Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Technical Presentation (May 2026)

64 slides from Infineon Technologies's technical presentation, May 2026

1. Slide 1: Automotive Traction Inverter Application Presentation

   Automotive Traction Inverter Application Presentation May 2026 Public 1

2. Slide 2: Market Trend Requirement

   Market Trend Requirement 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 2

3. Slide 3: Traction Inverter application at a glance

   Traction Inverter application at a glance Market TAM* (M€) Application ‒ Traction Inverter is the most essential part of electric drivetrain, its primary function is to covert the battery’s DC power into three phase AC power, enabling precise regulation of motor torque, speed and efficiency. ‒ Power

4. Slide 4: Infineon is the world leader in automotive semis

   Infineon is the world leader in automotive semis, serving all key applications and benefiting strongly from content growth Average semiconductor bill-of-material per car in 2024 and 2030 Semiconductors covered by Infineon Drivetrain applications: ~$1,650 per BEV (up to ~$2,500 for high-end car) ‒ Tr

5. Slide 5: Inverter vision: How to get there

   Inverter vision: How to get there Smart Charging Higher energy Right timing and utilization of performance renewable energies Energy Management 10% smaller battery Energy handling 10 kwh 10% more vehicles predictive driving Semiconductor Less dependability Efficiency in supply e.g. on Reduce power l

6. Slide 6: Traction Inverter is influenced by trends

   Traction Inverter is influenced by 4 trends: higher efficiency, cost optimization, right performance and vehicle integration Higher efficiency Cost optimization ‒ Partial load efficiency, ensure optimal energy ‒ Increase of power density to reduce cooling consumption as WLTP driving cycle effort and

7. Slide 7: Our understanding of Traction Inverter application

   Our understanding of Traction Inverter application Application requirements Typical challenges ‒ Increase Efficiency → Extend driving range ‒ Multiple-Motors with one Inverter, sometimes Inverter, OBC, BMS, VCU belong to X-in-1 architecture ‒ Cost Reduction → Affordability for all ‒ Cost reduction ‒

8. Slide 8: How does Infineon add value to the customer in Traction Inverter

   How does Infineon add value to the customer in Traction Inverter One Stop Shop Cost optimization Enable fast platform migration ‒ One Inverter, One Infineon, one ‒ Best performance cost ratio ‒ Market’s best scalability stop shop with more than 30 semi- through market leading power ‒ Broadest power

9. Slide 9: Semiconductors contribute to improved energy efficiency, size and weight reduction

   Semiconductors contribute to improved energy efficiency, but also to size and weight reduction, to improve the vehicle dynamics 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 9

10. Slide 10: Leveraging full potential based on power ratings and switching frequency

    Leveraging full potential based on the power ratings and switching frequency required by the application Comparison of technologies Si ‒ Si remains the mainstream technology Power [W] ‒ Targeting 25 V – 6.5 kV ‒ Suitable from low to high power 10 M SiC SiC 1M Central PV* ‒ SiC complements Si in many

11. Slide 11: Transition to WBG vastly differs by application

    Transition to WBG vastly differs by application with Si expected to remain technology of choice for many of them 2020 2030 xEV High power EV Charging SiC with advantage in high power switching Energy Solar Storage performance and power density Systems On-board Charger GaN superior switching performa

12. Slide 12: Infineon offers unparalleled expertise in semiconductor manufacturing

    Infineon offers unparalleled expertise in semiconductor manufacturing driving state-of-the-art technology World’s thinnest World’s largest World’s first silicon power wafer with 20 µm 200-millimeter silicon carbide 300-millimeter gallium nitride on a diameter of 300-millimeters (SiC) power Fab in Ku

13. Slide 13: Infineon pioneers world's first 300 mm power GaN technology

    Infineon pioneers world’s first 300 mm power gallium nitride (GaN) technology – an industry game-changer Higher system performance & increased cost-effectiveness through GaN technology Contribute to achieving cost Supply stability parity with silicon over time for business continuity Superior Value

14. Slide 14: Infineon's SiC superjunction technology sets new standards

    Accelerating electric vehicle adoption and industrial efficiency: Infineon's SiC superjunction technology sets new standards CoolSiC™ trench + SJ What was announced on 6 May 2025 40% improvement in RDS(on)*A − Based on a solid track record with SiC trench-based devices (CoolSiC™) and the position as

15. Slide 15: Success stories in Traction inverter

    Success stories In Traction inverter 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 15

16. Slide 16: AURIX TC4xx inside BMW starting 2030

    Infineon driving decarbonization and digitalization AURIX TC4xx inside BMW starting 2030 in various applications Business scenario − OEM: BMW AG − SOP: 2030 − Application: Traction Inverter, Battery Control Unit, ADAS Central Computing, Vehicle Motion Central Computing Product fitment Already won 1)

17. Slide 17: AURIX TC4x and Chip embedding receive two awards

    AURIXTM TC4x and Chip embedding receive two awards in World New Energy Vehicle Congress 2025 Global NEV Innovative Technology Global NEV Cutting-edge Technology AURIX™ TC4x and CoolSiCTM Chip Embedding Adopted in Traction Inverter application received two awards during world new energy vehicle congr

18. Slide 18: Rivian R2 platform powered by Infineon HybridPACK Drive G2

    Rivian R2 platform powered by Infineon HybridPACK Drive G2 as well as AURIX TC3xx and PMIC 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 18

19. Slide 19: Infineon and Stellantis collaborate on 1 Billion EURO business

    Through technology excellence and long term supply security Infineon and Stellantis collaborate on 1Billion EURO business Advantage of Infineon SiC For EV traction inverter, more efficiency and right performance are key. While IGBT is ideal for cost-optimized drive-train, SiC demonstrates higher eff

20. Slide 20: One Inverter One Infineon

    ‚One Inverter One Infineon‘ System solution Reference design 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 20

21. Slide 21: 30+ Infineon components inside Inverter Chipset Platform

    30+ Infineon components inside [Inverter Chipset Platform] seamless interoperability and functional integration Microcontrollers Functional Safety Current sensors › Multi-core device › Complementing and › AURIX™ TC49x or › Safety & security › XENSIV™ TLE4973 TC46x › AC current measurement interopera

22. Slide 22: Traction Inverter Architecture

    Traction Inverter Architecture Galvanic Isolation LV HV Redundant Isolated LV Battery Supply HV-LV DC-Link HV Battery Network DC/DC Power Management OPTIREGTM Supply and Gate Legend Flyback Engine Safety Pre-Regulators Supply Flyback Power Module Power Supply Rail Circuitry OPTIREGTM Circuitry or or

23. Slide 23: MSK: Main Inverter CoolSiC Kit

    MSK: Main Inverter CoolSiCTM Kit Feature Benefit › Inverter Control Board: › Multi core application with Peripheral Process Unit(PPU) AURIX™, I-PMIC, F- RAM, CAN FD to achieve superior performance › Safety concept with AURIXTM MCU+ I-PMIC for redundant safety actions › Resolver + private CAN for rot

24. Slide 24: One Inverter One Infineon for Commercial vehicle inverter

    EconoDUALTM Power kit ‘One Inverter One Infineon’ for Commercial vehicle inverter Feature Benefit 250kW output power for 800V/900A One Inverter, One Infineon: fast time to market CV traction inverter through system solution 1) EconoDUAL™ 3 1200V / 900A Development advantage through customized power

25. Slide 25: Commercial vehicle reference inverter power board

    Commercial vehicle reference inverter power board containing HybridPACK™ Heavy Duty (HD), EiceDRIVERTM 1EDI3035AS & XENSIVTM TLE4973 TLE4973 current sensor integrated in HybridPACK Featured Infineon products HD module FF01MR14A60MA2XT Power Modules (SP006072078) HybridPACK™ ‒ Automotive AQG324 quali

26. Slide 26: Discrete CoolSiC IDPAK based Main Inverter Demo

    Discrete CoolSiCTM IDPAK based Main Inverter Demo Feature Benefit − Inverter Power Stage − Discrete based inverter demo - showing flexibility and − 12xIDPAK G2PE CoolSiCTM scalability of inverter covering several power classes and − Current sensor XENSIV™ TLE4973 voltage levels. − Compatible with se

27. Slide 27: 3 Level T-Type Inverter – Next Step for High Efficiency EVs

    3 Level T-Type Inverter – Next Step for High Efficiency EVs Feature Benefit − Reducing battery costs up to 5% within WLTP − Higher electric motor efficiency driving cycle − Optimized commutation loops for 3-Level − Improved DC-Bus design operation, allowing better system €/Arms − Improved user frien

28. Slide 28: Power switches

    Power switches Module Discrete Bare Die 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 28

29. Slide 29: Solution space for electric drive trains is broadening

    Solution space for electric drive trains is broadening as new topologies offer system cost benefits 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 29

30. Slide 30: Scalable HybridPACK Drive G2 package enables Si, SiC & Fusion inverters

    Scalable HybridPACK™ Drive G2 package enables Si & SiC & Fusion inverters with maximum synergies in utilization 750V 1200 ~ 13xxV CoolSiC™ G2 FS02MR08 FS01M3R08 FS01MR08 FS00M9R08 FS03M1R12 FS03MR12 FS02MR12 FS01M5R13 FS01MR12 FS01M3R13 ~500-550Arms ~600-650Arms ~700-800Arms ~850-900Arms ~300-350Arm

31. Slide 31: HybridPACK Drive G2 SiC/SiC F3L01M6R12A14TMA3BLO

    Designed for 3 Level T-type Traction Inverter HybridPACK™ Drive G2 SiC/SiC F3L01M6R12A14TMA3BLO HybridPACK™ G2 T-Type SiC/SiC Features Voltage Current Power ‒ 3-level T-type topology with smoother output voltage Vces,dss [V] [Arms] [KW] ‒ Reduced Total Harmonic Distortion (THD) ‒ Reduced dv/dt to im

32. Slide 32: HybridPACK Drive G3s is high performing, scalable, compact

    HybridPACKTM Drive G3s is high performing, scalable, compact, robust, easy to integrate and offers optimum price/perfomance ratio Suitable for systems with State-of-the-art automotive SiC Broad portfolio technology battery voltage up to 950V (750V and 1200V modules with TM (CoolSiC Gen3P and trench-

33. Slide 33: HybridPACK Drive G3s & EiceDRIVER evaluation board

    HybridPACKTM Drive G3s & EiceDRIVERTM evaluation board for traction inverter application Feature Benefit New compact frame package, optimized to Optimum price / performance ratio for fully exploit the high performance of applications between 150kW and 250kW Automotive CoolSiCTM Gen3P technology up t

34. Slide 34: One Inverter, One Infineon, Hundred Platforms

    One Inverter, One Infineon, Hundred Platforms Flexible Designs for Efficient and Effective Integration ‒ Scale inverter systems to diverse vehicle Infineon’s discrete portfolio offers 750V and platforms and configurations, reducing 1200V VCEmax in the same IDPAK package . development cost and Time-t

35. Slide 35: 750 V/1200 V CoolSiC portfolios in ID-PAK

    750 V/1200 V CoolSiC™ portfolios in ID-PAK: for flexible and scalable designs Portfolio & samples timeline Features • Silver-prepared backside for sintering or soldering 750 V/1200 V Automotive CoolSiC™ MOSFET Portfolio in ID-PAK • Up to 3× lower stray inductance per switch vs kW/Product Power range

36. Slide 36: S-Cell Package: flexible solution for reliable SiC Embedding

    S-Cell Package: A flexible and high performing solution for a reliable SiC Embedding Enhanced SiC Performance ‒ Up to 5% better RDS_ON@25°C with IFX diffusion soldering technology ‒ Cutting edge CoolSiC™ Gen2p technology High Quality and Reliability ‒ Fully tested “discrete” device ensures high modu

37. Slide 37: SiC PCB Embedding: AIMCE120R011M2P1A

    Maximizing SiC potential for automotive traction inverter with SiC PCB Embedding: AIMCE120R011M2P1A Product features S-Cell Package and Die Layout ‒ 11 mΩ 1200 V CoolSiC™ Gen2p ‒ S-cell package and thick Cu front-side metallization for reliable embedding 1,27 mm ‒ Diffusion soldering die attach → 5%

38. Slide 38: S-Cell is a universal solution addressing all car segments

    Infineon's S-Cell is a universal solution, enabling maximum flexibility addressing all car segments Perfect (ideal) current sharing assumed 115 230 460 690 1150 Phase current Arms Arms Arms Arms Arms ** ** ** ** ** 75 150 300 450 750 Inverter power kW kW kW kW kW *** *** *** *** *** EG. A mini class

39. Slide 39: Automotive Product Portfolio of 1200V Gen2pE CoolSiC Bare Chips

    Automotive Product Portfolio of 1200V Gen2pE CoolSiC™ Bare Chips for Main Inverter Applications Voltage Die RDS,on Layout Metallization Customer benefits size (25°C) ‒ System cost-down due to SiC area reduction 32 mm² Solderable ‒ Various options for layout and metal stack 8 mΩ ‒ High performance wi

40. Slide 40: Sensors

    Sensors Current / position sensors 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 40

41. Slide 41: TLE4973 offers highest performance in smallest form factor

    TLE4973 offers highest performance in smallest form factor as stand- alone component or embedded module for today’s traction inverters TLE4973 As Stand-alone sensor Best Fit for lateral/vertical insertion in busbar TLE4973 RE35S5 VSON-6 TLE4975 in SSO4 (SOP Q2‘2026) › < ±1.35% accuracy for reliable

42. Slide 42: Swoboda current sensor module

    Swoboda current sensor module scalable for complete HybridPACK™ Drive G2 portfolio Core-less 12mm Sensor IC Bus bar Based on TLE4973 core-less technology Scalable for complete HybridPACK™ Drive G2 portfolio Core-based Sensor IC Flux Concentrator 23mm SOP Bus bar 4 May 2026 Public Copyright © Infineo

43. Slide 43: Space optimization Swoboda current sensor

    Space optimization Swoboda current sensor Easy platform migration ‒ Scalability cross whole HybridPACK™ Drive G2 portfolio ‒ Easy migration for preferred power segments Sensor IC Less cost & complexity Flux Concentrator ‒ Eliminate long tab ‒ No magnetic concentrator ‒ Reduce assembly time Bus bar 4

44. Slide 44: TLE4975 current sensor – smallest size and no module overhead cost

    TLE4975 current sensor – smallest size and no module overhead cost Moves straight into traction inverters Space saving Easy assembly ‒ No magnetic core, up to 17% ‒ No core, no cable, no connector space saving at inverter level ‒ Drop-in replacement to linear field ‒ Enable highest power density sen

45. Slide 45: HybridPACK Drive G2 and Current Sensor Module

    HybridPACK™ Drive G2 and Current Sensor Module Get started today! Product overview Product overview ‒ HybridPACK™ Drive family page ‒ TLE4973 AE35S5 VSON Product Page ‒ FS1150 LBC product page product page ‒ TLE4973 RE35D5 TDSO Product Page ‒ FS1150 LMC product page ‒ Swoboda current sensors product

46. Slide 46: EiceDRIVER Gate driver

    EiceDRIVERTM Gate driver 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 46

47. Slide 47: EiceDRIVER 1EDI304xAS - isolated gate driver for inverter

    EiceDRIVERTM 1EDI304xAS - isolated gate driver for inverter perfect fit for electrified vehicles addressing application requirements Fuel efficiency Cost optimization ‒ up to 50% switching loss savings ‒ up to 7% area saving with less especially at peak currents switching loss without increasing VDS

48. Slide 48: EiceDRIVER 1EDI304xAS – the most advanced gate driver

    EiceDRIVERTM 1EDI304xAS – the most advanced gate driver combining highest performance with lowest overall system cost Safely increase Advanced Add value with inverter efficiency system cost saving predictive maintenance Leading on-the-fly slew rate control to 11-Bit ADC measuring internal Accurate V

49. Slide 49: EiceDRIVER 3rd Generation Selection Tree

    EiceDRIVERTM 3rd Generation Selection Tree Configurable via SPI N Y Active Slew Rate Control Power Switch Technology Y IGBT SiC Flyback Controller included DESAT ADC Y N Y N Y N 1EDI3026AS 1EDI3025AS 1EDI3038AS 1EDI3035AS 1EDI3041AS 1EDI3040AS OCP instead ADC & current source Made for all SiC & Made

50. Slide 50: AURIX Microcontroller

    AURIXTM Microcontroller 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 50

51. Slide 51: AURIX TC3x and TC4x solutions for Inverters

    AURIX™ TC3x is the-state-of-the art solution for Inverters The Inverter of the future is enabled by AURIX™ TC4x AURIX™ solution TC3x TC4x Parallel Processing Unit (PPU), Observer/virtual → Virtual Sensing and Model predictive Sensor by AI Standard, e.g., Kalman filter control Enhanced Hypervisor & V

52. Slide 52: AURIX TC4x: The Scalable Backbone for Next-Gen e-Mobility in SDV

    AURIX TC4x: The Scalable Backbone for Next-Gen e-Mobility in SDV Inverter Key value: Modern algorithm enabling higher motor efficiency, OBC/DCDC system cost improvement with AI models and RDC removal... Key value: Integration in a single MCU and efficient Best product fits: TC4P, TC4E, TC46, TC49 Si

53. Slide 53: Inverter Innovation Enabled by TC3 and TC4

    Inverter Inovation Enabled by TC3 and TC4 Innovation to increase inverter + motor (system) efficiency Today’s inverter technology Future inverter technology Switching frequencies Higher switching frequencies reduce 10kHz 15kHz 30kHz losses in the motor SiC reduces the switching losses of Wide band g

54. Slide 54: AURIX TC4x Portfolio from Entry Level Inverter to X-in-1

    AURIXTM TC4x Portfolio from Entry Level Inverter to Highly Integrated X-in-1 Performance (#cores/LS + CSRM) 5/5 › High X-in-1 Integration TC49x +1 › High-end Inverter PPU 256 4/4 › Advanced Inverter TC46x +1 › Main Stream X-in-1 PPU 256 3/3 › Mainstream Standard TC4Ex +1 Inverter PPU 128 2/2 TC4Px ›

55. Slide 55: AURIX TC4x is enabling several Inverter solutions

    AURIX™ TC4x is enabling several Inverter solutions from optimization on Microcontroller up to innovation on system level TC37/TC38x * Detailed concept, see chapter 3/4 Multicore TC4Px 3x DSADC/CDSP -> angle based* CPU0 CPU1 + 3 x DS-ADC Resolver CPU0 CPU1 PPU 128b -> time based* eGTM* TC4Ex Virtuali

56. Slide 56: Parallel Processing Unit (PPU) enables affordable AI use cases

    Parallel Processing Unit (PPU) enables affordable artificial intelligence use cases Automotive AI Use Cases PPU accelerator Artificial Intelligence Domain/Zone Control SIMD vector DSP Co- & Neural Networks processor › Modelling › Model Predictive Control › IDPS & other security methods ADAS › Object

57. Slide 57: AURIX TC4x PPU is innovating Vehicle Motion Control

    AURIX™ TC4x PPU is innovating Vehicle Motion Control: Boosting Tracking Accuracy, Energy Efficiency & Driving Comfort AI Enhanced vehicle motion with AURIX™ TC4x is driving a test vehicle Decide Act Sensor Sense Object Understand Planned Calculation of Planned Follow the Actuator Perception of the S

58. Slide 58: Observers in AURIX TC4x

    Observers in AURIX™ TC4x PPU enables Artificial Intelligence in Inverter-Applications * Neural Network (NN) Example: B6-bridge and Motors AI Application Benefits − AI-possibilities in Inverter-applications: Position Sensor, Health Observer, Temperature Estimation − Virtual Sensors − Cost-savings: Vi

59. Slide 59: AURIX TC4x PPU Tj estimation enabling double-digit cost savings

    AURIX™ TC4x PPU Tj estimation in real-time is enabling double-digit cost savings on system level Details, see Level 2) presentation Today’s challenge ‒ As more precise Tj temperature of a power module can be estimated, the better the module can be utilized ‒ Current NTC sensors are not very accurate

60. Slide 60: OPTIREG PMIC

    OPTIREG PMIC Power management IC 4 May 2026 Public Copyright © Infineon Technologies AG 2026. All rights reserved. 60

61. Slide 61: XEV PMIC enables BOM and space saving integration

    XEV PMIC enables BOM and space saving integration Parallel Cost optimization processing Resolver PMIC power supply Resolver exciter 13€ 7€ Integration & less space 75% XEV PMIC space Supply and 800mm 200mm Engine Safety saving Pre-Regulators 2 2 Resolver Exc. 4 May 2026 Public Copyright © Infineon T

62. Slide 62: OPTIREG XEV PMIC TLE9744QK power supply solution

    OPTIREG™ XEV PMIC TLE9744QK is our new power supply solution for inverter application and will safe up to 6€ per BOM Solution with traditional Solution with XEV PMIC TLE9744XQK: Benefits general purpose PMIC: ‒ Only 1 device needed ‒ Adaptable for different ‒ At least 7 devices needed ‒ BOM cost ~ 1

63. Slide 63: Get started today with resources at your fingertips!

    Get started today with resources at your fingertips! Application overview ‒ Application homepage ‒ PV presentation NDA customer CV presentation NDA customer ‒ PV and CV fighting guide Reference designs & boards ‒ Hybridkit Gen2 CoolSiC ‒ EconoDUAL 250kw power kit for commercial and agricultural vehi

64. Slide 64: Cinfineon

    Cinfineon

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