Chipbond Technology — Online Investment Forum by Credit Suisse Virtual Meetings (January 2021)

14 slides from Chipbond Technology's conference presentation, Jan 6, 2021

Slide 1: Chipbond 2020
CHIPIOND 2020
Slide 2: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 3: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 4: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 5: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 6: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 7: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 8: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 9: Products by application: TV, Phone, NB/PC, RF
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v Film v
Slide 10: Applications
AGE ZNEIGIN |S Non Driver
Slide 11: 2019 Phones, TV, NB
2019 Phones TV NB 100 135 170 205 240
Slide 12: 2020F Phones, TV, NB
2020F Phones TV NB 100 135 170 205 240
Slide 13: Slide 13
Slide 14: TDDI
F TDDI • COF design • Longer test time • Larger die size