Infineon Technologies AG · XETR:IFX
Infineon Technologies — Technical Presentation (January 2014)
20 slides from Infineon Technologies's technical presentation, January 2014
Slide 1: RC-H5 1350V Next Generation Reverse Conducting IGBT
RC-H5 1350V Next Generation Reverse Conducting IGBT January 2014
Slide 2: Overview
Overview What is the RC-H5? What is driving the induction cooking market? How does the RC-H5 help customers meet their needs? When & where can I get more information? 2014-01-10 Copyright © Infineon Technologies AG 2014. All rights reserved. Page 2
Slide 3: What is RC-H5?
What is RC-H5? Next generation Reverse Conducting discrete IGBT for resonant switching applications, like Induction Cooking Builds on the successful RC-H3 technology Designed to meet specific trends in IH applications Extends performance leadership First device in the RC-H5 is IHW20N135R5:
Slide 4: Induction Cooking Application Landscape
Induction Cooking Application Landscape Half Bridge Topology Single Ended Topology Most common applications: Most common applications: Multi-Hob Induction Stoves Table Top Induction Cooker Inverterized Microwave Ovens Induction Rice Cooker Inverterized Microwave Ovens 2014-01-10 Copyri
Slide 5: RC-H5 Offers a Comprehensive Solution with No Compromises
RC-H5 Offers a Comprehensive Solution with No Compromises Better Higher Efficiency Reliability RC-H5 = Complete System Leadership Compact Lower Design System (Thermal Costs Performance) 2014-01-10 Copyright © Infineon Technologies AG 2014. All rights reserved. Page 5
Slide 6: IGBT Topologies in Induction Heating and Microwave Ovens
IGBT Topologies in Induction Heating and Microwave Ovens Half Bridge Topology: 600V+ Single Ended Topology: 1200V+ P+ SW1 SW2 SW1 Reverse Conducting IGBTs designed specifically for soft switching topologies RC-H family of devices optimized for the requirements of Induction Cooking systems 2014-01-10
Slide 7: Reverse Conducting IGBTs Overview
Reverse Conducting IGBTs Overview Technology Concept Free-wheeling diode monolithically integrated with IGBT chip “RC-H”: soft switching for resonant topologies “RC-Drives/Drives Fast”: hard switching for consumer drives Same DC current rating of diode and IGBT 2014-01-10 Copyright © Infin
Slide 8: IGBT Portfolio Induction Cooking
IGBT Portfolio Induction Cooking Table Top Cookers, Multi-Hob Stoves, Induction Rice Cookers, Inverterized Microwave Ovens, Multi-function Printers TO-247 Continuous Collector 600V 1100V 1200V 1350V 1600V Current at Tc = 100°C 15A IHW15N120R3 20A IHW20N120R3 IHW20N135R3 IHW20N120R5 IHW20N135R5 25A I
Slide 9: RC-H5 Targeted Application Leadership
RC-H5 Targeted Application Leadership IHW20N135R5: Created to set new benchmarks in 3 key focus areas for Induction Cooking Efficiency Reliability Design Benefits lower losses due to reduced turn-on spike higher switching less switching losses current frequencies enable and improved diode system opt
Slide 10: IHW20N135R5 Focus on: Efficiency
IHW20N135R5 Focus on: Efficiency Industry leading performance – up to 30% improvement over competitor devices Designed for maximum efficiency: Combines best in class switching losses plus low on-state losses Improved diode performance ― Reduced Vf dependency on applied gate voltage results in
Slide 11: System Efficiency - RC-H5 Industry Leadership
System Efficiency - RC-H5 Industry Leadership 2014-01-10 Copyright © Infineon Technologies AG 2014. All rights reserved. Page 11
Slide 12: Efficiency – Reduced Tail Current for Improved Conduction Losses
Efficiency – Reduced Tail Current for Improved Conduction Losses 250 2.5 200 2 RC-H5 tail-current reduction 150 1.5 IC (A), UGE (V) UCE (V) RC-H5, U [V] 100 1 RC-H3, U [V] RC-H5, I [A] 50 0.5 RC-H3, I [A] 0 0 -50 -0.5 0 0.5 1 1.5 2 2.5 Soft-switching, 600V, 20A, 10 Ohm, 25°C t (µs) 2014-01-10 Copyri
Slide 13: IHW20N135R5 Focus on: Reliability
IHW20N135R5 Focus on: Reliability Turn-on spike current reduced by 10% Less stress for passive components in system Lower EMI – less filtering requirements Improved thermal performance Results in lower case temperature, especially under bad cooling conditions and high ambient temperatures
Slide 14: System Reliability Improvement: Turn-on Peak Current Reduction
System Reliability Improvement Turn-on peak current reduction of the RC-H5 IHW20N135R3 Ic peak = 170A Competitor 1 Ic peak = 284A 7% further reduction of max peak current IHW20N135R5 Ic peak = 162A 175% higher peak current than RC-H5 Low inductance characterization board Tj = 25°C, Cres
Slide 15: Reliability: Thermal Performance Improvements
Reliability: Thermal Performance Improvements 110 12% reduction in temperature 100 90 80 70 60 50 Thermal test IHW20N135R3 △Tc IHW20N135R5 △Tc IHW20N135R3 △Tplastic-mold IHW20N135R5 △Tplastic-mold Test with restricted airflow at maximum system power rating 2014-01-10 Copyright © Infineon Technolog
Slide 16: IHW20N135R5 Focus on: System Design
IHW20N135R5 Focus on: System Design Reduced losses offer opportunity for increased system switching frequency Higher frequencies up to 30kHz offer efficiency improvements or system cost reductions from smaller coil sizes Updated form factors made possible with smaller coils, less cooling requi
Slide 17: RC-H5: Next Generation Reverse Conduction IGBT
RC-H5: Next Generation Reverse Conduction IGBT First device available: IHW20N135R5 - 20A, 1350V Optimal combinations of lowest switching losses 1200V Trade-off optimization 0,07 up to 30 % reduction! 0,065 RC-H2 RC-H3 RC-H5 Competitor low conduction losses 0,06 Eoff [mJ/A] 0,055 0,05 0,045
Slide 18: RC-H5 1350V House of Features & Benefits
RC-H5 1350V House of Features & Benefits Company brand RC-H5 Product brand 1350V Lower system replacement costs for Value added manufacturer. Lower power consumption, operating costs, and fan noise for end user. Main benefits Improved Efficiency Better Reliability Higher frequency designs (to 30kH
Slide 19: More Information: www.infineon.com/rch5
More Information: www.infineon.com/rch5 2014-01-10 Copyright © Infineon Technologies AG 2014. All rights reserved. Page 19
Slide 20: Cinfineon
Cinfineon Innovative semiconductor solutions for energy efficiency, mobility and security.
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