Visual Photonics Epitaxy Co., Ltd. · TWSE:2455
Visual Photonics Epitaxy — 2026 Q1 Spring Investment Forum
11 slides from Visual Photonics Epitaxy's conference presentation, Mar 3, 2026
Slide 1: Company Profile
Company Profile World-class leading edge with MOCVD 1
Slide 2: Core Technology
Core Technology MOCVD（有機金屬氣相沉積法） - Metal Organic Chemical Vapor Deposition 2
Slide 3: Core Technology
Core Technology Production MOCVD Metal Organic Chemical Vapor Deposition Reactor Through the organic metal chemical vapor deposition method, the Way to semiconductor film is grown on the substrate, and the epitaxial Produce layer is accurately controlled through the real-time monitoring of the machi
Slide 4: Semiconductor (by Material)
Semiconductor（by Material） Element Si ,Ge Semiconductor IV-IV SiC, SiGe III-V GaAs, InP, GaN, GaP, GaSb... Compound II-VI ZnSe, ZnS, CdS, etc. Period Column II III IV V VI Be 鈹 B硼 C碳 N氮 O氧 2 Beryllium Boron Carbon Nitrogen Oxygen 二元化合物 Binary : GaAs, InP, GaP,GaN, etc. Mg 鎂 Al 鋁 Si 矽 P磷 S硫 3 Magnesi
Slide 5: Chemical Reaction During Epitaxy
Chemical Reaction During Epitaxy 化學反應式： 主要原物料: MO Source + Hydride + Carrier Gas：H2 AsH3 : Arsine TEAl : Tri-ethyl-Aluminum ( C2H5 )3Al PH3 : Phosphine TMGa : Tri-Methyl-Gallium ( CH3 )3 Ga SiH4 : Silane TMIn : Tri-Methyl-Indium ( CH3 )3In Si2H6 : Disiline DETe : Di-ethyl-Tellurium ( C2H5 )2Te H2Se
Slide 6: Advantages of Compound Semiconductor
Advantages of Compoundsemiconductor 1. High Electron Mobility高電子移動速率(5.7x higher than CM0S) 2. High Frequency Response高頻率響應 3. Wide Band Width 寬幅之頻寬 4. High Linearity高線性度 5. High Power高功率 6. Alternative Choice of Material材料選擇多元性 7. 抗輻射 適用於微電子產品－HBT、pHEMT、BiHEMT、GaN on XX 光電子產品－ PIN（PD、APD）、VCSEL、LD、
Slide 7: GaAs in Wireless Communication Supply Chain
GaAs in Wireless Communication Supply Chain IDM：Qorvo, Skyworks Sumitomo, Freiberger, AXT Fabless ：Avago, 2~6 ”GaAs Substrate Qualcomm, Richwave, GaAs Epi- Wafer Microelectronics 磊晶片 IC Process Wireless Communication Substrate VPEC is a Pure Foundry： MOCVD Reactor Epi Provider WIN, AWSC IC Package &
Slide 8: 2022-2025 Financial Result
2022-2025 Financial Result 2025 % 2024 % 2023 % 2022 % Revenue 3,380,143 100% 3,241,217 100% 2,694,104 100% 2,603,629 100% Gross margin 1,219,726 36% 1,278,964 39% 1,108,914 41% 1,089,007 42% Operating 669,263 20% 721,214 22% 542,069 20% 579,950 22% Profit Non- operating -1,912 0% 96,460 3% -347 0%
Slide 9: 2026 Outlook
2026 Outlook 的内容入您的内容输入您的内 容输入您的内容输入您的内容 5G Mobile 内容输入您的内容. 01 Penetration WiFi 7 02 Wireless RF 03 V2X 04 IoT Smart Link (4G PA) VPEC Proprietary and Confidential 9
Slide 10: 2026 Outlook
2026 Outlook Data Center 01 High Speed Connectivity PD for 800G VCSEL for 400G & 800G 02 3D-sening VCSEL / PD Opto electronics AR/VR VCSEL 03 機器視覺 LEO Solar Cell Future Driving Engines 04 P-sensor、3D Sensing 、 ToF Car LiDAR (LD/PD) UAV AI glass 10 VPECCPO Proprietary and Confidential
Slide 11: Awakening the AI Terminals: Sense, Compute, Move
Awakening the AI Terminals: Sense, Compute, Move Source：Copilot VPEC Proprietary and Confidential 11
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