Slide 1: First Quarter FY 2026 Quarterly Update
First Quarter FY 2026 Quarterly Update Infineon Technologies AG Investor Relations 1
Slide 2: Infineon at a glance
Infineon at a glance Addressing long-term high-growth trends FY25 revenue by segment Automotive (ATV) 10% Green Industrial Power (GIP) Power & Sensor Systems (PSS) 29% 50% Connected Secure Systems (CSS) Energy Mobility IoT green and efficient clean and safe smart and secure 11% Financials FY25 reven
Slide 3: Well-balanced portfolio among segments and key applications
Well-balanced portfolio among segments and key applications, highest growth coming from Decarbonization and Digitalization FY25 revenue of €14,662m by segment and key application CSS E-mobility Other 10% 13% 20% Software- 11% defined vehicle Automation & Drives 4% PSS 29% ATV 50% Smart Cards 4% 8% A
Slide 4: Infineon is a global player, clear #1 in power semiconductors
Infineon is a global player, clear #1 in power semiconductors, Automotive semis and automotive microcontroller markets Power discretes and modules Automotive semiconductors 2024 total global market: $32.8bn1 2024 total market: $68.4bn2 Infineon 17.4% Infineon 13.5% NXP 10.5% onsemi 8.5% STMicro 8.8%
Slide 5: Our Target Operating Model
Our Target Operating Model: committing to ambitious financial goals and being the sustainability leader Target Operating Model through cycle Revenue growth >10% Segment Result Margin 25% Adj. Free Cash Flow Margin1 10-15% Sustainability leader CO2 neutrality 2030 1 See notes for definition 2026-02-0
Slide 6: Modular investment approach for long-term value creation
Modular investment approach for long-term value creation – pull-in of AI related investments for faster ramp Infineon investments1 FY26 ~€2.7bn Strategic investments ‒ Dresden module 4 Capacity investments ‒ Smart power and logic: enabling further growth for ”powering AI” and analog/mixed-signal pro
Slide 7: Outlook for Q2 FY26 and FY26
Outlook for Q2 FY26 and FY26 Outlook Outlook Q2 FY261 FY261 Revenue ~€3.8bn moderately up vs. prior year Adj. Gross Margin low 40s % Segment Result Margin mid-to-high-teens % high-teens % FCF ~€1.0bn/ Adj. FCF ~€1.4bn Investments ~€2.7bn D&A ~€2.0bn2 1 Based on an assumed average exchange rate of $1
Slide 8: Infineon strengthens its sensor leadership with ams OSRAM acquisition
Infineon strengthens its sensor leadership with the acquisition of ams OSRAM’s non-optical analog/mixed-signal sensor portfolio Transaction overview CY26e revenue ~€230 m analog / mixed-signal sensor business Purchase price €570 m Employees Strategic rationale ~230 employees, thereof ~150 in R&D fab
Slide 9: Infineon serves all markets with a broad sensor portfolio
Infineon serves all markets with a broad sensor portfolio to provide best solutions in Auto and Industrial Automotive Industrial Medical ‒ Radar sensors ‒ Radar sensors ‒ Temperature sensors ‒ Magnetic position sensors ‒ Magnetic position sensors ‒ Conventional and photon counting IC ‒ Magnetic sp
Slide 10: Compelling financial profile of the transaction
Compelling financial profile of the transaction Financial value creation through: Transaction outline: Growth and margin profile in line with 1 ‒ 570m EUR purchase price, all-cash transaction Infineon TOM ‒ Financed through additional debt 2 EPS accretive from day 1 ‒ PMI will follow proven script,
Slide 11: Strengthening of Infineon's leading robotics sensor solutions
Strengthening of Infineon’s leading robotics sensor solutions with acquired portfolio – addressing around 200 sensors Humanoid sensor usage ‒ Broad range of environmental sensors (pressure, vibration, SiMiC, ToF, radar) ‒ Capacitive sensing for dexterous hands, >100 position sensors, e.g. for joints
Slide 12: Undisputed power systems leadership mastering all three key materials
Undisputed power systems leadership mastering all three key materials Reliable multi sourcing Application of raw materials Si/SiC/GaN understanding Packaging know-how and World-scale fabs hybridization competence Controller Driver IC Power switch Software + Algorithms Leadership in Power Systems acr
Slide 13: Infineon is the leader across all power semiconductor technologies
Infineon is the leader across all power semiconductor technologies – unparalleled portfolio and know-how World’s thinnest silicon power World’s most competitive World’s first 300 mm wafer with 20 µm on 300 mm 200 mm silicon carbide power fab gallium nitride power wafer ‒ Broadest Si-power portfolio
Slide 14: Infineon presents the world's thinnest silicon power wafer
Infineon presents the world’s thinnest silicon power wafer paving the way for more energy efficient power systems Infineon reduces wafer thickness from 40 µm to 20 µm [µm] ‒ Infineon pioneers 20 µm process 180 at high-scale production 160 ‒ Halving thickness also 140 halves resistance, reducing powe
Slide 15: With Kulim 3, Infineon on track to most competitive SiC provider
With Kulim 3, Infineon is on track to becoming the industry's most competitive provider of SiC technology SiC raw material supplier network ‒ More than 6 qualified SiC wafer and boule suppliers ‒ Globally diversified and resilient Superior trench technology ‒ 30% more chips per wafer than planar ‒ U
Slide 16: Infineon is a leader in GaN technology
Infineon is a leader in GaN technology and can build on the industry’s broadest IP portfolio and application expertise Leading GaN product Broadest IP portfolio MV and HV portfolio in the market applications (~350 patent families) World’s first 300 mm GaN manufacturing Leadership process strengthens
Slide 17: Infineon products are essential for AI power supply
Infineon products are essential for AI power supply and secure operation of data centers – from grid to core and beyond Grid Rack Core Physical AI Energy Storage Uninterruptible Power Solid State Circuit Server Systems (ESS) Breaker (SSCB) Racks Core Supply (UPS-ESS) Renewable Energy Solid State Phy
Slide 18: Infineon at the core of IoT
Infineon at the core of IoT – driving digitalization by serving strongly growing multi-application markets Consumer IoT Industrial IoT Automotive IoT Products: MCU – Connectivity (Wi-Fi, BLE, NFC) – Sensors – Security – Power supply & switches at the core o eon Coin cell- Battery- powered in f Io Po
Slide 19: ESG: Targets and achievements
ESG: Targets and achievements 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 19
Slide 20: SBTi has approved our CO2 emission reduction targets
Important milestone achieved: The Science Based Targets initiative (SBTi) has approved our CO2 emission reduction targets SBTi validation of Infineon’s 2030 CO2 reduction targets marks a major step in our decarbonization journey − Scope 1 and 2 targets align with the Paris Agreement, limiting global
Slide 21: Our 2030 carbon neutrality goal
Our 2030 carbon neutrality goal is aligned with the Paris Climate Agreement’s 1.5°C target CO2 burden1 CO2 savings2 2.7 million tons of CO2 equivalents 143 million tons of CO2 equivalents Ratio ~1:53 previously 1:45 On the road to carbon neutrality3 we achieved Infineon’s CO2 target3 by 2025 and 203
Slide 22: External recognitions confirm our engagement
External recognitions confirm our engagement in contributing to a sustainable society Rating/Score Scale Date MSCI ESG AAA CCC to AAA 05/2025 B climate scoring CDP B water scoring F to A 01/2026 Ecovadis 99th percentile “Platinum” award 0 to 100 09/2025 Dow Jones Sustainability Dow Jones Sustainabil
Slide 23: Automotive
Automotive 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 23
Slide 24: ATV at a glance
ATV at a glance ATV revenue and segment result margin FY25 revenue split by product group [EUR m]1 Revenue Segment result margin CAGR 11% power (discretes, (FY21 – FY25) modules) 8,242 7,716 7,402 6,516 control & 4,841 29% connectivity 26% 23% 21% 16% analog & FY211 FY221 FY231 FY24 FY25 sensors 1 T
Slide 25: Infineon's top market position is built on system competence
Infineon’s top market position is built on system competence based on an industry-leading product portfolio Automotive semiconductors (2024 total market: $68,382m; -1.2% y-y) Infineon’s 2024 market share and position by region 17.7% Infineon 13.5% 13.5% 14.1% 13.9% 13.2% NXP 10.5% 10.4% STMicro 8.8%
Slide 26: Strong content growth drivers in xEV and software-defined vehicles
Several strong content growth drivers for Infineon in xEV and software-defined vehicles, even at flat LV production Structural trends fueling our growth Overview of growth vectors until 2030 xEV 2025 2030 ‒ Strong volume growth of BEVs and PHEVs Share of xEVs ‒ Increasing share of SiC in traction in
Slide 27: Infineon is the world leader in automotive semis
Infineon is the world leader in automotive semis, serving all key applications and benefiting strongly from content growth Average semiconductor bill-of-material per car in 2025 and 2030 Semiconductors covered by Infineon Drivetrain applications: ~$1,600 per BEV (up to ~$2,500 for high-end car) ‒ Tr
Slide 28: Number of power MOSFETs per car continues to increase
Number of power MOSFETs per car continues to increase, and drives accelerated growth for the leading portfolio Examples of MOSFET applications Latest portfolio with constant innovation Technologies, packages and voltages OptiMOS 7 40 V Power door Power Brake Electric power BMS Transmission Windshiel
Slide 29: Electromobility
Electromobility 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 29
Slide 30: Broad product portfolio and system understanding enable higher BoM
Infineon’s broad product portfolio and system understanding enable higher BoM and allow compact designs and fast T2M Infineon inverter reference design, covering up to 95% of value P2S (product-to-system approach) ‒ Reference design for up to 300 kW, further customization possible OPTIREG 32-bit Buc
Slide 31: Unmatched portfolio breadth and customer base lead to accelerated SiC growth
Competitive setup, unmatched portfolio breadth and our worldwide customer base lead to accelerated growth in SiC Leading SiC technology and production efficiency Most scalable SiC auto portfolio 650 V 750 V 1,200 V ‒ Unrivaled productivity with most competitive fab and most diversified supplier netw
Slide 32: AURIX TC4x with integrated PPU brings AI-on-the-edge to the battery
Infineon AURIX TC4x with integrated PPU brings AI-on-the-edge to the battery AURIX TC4x Efficient battery cell utilization Battery cost ‒ Higher capacity PPU ‒ Less cells Battery health (parallel processing unit) ‒ Lower battery cost Faster charging High computing performance with complex Charging s
Slide 33: CoolGaN automotive transistor 100 V G1 family
Infineon strengthens its leading position in automotive semis – introducing the CoolGaN automotive transistor 100 V G1 family CoolGaN automotive transistor 100 V G1 family ‒ First GaN transistor family qualified to AEC-Q101 for automotive applications ‒ Features CoolGaN transistors and bidirectional
Slide 34: Software-defined vehicle
Software-defined vehicle 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 34
Slide 35: Software-defined vehicles enabled by safe/secure computing
Software-defined vehicles are enabled by safe/secure computing, high-speed in-vehicle networks, and intelligent power distribution new features in monetization of safety and security functions & data Advantages of standardization of new features in comfort, software-defined components connectivity a
Slide 36: Automotive Ethernet portfolio strengthens our MCU position
The Automotive Ethernet portfolio strengthens our market leading MCU position and increases offering for zonal architectures Infineon’s unique portfolio of MCU and Ethernet Components of hierarchical E/E architectures: Automotive MCUs Automotive Ethernet High Performance Computing (HPC) Complex sens
Slide 37: Extended portfolio contributes to SDV as second growth pillar
Infineon’s extended portfolio contributes essentially to SDV as the second growth pillar alongside e-mobility Infineon components for hierarchal computing E/E architecture Infineon BoM potent.: ~$500 HPC SoC/ Safety Smart Gate ‒ High-level control for complex, safe MPU* Comp. Power Driver MOSFET Swi
Slide 38: Smart semiconductors in power distribution systems enable SDV
Smart semiconductors in power distribution systems are key enabler for SDV while ensuring high availability and resilience Infineon PROFET Wire Guard enables SDV Relay replacement Switch e.g. PROFET Wire Guard Fuse ISO 26262 replacement Protect compliant Load status Fast failure isolation Diagnose (
Slide 39: 48 V enables higher power demand features
48 V enables higher power demand features for future E/E architectures and automated driving Demand of in-vehicle loads is sharply increasing and requires 48 V architectures LED Lighting Cooling fan LED Lighting ‒ More high-power applications and the introduction of zonal E/E architectures Brake Blo
Slide 40: Growth of L1/L2/L2+ drives ADAS semiconductor content
Growth of L1/L2/L2+ is the main driver of ADAS semiconductor content until 2030 Car production by degree of automation (SAE level) Radar is essential to meet decisive requirements of ADAS/AD 100% Distance L0 5 4.5 L0 4 80% 3.5 Lane Detection Speed 3 L1 2.5 2 1.5 60% 1 0.5 0 L1 L1/L2/L2+ Traf
Slide 41: Infineon and Lenovo accelerate autonomous driving
Infineon and Lenovo accelerate autonomous driving with high-performance SDV computing platforms AURIX TC3x ASIL-D safety host selected for Lenovo’s flagship AD domain controller units AD1 and AH1 Strategic design win in China ‒ AURIX TC3x was selected as ASIL-D safety host in Lenovo’s flagship auton
Slide 42: AMD adopts Infineon's HYPERRAM
AMD adopts Infineon’s HYPERRAM for high-performance, low- power embedded applications Validated high-bandwidth, low-power memory for AMD Spartan UltraScale+ FPGA Technical validation ‒ AMD validates Infineon’s 64 Mb HYPERRAM pseudo-SRAM and HYPERRAM controller IP for Spartan UltraScale+ FPGA ‒ Provi
Slide 43: Green Industrial Power
Green Industrial Power 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 43
Slide 44: GIP at a glance
GIP at a glance GIP revenue and segment result margin FY25 revenue split by application [EUR m] Revenue Segment result margin Home Appliance CAGR 1% (FY21 – FY25) Heating, Ventilation, 10% Air condition 2,205 10% 1,934 Power 1,790 40% 1,542 1,631 Infrastructure 30% 21% 22% 18% 12% Automation & 25% D
Slide 45: Huge potential along entire green energy chain until 2030
Huge potential along entire green energy chain until 2030 according to IEA Net Zero scenario Generation Infrastructure Consumption $600bn annual Photovoltaic + 10,300 GW Grid network Heat pump +420m units investments +200k FC EV Wind power +3,300 GW Grid storage +2100 GW H2 Fuel cell1 +200k FC Truck
Slide 46: Green energy generation provides large business opportunities
Green energy generation provides large business opportunities Power semiconductor content by application 6000 [EUR per MW] [EUR per installation] Mainly SiC 5,000 5,000 Mainly IGBT 5000 4000 3,500 3,500 3000 2,500 2,000 2000 2,000 1,500 1,000 1000 0 60 500 600 0
Slide 47: Renewables are on average the cheapest source of energy
Renewables are on average the cheapest source of energy [USD/MWh] ⌀ 58-254 USD/MWh 250 -50% Levelized Cost of Energy (USD/MWh) 200 150 ⌀ 31-100 USD/MWh 100 50 0 Nuclear Gas Coal Solar 1 Solar + Storage1 Onshore Wind 1 Costs for Utility-scale installations USA Europe China Based on Wood Mackinzie LCO
Slide 48: ESS: Commercial and utility storage solutions with strong growth
ESS: Commercial and Utility Storage Solutions with strong growth potential Infineon’s semiconductor content for energy storage solutions (ESS) ‒ IGBT discretes ‒ SiC MOSFETs power ‒ Low & medium power modules ‒ High-power modules control & ‒ MCUs >€2,500 per MW connectivity ‒ Connectivity chips anal
Slide 49: Solid-state transformers: new application for semiconductors
Solid-state transformers: new application for semiconductors with significant additional market potential Conventional transformer Solid-State transformer (SST) EasyPACK ~40x lighter1 ~14x smaller1 ~50% faster ~20 t ~500 kg construction time Conventional transformer market Infineon expects that SST
Slide 50: Solid-state circuit breakers
Solid-state circuit breakers: increased safety, energy efficiency and reliability in power distribution Analog circuit breaker Digital solid-state circuit breaker Traditional electromechanical analog Enables smart energy management: circuit breakers protect electrical circuits - Ultra-fast overload
Slide 51: Adding CoolSiC JFET to MOSFETs
Adding CoolSiC JFET to MOSFETs: Infineon offers most comprehensive SSCB portfolio in the industry More than 20 SSCB key customers and first Design-Wins with CoolSiC JFET Q-DPAK with CoolSiC JFET Energy savings ✓ Provides ground-breaking ultra-low RDS(on) 1.5m Ω at 750 V and 2.3 mΩ at 1200 V VBDss Ro
Slide 52: Power & Sensor Systems
Power & Sensor Systems 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 52
Slide 53: PSS at a glance
PSS at a glance PSS revenue and segment result margin FY25 revenue split by application [EUR m]1 Revenue Segment result margin Others CAGR 7% (FY21 – FY25) 5% 4,208 Computing 4,070 30% 3,798 3,795 3,268 Industrial 35% 28% 25% 23% 16% 13% 5% Communications 10% 15% F
Slide 54: Significant acceleration of our AI revenues
Significant acceleration of our AI revenues due to most advanced technology and broadest portfolio Infineon is growing together with customers driven by significant AI investments Revenues from powering AI datacenters [EUR m] 3,000 In FY25, our AI server business achieved 2,500 2,500 10x >€700m n
Slide 55: AI leadership enabled by system-first thinking
Infineon’s AI leadership enabled by system-first thinking and strategic differentiation by design P2S System Broadest product Customer-centric Quality and understanding portfolio innovation Manufacturing Industry leading system Best-in-class performance Accelerating innovation- High reliability and
Slide 56: Architectural evolution from 125kW up to 1MW per rack
Infineon enables the architectural evolution from 125kW up to 1MW per rack PSUs within server rack 3-phase VDC power sidecar Hybrid microgrid Today ~125 kW/rack 2027+ ~600 kW+/rack 2029+ >1 MW/rack IT payload Power delivery & backup IT payload Power delivery IT payload Power delivery power through c
Slide 57: Infineon BOM per AI server rack up to $12k-$15k
Leading performance high density AI Server for accelerated compute – Infineon BOM per AI server rack up to between $12k and $15k Top of rack switches x1 $200-215 PSU (Power Supply Unit) x24 ~$120 x36 GPU Board (2 GPU + 1 CPU) Compute Tray ~$130 x10 Power x18 48 V Bus Switch Tray Delivery Converter x
Slide 58: 3-phase VDC power sidecar
3-phase VDC power sidecar – Infineon powers AI from grid to core for accelerated compute, driving further content growth x72 (18x4) Compute Blades Server x1 GPU Board Rack x72 Mother Board x2 x32 (8x4) HV IBC Switch Tray x288 Smart Network x30 Interface Cards PSU (Power Supply Unit) Power x30 Sideca
Slide 59: Energy efficient power semiconductors serving AI power conversion
With its energy efficient power semiconductors Infineon is serving all AI-related power conversion from grid-to-core Power delivery network losses in an average AI data center AC/DC 277 V AC – 48 V DC DC/DC 48 V – 12 V DC/DC 12 V – 1 V 1 AC 277 V 42 – 54 V . PFC 48 V/ 12V→5V 48V→12V . 12 V 208 AC
Slide 60: Innovative 3-phase PSU system solutions
Innovative 3-phase PSU system solutions leverage system expertise and IP to deliver industry-leading performance and efficiency Infineon’s solutions range from 3 kW to 30 kW 30 kW 27 kW 3-phase PFC 16+ kW 3-phase PSU 12 kW 3-phase PSU 8 kW 1-phase PSU η ~97.5% η ~97.5% 100+ W/in3 3.3 kW 1-phase PSU
Slide 61: Broad portfolio of HV & MV IBCs
Infineon offers a broad portfolio of HV & MV IBCs for current and future AI server rack architectures SAM IBC Market Infineon IBC Module for AI Meeting customer requirements [USD m] 1. With a wide range of IBC topologies, Infineon is serving a multitude of data rack configurations CAGR while ensurin
Slide 62: Highest-density VRM modules enable vertical power delivery
Highest-density VRM modules enable true vertical power delivery adjacent to the processor x2 >4 A/mm2 x2 >3 A/mm2 Substrate embedded 2.0 A/mm2 Backside Gen 3 power mounted 1.5 A/mm2 module 2027 Gen 2 power 1.0 A/mm2 2025 module 0.6 A/mm2 Gen 1 power 2024 module Chip embedded 0.4 A/mm2 2024 2021 Mold
Slide 63: Cutting edge vertical power delivery solutions
Infineon’s cutting edge vertical power delivery solutions significantly reduce power losses in AI data centers further Lumped PDN1 Discrete (Lateral) 90-140µ + Power stages, inductors and capacitors located next to the processor Lateral Power + Lowest cost, with established eco-system and quality r
Slide 64: We empower humanoids to sense, move, act and connect
We empower humanoids to sense, move, act and connect. Safe and secure. Processing Connectivity MCUs, motor control ICs, Wi-Fi, Bluetooth®, NFC, security ICs Ethernet, EZ-USB Power Storage Power switches incl. Si and GaN, DC-DC conversion, NOR-Flash, SRAM ~$500 voltage regulators Infineon’s addressab
Slide 65: Connected Secure Systems
Connected Secure Systems 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 65
Slide 66: CSS at a glance
CSS at a glance CSS revenue and segment result margin FY25 revenue split by application [EUR m] Revenue Segment result margin Industrial and Consumer IoT CAGR 0% (FY21 – FY25) Industrial IoT 2,046 Smart cards Home 1,822 Appliance 1,397 1,506 1,418 Identification 45% 24% Smart Home 21% 55% Payment 13
Slide 67: Providing the essential building blocks
Providing the essential building blocks compute, connectivity, security, and software Consumer Industrial Automotive Compute Software PSOC and XMC DEEPCRAFT Studio and micro-controllers allow ModusToolbox software customers to enable smart, simplifies and accelerates Sense Actuate connected products
Slide 68: MCUs at the heart of every IoT and Edge AI application
Infineon’s MCUs at the heart of every IoT and Edge AI application New compelling MCU platforms PSOC Edge – Enables a new generation of responsive machine learning devices PSOC PSOC PSOC Edge Control Connect − Broad application range in Edge AI, IoT, Consumer, and Industrial − Strength in low power,
Slide 69: Software with maximal ease of use
Software with maximal ease of use DEEPCRAFT Studio ModusToolbox − Infineon’s Edge AI development platform − Infineon’s modern, extensible − Data collection & pre- development system processing, model training, model conversion & − Collection of development deployment tools, libraries, and embedded r
Slide 70: Broad wireless portfolio for IoT, industrial and automotive
Enabling connectivity with Infineon’s broad wireless portfolio for IoT, industrial, and automotive applications Wireless connectivity portfolio & advancements in ultra-wideband Wi-Fi AIROC Bluetooth® AIROC − Comprehensive Portfolio: Wi-Fi 4,5,6/6E − Full-featured Bluetooth® portfolio and connected M
Slide 71: Comprehensive end-to-end embedded AI solution
Infineon provides a comprehensive end-to-end embedded AI solution - CSS provides most essential building blocks Edge AI solution offering Customers‘ benefits Customer application − Software perfectly tailored to Infineon In-house AI Software DEEPCRAFT Studio hardware ensures peak performance and sim
Slide 72: Quantum computing and post-quantum cryptography
As quantum computing rises and introduces high security risks, Infineon serves as a trusted advisor in the PQC landscape. Computing power of quantum computers Infineon‘s post-quantum cryptography approach Computing power First universal quantum Infineon is the first company to Infineon TEGRION produ
Slide 73: Selected financial figures
Selected financial figures 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 73
Slide 74: Strong presence in all regions; well-balanced customer portfolio
Strong presence in all regions; well-balanced customer portfolio; no customer represents more than 10% of total sales FY25 revenue by region Revenue by sales channel Distribution Top-10 direct customers1 partners1 EMEA (excl. Americas Germany) 12% 14% Japan 9% Germany 10% Top-10 direct customers Dis
Slide 75: Group financial performance
Group financial performance Revenues and Segment Result USD exchange rate [EUR m] Segment result Revenues Segment result margin Average revenue exchange rate +7% -7% Q1 Q4 Q1 3,943 FY25 FY25 FY26 3,704 3,662 3,591 3,424 ø USD/EUR 1.07 1.17 1.16 Order backlog1 [EUR bn] 20
Slide 76: Automotive (ATV)
Automotive (ATV) Revenues1 Segment Result1 [EUR m] Revenues [EUR m] Segment result Segment result margin +4% -5% 1,858 1,870 1,921 1,752 1,821 430 385 403 371 343 19.6% 20.7% 19.8% 22.4% 22.1% Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 ‒ Sequential revenue decrea
Slide 77: Green Industrial Power (GIP)
Green Industrial Power (GIP) Revenues1 Segment Result1 [EUR m] Revenues [EUR m] Segment result Segment result margin +9% -21% 442 409 377 349 320 72 62 41 36 31 15.2% 16.3% 11.3% 10.9% 8.9% Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 ‒ Sequential revenue declines
Slide 78: Power & Sensor Systems (PSS)
Power & Sensor Systems (PSS) Revenues1 Segment Result1 [EUR m] Revenues [EUR m] Segment result Segment result margin +16% -3% 1,210 1,171 197 204 1,075 176 1,007 999 167 135 16.6% 18.3% 17.4% 13.5% 14.5% Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1 FY25 Q2 FY25 Q3 F
Slide 79: Connected Secure Systems (CSS)
Connected Secure Systems (CSS) Revenues Segment Result [EUR m] Revenues [EUR m] Segment result Segment result margin -7% -13% 356 369 344 349 321 45 40 39 30 23 8.7% 11.2% 11.2% 12.2% 7.2% Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 ‒ Revenue decrease driven by a
Slide 80: Gross margin and Opex
Gross margin and Opex Gross profit1 R&D1 SG&A [EUR m] [EUR m] [EUR m] 1,515 1,504 1,462 1,343 1,391 626 544 559 560 565 395 410 401 409 376 39.2% 38.7% 40.9% 38.1% 39.9% 15.9% 15.6% 15.1% 14.3% 17.1% 11.5% 10.5% 11.1% 10.2% 11.2% Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1FY25 Q2 FY25 Q3 FY25 Q4 FY25
Slide 81: Investments, Depreciation & Amortization and Free Cash Flow
Investments, Depreciation & Amortization and Free Cash Flow Investments Depreciation & Amortization Free Cash Flow [EUR m] [EUR m] [EUR m] 731 582 288 174 487 483 484 478 470 451 463 -237 -1,276* -199 442 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1 FY25 Q2 FY25
Slide 82: Working capital, in particular trade working capital components
Working capital, in particular trade working capital components Working capital1 Inventories [EUR m] [EUR m] [days] 4,385 4,333 4,280 4,485 4,141 3,464 3,424 3,716 2,955 3,275 190 177 176 183 153 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Q1
Slide 83: Development of liquidity and debt
Development of liquidity and debt Capital structure [EUR m] Gross Cash Gross Debt Net Cash/Debt 1,957 2,102 1,687 1,849 1,539 -4,943 -2,986 -4,984 -3,445 -5,516 -3,829 -6,829 -4,727 -6,829 -4,980 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights
Slide 84: Return on capital employed
Return on capital employed Historical development 16.6% 12.2% 12.6% 8.4% 8.5% 4.9% 3.0% FY19 FY20 FY21 FY22 FY23 FY24 FY25 2026-02-04 Copyright © Infineon Technologies AG 2026. All rights reserved. 84
Slide 85: Earnings-per-share and total cash return
Earnings-per-share and total cash return Development of earnings-per-share (EPS) from continuing operations [EUR cent] EPS basic EPS adjusted 34 37 34 35 33 22 19 18 18 18 Q1 FY25 Q2 FY25 Q3 FY25 Q4 FY25 Q1 FY26 Total cash return to shareholders via d
Slide 86: Maturity profile
Maturity profile Calendar years 2026 to 2033 [EUR m; USD m; nominal values] $1,000 €1,000 $350 €750 $350 €600 €750 €750 €650 €500 $350 $235 $350 $250 2026 2027 2028 2029 2030 2031 2032 2033 Corporate bonds under the EMTN program US PP 2016 Notes Hybrid bond1 US PP 2021 Notes (Jun 2027, Acquisition f
Slide 87: Conservative financial policy and investment-grade rating
Conservative financial policy and strict commitment to investment-grade rating are the basis for through-cycle flexibility Financial Policy Targets Status Quo (LTM 31 December 2025) Gross Cash1 At least 10% of revenue3 12% of revenue → €1.8bn Gross Debt2 ≤ 2.0x EBITDA 2.0x EBITDA Comfortable ‒ Flexi
Slide 88: Cinfineon
Cinfineon
Slide 89: Disclaimer
Disclaimer Disclaimer This presentation contains forward-looking statements and/or assessments about the business, financial condition performance and strategy of the Infineon Group. These statements and/or assessments are based on assumptions and management expectation resting upon currently availa
Slide 90: Glossary
Glossary AC alternating current MCU microcontroller unit AD automated driving LV low voltage ADAS advanced driver assistance system MEMS micro electro-mechanical system AI artificial intelligence MOSFET metal-oxide silicon field-effect transistor BBU battery back-up unit MPU micro processing unit BE
Slide 91: Notes and ESG footnotes
Notes and ESG footnotes Investments = 'Investments in property, plant and equipment' + 'Investments in other intangible assets and capitalized developments costs' Adjusted Free Cash Flow Margin = Adjusted for large investments in frontend buildings and major M&A transactions, for full definition see
Slide 92: Financial calendar
Financial calendar Date Event Location 19 February 2026 Annual General Meeting 2026 Munich 26 February 2026 SIG Fifteenth Annual Technology Conference New York 3 March 2026 Morgan Stanley TMT Conference San Francisco 5 – 6 March 2026 Oddo BHF TMT Forum virtual 9 March 2026 BNP Paribas Exane TMT Conf
Slide 93: Investor Relations contacts
Investor Relations contacts Alexander Foltin Daniel Györy Executive Vice President Senior Director Finance, Treasury & Investor Relations Team lead Investor Relations +49 89 234-23766 +49 89 234-35078 alexander.foltin@infineon.com daniel.gyoery@infineon.com Isabell Diel Alexander Groschke Senior Man