Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Technical Presentation (April 2015)

15 slides from Infineon Technologies's technical presentation, April 2015

  1. Slide 1: TO-Leadless

    TO-Leadless Optimized for high current applications

  2. Slide 2: Package for high current applications

    Package for high current applications TO-Leadless is a perfect fit for applications with high power & high reliability requirements  Forklift  Light electric vehicles (LEV) such as e-scooter, µ-cars  PoL (Point of Load)  Telecom

  3. Slide 3: Differentiation of Infineon's high power packages @ a glance

    Differentiation of Infineon’s high power packages @ a glance D²PAK D²PAK 7pin TO-LeadLess Power Density Current Capability Thermal Performance Height Reliability

  4. Slide 4: More details on parameters of high current packages

    More details on parameters of high current packages D²PAK D²PAK 7pin TOLL 30V 3.4 mΩ 0.9 mΩ 0.4 mΩ lowest RDS(on) 60V 1.9 mΩ 1.0 mΩ 0.75 mΩ 100V 2.7 mΩ 2.5 mΩ 2.0 mΩ 150V 7.2 mΩ 6.5 mΩ 5.9 mΩ Package Resistance 0.74 mΩ 0.44 mΩ 0.25 mΩ Current Capability 120A 180 A 300 A Footprint 150 mm² 150 mm² 115

  5. Slide 5: TO-Leadless a replacement for D²PAK 7Pin

    TO-Leadless a replacement for D²PAK 7Pin 4.4mm 2.3mm 9.9mm 11.7mm 10.0mm 15mm Footprint: 150 mm² Footprint: 115 mm² 30% 50% 60% Footprint Height Space Reduction Reduction reduction

  6. Slide 6: TO-leadless offers advantages where high level of parallelization is required

    TO-leadless offers advantages where high level of parallelization is required 150V Voltag Class 100V 60V TOLL D²PAK 7pin 30V SuperSO8 low high Level of Parallelization

  7. Slide 7: Improved Reliability: Bottleneck Solder Joint / Current density

    Improved Reliability: Bottleneck Solder Joint / Current density D2PAK 7Pin TO -LeadLess Bnom =0.8mm bnom =0.6mm Lnom =1.9mm Lnom =2.65mm L3nom =0.7mm enom =1.2mm Contact/Solder area D2PAK 7Pin: Contact/Solder area TOLL: =2.65mm*0.6mm*5 ~1.9mm*0.8mm*7+0.7mm*0.4mm*6 = 7.95mm2 = 12.32mm2 TOLL: Much big

  8. Slide 8: Possibility of optical inspection

    Possibility of optical inspection The TO-LeadLess packages enables a visual inspection due to Tin plated grooved leads Trapezoid Groove guaranteed wetting Visible solder joint Pin of TO-LeadLess Groove Tracks onPCB PCB

  9. Slide 9: When do we recommend TO-Leadless & why?

    When do we recommend TO-Leadless & why? high current applications thermal which require best thermal behavior behavior when space reduction in the space application is required applications which require efficiency highest efficiency and best EMI behavior

  10. Slide 10: TO-Leadless a perfect combination of low package area and thermal resistance

    TO-Leadless a perfect combination of low package area and thermal resistance thermal behavior Hotter 2.0 space Thermal Resitance (K/W) S3O8 DPAK 1.5 1.0 CanPAK™ S/M SuperSO8 D²PAK 7pin 0.5 D²PAK TO-220 Cooler TO-Leadless Smaller Larger 25 50 100 150 200 250 300 350 Package Area (mm²)

  11. Slide 11: TO-LeadLess offering lowest RDS(on)

    TO-LeadLess offering lowest RDS(on) efficiency TO-LeadLess D²PAK 7pin For the first time offering outstanding low RDS(on)

  12. Slide 12: TO-LeadLess portfolio

    TO-LeadLess portfolio Package Type VDS [V] RDS(on) max [mΩ] IPT004N03L 30 0.04 IPT007N06N 60 0.7 IPT020N10N3 100 2.0 IPT059N15N3 150 5.9

  13. Slide 13: Summary: Why TO-LeadLess?

    Summary Why TO-LeadLess?  A leadless package with 60% space reduction  Highest current capability: up to 300A  Very low RDS(on) – up to 30% lower RDS(on)  Enables a visual inspection due to Tin plated grooved leads  Better EMI due to reduced parasitic inductances (cut by half)  High reliabilit

  14. Slide 14: If you have any further questions…

    If you have any further questions… Further information you find on our homepage: www.infineon.com/toll

  15. Slide 15: Infineon

    Cinfineon Innovative semiconductor solutions for energy efficiency, mobility and security.

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