Micron Technology, Inc. · NASDAQ:MU

Micron Technology — Reg A Offering (August 2016)

9 slides from Micron Technology's offering presentation, Aug 9, 2016

1. Slide 1: 3D NAND and UFS for Mobile

   3D NAND and UFS for Mobile High-Performance 32GB Mobile Memory ©2016 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Statements regarding pr

2. Slide 2: Micron 3D NAND Technology Summary

   Micron 3D NAND Technology Summary High Capacity The thin 32-layer technology allows for high capacity solutions (MLC 64Gb, MLC 256Gb, TLC 384Gb) by vertically adding layers to the 3D stack without increasing the footprint Proven Technology: Floating Gate Micron 3D NAND uses a floating gate cell, pro

3. Slide 3: Micron Mobile 3D NAND Memory

   Micron Mobile 3D NAND Memory BREAKTHROUGH STORAGE PERFORMANCE, POWER AND RELIABILITY High Performance Enhanced Reliability Up to 30% faster sequential Unique floating gate technology writes vs. 2D NAND*; UFS 2.1 provides superior data retention interface delivers 33% higher compared to charge trap g

4. Slide 4: Universal Flash Storage (UFS) 2.1 Interface

   Universal Flash Storage (UFS) 2.1 Interface UFS 2.1 Serial Interface  UFS 2.1 is the next-generation interface to the Read AND Write e.MMC 5.1 specification, delivering significantly faster random read speed performance Read UFS 2.1 – UFS uses a full duplex serial interface, allowing reading and Ho

5. Slide 5: Micron: World's Smallest 3D NAND Die

   Micron: World’s Smallest 3D NAND Die  Micron 8GB 3D NAND die measures 1y/1z planar 60.217mm2, making it the smallest 3D NAND on the market* Micron 3D NAND – ~30% smaller than 1y/1z planar NAND* – Enables ultra small form factor packaging such as 9x9mm ePOP or 8.5x11mm discrete UFS  Tiny memory pac

6. Slide 6: New Micron Mobile 3D NAND and UFS Products

   New Micron Mobile 3D NAND and UFS Products 32GB MULTICHIP PACKAGE AND DISCRETE MEMORY DEVICES Product Interface 3D NAND LPDRAM eMCP4 e.MMC 5.1 32GB MLC 3GB LPDDR4 eMCP4X e.MMC 5.1 32GB MLC 3GB LPDDR4X uMCP4X UFS 2.1 HS-G3 1L 32 GB MLC 3GB LPDDR4X Discrete UFS UFS 2.1 HS-G3 1L 32GB MLC N/A Micron 3D

7. Slide 7: 32GB 3D NAND Targeted for Volume "Sweet Spot"

   32GB 3D NAND Targeted for Volume “Sweet Spot” Represents $500+ $300- ~50% of $100- <$100 $499 smartphone $299 volume* Flagship High-End Mid-End Entry 4-6 GB+ RAM 3-4 GB+ RAM 2 GB RAM 1 GB+ RAM 64 GB+ NAND 32 GB+ NAND 16 GB+ NAND 8 GB+ NAND * Source: Micron © 2016 Micron Technology, Inc. |

8. Slide 8: Summary of 3D NAND Messages

   Summary of 3D NAND Messages 1. New Micron Mobile 3D NAND-based 32GB memory delivers leading UFS 2.1 random write memory device performance 2. Industry’s first mobile product built on floating gate technology—a proven cell technology that enables better performance, quality, and reliability 3. Introd

9. Slide 9: ACCELERAT3D

   q@icron — ACCELERAT > ==

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