 24 Q2 24 Q3 24 Q4 24 Q1 25 Q2 25 Q3 25 RD Expenses Other Expenses QoQ | © 2025 Egis Technology Inc. CONFIDENTIAL 3
Slide 4: Income Statement Q3 2025 vs. Q3 2024
Income Statement Q3 2025 vs. Q3 2024 Unit: NT$ Thousands Q3 2025 Q3 2024 Growth Rate Net Sales 1,462,317 1,246,186 17% COGS 1,018,769 745,752 Gross Profit 443,548 500,434 -11% Gross Margin 30.3% 40.2% Operating Expense 825,116 751,163 Operating Income (381,568) (250,729) -52% Operating Margin -26% -
Slide 5: Income Statement Q3 2025 vs. Q2 2025
Income Statement Q3 2025 vs. Q2 2025 Unit: NT$ Thousands Q3 2025 Q2 2025 Growth Rate Net Sales 1,462,317 1,203,233 22% COGS 1,018,769 733,260 Gross Profit 443,548 469,973 -6% Gross Margin 30.3% 39.6% Operating Expense 825,116 813,263 Operating Income (381,568) (343,290) -11% Operating Margin -26% -2
Slide 6: Balance Sheet (1)
Balance Sheet (1) Unit: NT$ Thousands Q3 2025 Q3 2024 Cash and cash equivalents 3,162,666 2,041,545 Financials assets at fair value through P&L 192,208 298,695 Notes and accounts receivable, net 554,837 618,371 Inventories 437,416 588,210 Prepaid Expenses 1,447,474 546,139 other current assets 296,2
Slide 7: Balance Sheet (2)
Balance Sheet (2) Unit: NT$ Thousands Q3 2025 Q3 2024 Current liabilities Short-term borrowings 1,139,125 1,119,750 Notes and accounts payable 219,796 259,580 Long-term liabilities, current portion 309,829 920,000 other current liabilities 3,740,490 2,329,975 Total current liabilities 5,409,240 4,62
Slide 8: Building Chiplet Marketplace
Building Chiplet Marketplace 2025Q3 Investor Conference ir@egistec.com 2025.12.22 | © 2025 Egis Technology Inc. CONFIDENTIAL 8
Slide 9: 為何需要 Chiplet？
為何需要 Chiplet？ • 摩爾定律 • AI/HPC需求 | © 2025 Egis Technology Inc. CONFIDENTIAL 9
Slide 10: 實踐中的挑戰：Chiplet 設計的關鍵考量
實踐中的挑戰：Chiplet 設計的關鍵考量 1. 先進封裝技術： 將多個 Chiplet 精密封裝於同一系統中，需仰賴複雜且昂貴的先進封裝技術，如 2.5D（使用矽中介層）或 3D 封裝；相關的成本、產能與良率仍需持續優化。 2. 互連效能： 雖然 UCIe 已有效降低 D2D 的延遲與功耗，但晶片間通訊仍難以完全媲美單體晶片內部連 接，對高效能運算架構帶來設計挑戰。 。 3. 散熱管理： 將多個高效能 Chiplet 緊密堆疊或排列在一起，將造成高度熱密度，散熱設計成為封裝與 系統層面的關鍵課題。 4. 測試與驗證： 在封裝之前，必須確保每一個 Chiplet 都是功能完好（Known G
Slide 11: UCIe 技術解密：通用小晶片互連快車道
UCIe 技術解密：通用小晶片互連快車道 ⚫ UCIe 標準定義了一套 完整、分層的 D2D 互連協定堆疊，實現高頻寬、低延遲、低功耗的晶片間通訊。 ⚫ UCIe 的技術架構可分為 三個關鍵層級： 1. 實體層（Physical Layer, PHY）負責原始電子訊號的傳輸提供多種 PHY 選項，可支援不同封裝技 術與應用情境： 標準封裝（如有機基板） 先進封裝（2.5D / 3D，例如TSMC CoWoS、Intel EMIB / Foveros）讓 UCIe 能在效能與成本之 間保持高度彈性。 2. 裸晶到裸晶適配層（Die-to-Die Adapter）負責鏈路管理、參數協商與錯誤偵測確
Slide 12: UCIe Use Cases…We will see more in the future
UCIe Use Cases…We will see more in the future Network Switch ASIC AI Accelerators Compute Dies IO/Mem. Expansion Dies Network Switch Optical I/O Chiplets | © 2025 Egis Technology Inc. CONFIDENTIAL 12
Slide 13: Evolution of Chiplet
Evolution of Chiplet | © 2025 Egis Technology Inc. CONFIDENTIAL 13