Infineon Technologies AG · XETR:IFX

Infineon Technologies — Lehman Brothers Telco Emerging Markets Seminar 2005

13 slides from Infineon Technologies's conference presentation, Dec 5, 2005

  1. Slide 1: Lehman Brothers Telco Emerging Markets Seminar

    Lehman Brothers Telco Emerging Markets Seminar December 5th, 2005, London Infineon Weng Kuan Tan Vice President and General Manager Entry Phone Business Unit Infineon Technologies AG Lehman Telco Seminar Dec. 5, 2005, London Copyright © Infineon Technologies 2005. All rights reserved. Page 1

  2. Slide 2: Disclaimer

    Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that

  3. Slide 3: Infineon Communication: Fields of activities

    Infineon Communication: Fields of activities FY05 revenue: UMTS EUR 1.4bn EDGE Smart phones GSM/GPRS Multimedia CDMA Feature Bluetooth Entry Mobile RF A-GPS WLAN ULC Phone Solutions Platforms DECT WDCT DVB-T Broadband DVB-H T-DMB CO T/E CPE ATM/IP VoIP VoIP xDSL xDSL Copper-wire ISDN ISDN CODEC/SLIC

  4. Slide 4: Infineon Communication has a leading position in the wireless and wireline semiconductor market

    Infineon Communication has a leading position in the wireless and wireline semiconductor market „ No. 4 in wireless communication semiconductors 1) – No. 1 in RF transceivers for mobile phones – No. 1 in tuner for digital terrestrial TV – No. 2 in DECT – No. 3 in power amplifiers for base stations –

  5. Slide 5: Strong growth ahead for ultra low-cost phones

    Strong growth ahead for ultra low-cost phones Mobile phone sales by price-tier 1000 High 800 > 150 million 600 Mid ULC phones 400 by 2010 Entry 200 0 Ultra low-cost (< US$ 50) CY04 CY05 CY06 CY07 CY08 CY09 CY10 Source: Strategy Analytics, March 2005 Key ULC growth drivers Emerging markets: Developed

  6. Slide 6: ULC segment: Major growth opportunities by region

    ULC segment: Major growth opportunities by region „ Asia – China Emerging markets with – India penetration level below 10% – Indonesia, Vietnam – Pakistan, Sri Lanka, – Pacific Islands, Bangladesh „ Europe – Russia – Eastern Europe „ Americas – Latin America „ Africa Lehman Telco Seminar Dec. 5, 200

  7. Slide 7: Infineon's ULC platform meets the key requirements of the ULC market

    Infineon's ULC platform meets the key requirements of the ULC market: High quality at very low cost Market R&D „ High-volume market „ Stable HW & SW platform „ Voice / SMS centric phone „ Comprehensive development & segment in developed markets support tools „ Emerging markets driven by „ Focus on p

  8. Slide 8: Infineon's ULC solution reduces total cost of ownership

    Infineon’s ULC solution reduces total cost of ownership Low component cost Low manufacturing cost „ Highest level of „ Low component count of less than integration: Single- 100 components on PCB chip E-GOLDradio „ Reduction of manufacturing time: „ Optimization of Single-sided mounted PCB ext. compo

  9. Slide 9: The heart of Infineon's ULC1 platform: RF and baseband single-chip E-GOLDradio

    The heart of Infineon’s ULC1 platform: RF and baseband single-chip E-GOLDradio 2004 2005 RF CMOS transceiver Single-chip: „ In volume production „ RF and baseband „ 130nm CMOS „ „ Single-chip digital RF „ solution Customer benefits: „ Lower system cost „ Smaller PCB area Baseband: „ Less complexity

  10. Slide 10: ULC1 GSM voice only platform: Optimized for lowest total cost of ownership

    ULC1 GSM voice only platform: Optimized for lowest total cost of ownership „ Emerging Markets & simplicity seeking users in Developed Markets „ 3GPP compliant platform „ Single-Chip E-GOLDradio „ Phone Bill-of-Material < 20 USD „ PCB components < 100 „ PCB footprint < 9cm2 „ 4-layer single-sided mou

  11. Slide 11: Design-wins and track record

    Design-wins and track record E-GOLDradio based platform design-wins: Customer Platform Ramp-up GSM/GPRS BenQ 2006 Design-wins feature phones OEM GSM ULC 2006 ODM GSM ULC 2006 „ 50 million phones based on Infineon platforms sold Track-record „ 100 million phones with Infineon software sold Lehman Tel

  12. Slide 12: Next Generation – Driving the ULC revolution

    Next Generation – Driving the ULC revolution Extending IFX leadership in ULC segment Infineon ULC1 Infineon ULC2 ≥ 20% BoM reduction Real PCB Target Simulation < 9 cm2 PCB size area < 6 cm2 < 100* PCB components < 50 < $ 20 Phone BoM < $ 16 * Excluding ESD Lehman Telco Seminar 2006 components 2007 D

  13. Slide 13: Lehman Telco Seminar Dec. 5, 2005, London Page 13

    Lehman Telco Seminar Dec. 5, 2005, London Copyright © Infineon Technologies 2005. All rights reserved. Page 13

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