Paragon Technologies Co., Ltd. · TWSE:3518

Paragon Technologies — Q2 2024 Earnings Presentation

19 slides from Paragon Technologies's earnings presentation, Aug 26, 2024

  1. Slide 1: Paragon Investor Conference 2024/8/26

    —_ Para QON (3sistw Investor Conference 2024 /8/ 26

  2. Slide 2: Limiting responsibility

    Limiting responsibility  The predictive information mentioned in this briefing report and related information, such as outlook of operating, financial performance and business forecasts, is the gathered information form company internal data and the existing status of external economic development.

  3. Slide 3: Contents

    公司簡介 Company Overview 財務資訊 Financial Information CONTENTS SiC新廠進度報告 progress report For advanced SiC factory 資訊交流 Q&A 3

  4. Slide 4: Company Overview

    fo ——= Company — Overview

  5. Slide 5: Paragon (3518TW)

    Paragon(3518TW) Paragon was established in 1995 as the world’s first company to apply vacuum sputtering thin film technology  Eatablishment:1995.10.20 to EMI/ESD solutions for 3C  Capital:NTD 960 Million products. It is also the first  Chairman:Mr. Kenny, huang vacuum sputtering technology  Assi

  6. Slide 6: About Paragon

    About Paragon EMI sputtering &PVD Silicon carbide products Taiwan HQ & RD Center - Established: 1995 year appearance coating -Nankan Factory (2023.1) - Capital: 960 million (NTD) -Suzhou Factory (3C) -Chiayi Factory(building) -Nanjing Factory / Neijiang Factory (EMI) 6 ~8 inches Silicon Carbide The

  7. Slide 7: Development history

    Development history As the world’s first company to apply vacuum sputtering thin film technology to EMI/ESD solutions for 3C products. The leading company of EMI suppliers in Notebook Market, 50% of market share. In 2022, it will acquire Jingcheng Materials, which owns SiC (silicon carbide) wafer pr

  8. Slide 8: Financial Information

    f a Financial | —_—_——___ Information

  9. Slide 9: Q2 24' Consolidated Balance

    Q2 24’Consolidated Balance 2024.6.30 % 2023.12.31 % 2023.06.30 % cash& cash equivalents 684 40 801 51 596 34 Financial assets-current&noncurrent 226 13 58 4 472 27 Notes and accounts receivable 255 15 279 18 263 15 Inventories 19 1 22 1 4 0 non-liquid asset in suspense 23 1 25 2 23 1 Fixed Assets &

  10. Slide 10: Q2 24' Financial Structure

    Q2 24’Financial Structure ITEM 2024.Q2 2023 2022 2021 2020 Debt Ratio 31.97 21.49 16.30 24.54 37.12 Current Ratio 345.58 395.27 606.50 377.86 185.25 Cash flow Ratio (4.44) (17.17) 63.32 31.54 (1.05) 10

  11. Slide 11: 2024Q2 Consolidated income statement

    2024Q2 Consolidated income statement ITEM 2024Q2 2024Q1 QoQ% 2023Q2 QoQ% operating revenue 94 81 15 102 (8) Gross Profit 18 19 (4) 29 (36) operating expenses 51 53 (3) 33 53 Operating Profit (33) (33) 3 (5) (589) non-operating revenue 3 7 (55) 2 32 and expenses Pre-Tax Income (30) (27) (10) (2) (110

  12. Slide 12: Revenue, Gross margin & Net profit margin

    Revenue 、 Gross margin &Net profit margin 12

  13. Slide 13: Q2 24' Consolidated Cash Flow

    Q2 24’ Consolidated Cash Flow 2024 ended 2023 ended June 30 June 30 Cash provided by (used in) operating activities (16) 6 Cash provided by (used in) investing activities (216) (307) Cash provided by (used in) financing activities 93 40 Effects of exchange rate change on cash 22 (29) Net increase (d

  14. Slide 14: Important matters

    Important matters  The first domestic guaranteed convertible corporate bond received full debt payment。(113.8.13)  Invested NT$600 million in Jingcheng Materials Company。(113.8.09)  Jingcheng SiC new plant production equipment purchase NT$270 million。(113.8.09)  Appointed Ms. You Xiuping as gene

  15. Slide 15: Progress report for advanced SiC factory

    progress report For advanced SiC factory 15

  16. Slide 16: SiC investment plan

    SiC investment plan  budget: NT$899.53 million (first phase) 2027 (second phases)  location: Chiayi Dapu Mei Intelligent Industrial Park  Main products: 8-inch SiC wafer Passed certification from major European and American  capacity: 3000PCS/month automotive manufacturers 2026 (first phases) En

  17. Slide 17: Competitive advantage

    competitive advantage At present, there are still only a The Jingcheng team has good few manufacturers that mass- relationships with SIC growth, wafer produce 8-inch SiC. The processing, epitaxy and compound current market supply exceeds semiconductor production, sales, demand, and it will become a

  18. Slide 18: <x oe) Oo

    <x oe) Oo

  19. Slide 19: True Partner for a Brighter Future

    TRUE PARTNER FOR A BRIGHTER spokesman:Mingi Liu(CFO) TEL:(03)212-8833 E-mail:mingi@pttech.com.tw

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