Ensilica Plc · LSE:ENSI

Ensilica — Investor Presentation (July 2026)

20 slides from Ensilica's investor presentation, July 2026

  1. Slide 1: Corporate overview July 2026

    Corporate overview July 2026

  2. Slide 2: Disclaimer

    ►Disclaimer The information contained in this document (“Presentation”) and the presentation made to you These forward-looking statements are not guarantees of future performance of the Company and verbally has been prepared by EnSilica Plc (the “Company”). EnSilica Plc is a UK company quoted on refl

  3. Slide 3: Who We Are

    ► ENSILICA LOCATIONS: UNITED KINGDOM: Oxford, Bristol, She eld, Cambridge GERMANY: Munich ► Who We Are  Fabless chipmaker specialist in complex mixed-signal HUNGARY: Budapest ASICs (Application-Specific Integrated Circuits) and ASSPs TAIWAN (Application-Specific Standard Products) Kaohsiung  Focused

  4. Slide 4: Firm foundations for future growth

    ►Firm foundations for future growth Founded Supply chain 2016 2001 EnSilica expansion 2013 2019 2021 2025 2023 Established Acquired Debt Acquired O cial Acquired High-end funding Brazil TSMC Budapest front-end EnSilica Oxford India RF & secured team partner team digital design consultancy analogue t

  5. Slide 5: What Does "Fabless" Mean?

    ►What Does “Fabless” Mean? A fabless company designs and sells semiconductors — while outsourcing the costly manufacturing to specialist foundries. IDM FABLESS FOUNDRY Integrated Device Manufacturer Design-only model Pure-play manufacturer Designs and manufactures its own chips in-house. Designs and

  6. Slide 6: Business Model: from NRE to recurring silicon revenue

    ► Business Model: from NRE to recurring silicon revenue Design wins generate NRE (Non-Recurring Engineering) first, then create long-life supply opportunities and reusable IP ASIC PRODUCT MODEL ASSP PRODUCT MODEL Customer funded NRE (one customer) EnSilica internal investment with lead-customer/grant

  7. Slide 7: Recent financial momentum

    ►Recent financial momentum FY26 trading update & FY27 management expectations demonstrates continued transition from design-led revenue to design-and-supply revenues FY2026 (unaudited) FY2027 (guidance)* Revenue Revenue £27.5m £32m–£34m ▲ c.51% vs FY25 ▲ c.16–24% vs FY26 EBITDA EBITDA £4.7m £5.5m–£6.

  8. Slide 8: Progression of Chip Portfolio to Long-Term Supply & Revenue Growth

    ► Progression of Chip Portfolio to Long-Term Supply & Revenue Growth MARKET DESIGN POST TAPE OUT CHIP SUPPLY Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 1 Automotive 2 Aerospace 3 Industrial 4 Industrial 5 Space 6 Industrial 7 Space* 8 Space 9 Space* 10 Space* 11 Healthcare* 12 AI Data Centres 13 Industrial 14 I

  9. Slide 9: One core capability, multiple high-value markets

    ► One core capability, multiple high-value markets Space & SatCom Automotive Industrial Leading growth opportunity Delivering at scale Market-leading customers RF, Beamforming, NTN modem, Safety, sensing & control Safety, sensing & control Position Navigation & Timing → Same core capability → Di ere

  10. Slide 10: The space opportunity — and EnSilica's role

    ► The space opportunity — and EnSilica's role A multi-decade SatCom growth cycle Where EnSilica specialises $98bn → $223bn User Terminals Full Ka/Ku beamformer + 5G NTN modem SatCom market 2025–2033, growing at 11% CAGR chipset What's driving the market ▸ Sovereign & resilient connectivity demand Pa

  11. Slide 11: Satellite User Terminal ASSPs

    ►Satellite User Terminal ASSPs Market growth – Large opportunity in SatCom user terminals with the SAM scaling 5 times by 2030 2025 – INITIAL DEPLOYMENTS 2028 – DEPLOYMENT & TESTING 2030 – MASS ADOPTION SAM: ~$2B1 SAM: ~$3B+1 SAM ~$650M Starlink Starlink Starlink Amazon LEO Amazon LEO Amazon LEO Eut

  12. Slide 12: Satellite Payload & PNT

    ►Satellite Payload & PNT Digital beamforming payloads and resilient PNT Payload Positioning, Beamforming Navigation & Timing  Digital beamforming ASICs for  Multi-band and constellation LEO/MEO payloads support  Proven by AST SpaceMobile  Resilient to jamming and delivery interference → Commerci

  13. Slide 13: SatCom traction and funding

    ►SatCom traction and funding Strong technical validation with operators, OEMs and space agencies. 4 Satellite terminal chips sampling with di erent customers 3 Major operator engagements for terminal ASSP $50m User terminal ASSP design win with major European satellite operator $30m Lead customer an

  14. Slide 14: Automotive & industrial and EnSilica's role

    ► Automotive & industrial and EnSilica's role Electrification, ADAS & automation Where EnSilica specialises $77bn → $133bn Automotive chips · 2025–30 · ~11% CAGR Motor/ Actuator/ Sensing Power Management $99bn → $137bn  High voltage, gate-drivers  High voltage, gate-drivers Industrial chips · 2025–

  15. Slide 15: Automotive & Industrial: proven scale and delivery

    ►Automotive & Industrial: proven scale and delivery These markets have validated the same core capability in high-reliability, long-life, mixed signal systems. 10M+ $40m $31m $75m Automotive chassis Chassis controller Actuator /motor Sensor + Arm ASIC controller ASICs supply contract over controller

  16. Slide 16: Safe & secure silicon for critical systems

    ►Safe & secure silicon for critical systems Communication, Industrial and Automotive systems require safety, cybersecurity and long-life supply.  Legislation, including the EU Cyber Resilience Act, is raising the minimum-security baseline required in semiconductor devices  This raises the cybersec

  17. Slide 17: Photonics

    17 ►Photonics What Are Photonic Microchips? Photonic Integrated Circuits (PICs) move data with light instead of electrons — delivering far higher speed, lower power and less heat than conventional chips (which still handle control and interfacing). Market Opportunity MARKET SIZE: GROWTH RATE: MARKET

  18. Slide 18: Flexible engagement models to satisfy customer needs

    ►Flexible engagement models to satisfy customer needs Customers can engage at di erent levels depending on IP ownership, risk, volume and supply requirements. Design services Manufacturing Turnkey ASIC Platform / ASSP  Customer owns Services  Customer funds design  EnSilica IP platform product 

  19. Slide 19: Investment case

    ►Investment case Business model Re-usable IP is Space: leading the Truly scalable in motion key way Supplying reliably at scale, Selling one ASSP to multiple Operational leverage growing as current and future chip Operating in dynamic, fast-growing backed by a strong balance sheet customers is game-

  20. Slide 20: www.ensilica.com

    www.ensilica.com EnSilica plc

EnSilica — Investor Presentation (July 2026) on 6ix