Spirox Corporation · TWSE:3055
Spirox — Future Trend Industry Investment Forum (Honyuan Securities) (September 2024)
21 slides from Spirox's conference presentation, Sep 5, 2024
Slide 1: Spirox Group
Spirox Group Professional Semiconductor Equipment Provider Delivering Smarter Solutions Spirox Confidential
Slide 2: Safe Harbor Notice
Safe Harbor Notice This presentation contains "forward-looking statements" and based on our own information and information from other sources we believe to be reliable. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implie
Slide 3: Agenda
Agenda • Company Profile & Product Portfolio • Financial Review • Q&A Spirox Confidential 3
Slide 4: Overview
Overview Hsinchu, Taiwan │ HQ • Own Products • Semiconductor Equipment Distribution • Board Repair Service Subsidiary Jetek Technology Corp. Spirox Technology Shanghai • System Integration Services • Semiconductor Equipment Distribution • Customized Test Solutions • Board Repair Service Southport Co
Slide 5: Core Competencies
Core Competencies Business Philosophy Build a customer-oriented culture and set win-win goals with customers and partners. Industry Experience With over 30 years of experience in semiconductor industry, Spirox has a strong and stable customer base. Professional Team • Years of service: • Education:
Slide 6: Assembly and Test + Quality Assurance Solutions
Assembly and Test + Quality Assurance Solutions Chip Probing IC Package IC Final Testing IC Process & Quality Assurance ATE Handler Prober Chuck Test Interface MicroLED Inspection Heat Sink Automatic Debond TCB Bonder Blade Dicing Saw Vacuum Reflow Reflow system Plasma Laminator Measurement Warpage
Slide 7: Silicon Photonics On-Wafer Measurement
Silicon Photonics On-Wafer Measurement TSMC President C.C. Wei mentioned the development progress of silicon photonics Probe Pin & Optical Waveguide technology at the North America Technology Symposium. He stated that by 2025, TSMC will complete COUPE validation to support small form-factor pluggabl
Slide 8: Transforming Spirox
Transforming Spirox • Expand the development of Spirox own products to enter markets beyond the Greater China • Start with automotive compound semiconductor • SP3055A Non-destructive Inspection System (JadeSiC-NK) • SP3055S Non-contact Whole Wafer / MicroArea 3D Stress Inspection and Analysis (JadeS
Slide 9: SiC Substrate: Crystal Growth, Cutting, Grinding and Polishing
SiC Substrate: Crystal Growth, Cutting, Grinding and Polishing SiC boule SiC wafer Bulk SiC Wafer growth polishing SiC Epi-wafer Dies-on-wafer Back-End Front-End Epitaxy level 0 Power module Bare-die Packaged devices Back-End level 1 Source: WMT Spirox Confidential 9
Slide 10: Current SiC Substrate Challenges
Current SiC Substrate Challenges • The overall effective output of the industry is insufficient and imbalanced. • Lack of control over the quality and defects of ingots and substrates (especially killing defects). • No effective non-destructive inspection technology for killing defects in the substr
Slide 11: Destructive KOH Etching for SiC Substrate Inspection
Destructive KOH Etching for SiC Substrate Inspection Top Substrate KOH Substrate Cutting Grinding Boule Ingot Polishing Bottom Substrate Sampling of Substrate’s surface Sampling of Substrate’s surface after KOH etching. after KOH etching. Spirox Confidential 11
Slide 12: Destructive KOH Etching for SiC Substrate Inspection
Destructive KOH Etching for SiC Substrate Inspection Top Substrate KOH Substrate Cutting Grinding Boule Ingot Polishing Bottom Substrate Issues with current KOH method: 1. Destructive inspection leads to waste of production capacity and costs. Consistency in chemical etching accuracy is difficult to
Slide 13: Compound Semiconductor Solutions
Compound Semiconductor Solutions JadeSiC-NK JadeSA-WBG Non-Destructive Inspection System 3D Stress Inspection & Analysis System Advanced NLO (non-linear optics) technology Wafer scan on surface and in depth for stress Non-destructive inspection technology distribution Killer defects (BPD, TS
Slide 14: Current Business Model
Current Business Model Upstream: Ingot / Substrate The upstream suppliers provide SiC substrates with defect density grades determined by highly inaccurate KOH etching directly according to the downstream manufacturers' requirements. Downstream: Epitaxy / Device / Module Spirox Confidential 14
Slide 15: Future Business Model
Future Business Model Upstream: Ingot / Substrate SiC Testing House Provide complete defect (BPD/TSD/TED) report for Downstream: Epitaxy / Device / Module every SiC substrate from the testing house or test production lines to optimize the process and improve yield. Spirox Confidential 15
Slide 16: Financial Review
Financial Review Delivering Smarter Solutions Spirox Confidential
Slide 17: Summary of Consolidated Cash Flow Highlights & Financial Ratio
Summary of Consolidated Cash Flow Highlights & Financial Ratio Adjust the held financial structure and debt solvency well business strategy and develop self- owned products. Spirox Confidential 17
Slide 18: Summary of Consolidated Balance Sheet
Summary of Consolidated Balance Sheet Asset-Light Operation Spirox Confidential
Slide 19: Summary of Statements of Consolidated Income (YoY & QoQ)
Summary of Statements of Consolidated Income (YoY & QoQ) (1) A high proportion of revenue comes from Mainland China, making it significantly impacted by geopolitical factors. Business with caution, and clients are carefully selected in China. (2) Comprehensive Lean Cost Management. Spirox Confidenti
Slide 20: Q & A
Q&A Delivering Smarter Solutions Spirox Confidential
Slide 21: Thank you.
Thank you. Delivering Smarter Solutions Spirox Confidential
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