Atomera Incorporated · NASDAQ:ATOM
Atomera — Investor Presentation (September 2018)
22 slides from Atomera's investor presentation, September 2018
Slide 1: Investor Presentation September 2018
Investor Presentation September 2018 NASDAQ: ATOM 1
Slide 2: Note Regarding Forward-Looking Statements
Note Regarding Forward-Looking Statements This presentation contains forward-looking statements concerning Atomera Incorporated (““Atomera,” the “Company,” “we,” “us,” and “our”). The words “believe,” “may,” “will,” “potentially,” “estimate,” “continue,” “anticipate,” “intend,” “could,” “would,” “pr
Slide 3: Investment Overview
Investment Overview Mears Silicon Technology (MST®) is a semiconductor enhancement technology Improves electron mobility resulting in higher performance, lower power, and lower costs Capital-light IP licensing business Highly leverageable business model with strong cash position Robust and
Slide 4: Extending Moore's Law
Extending Moore’s Law The skyrocketing cost of new nodes MST: A way out FinFET MST can deliver a half to a full node of benefits 8 8 Extends life of depreciated fabs 7 7 Continues reducing the cost per transistor Cost per Million Gates (cents) 6 6 May solve problems in geometries smaller tha
Slide 5: MST Technology
MST Technology Potential Benefits • Improved Efficiency • Improved performance • Lower power consumption • Some combination of the two • Reduced Die Size • Lower power needs • Lower bottom line cost • Improved Yield • Less waste • Easier design parameters 5
Slide 6: Semiconductor Ecosystem
Semiconductor Ecosystem Process Equipment Wafer Fabrication Chip Makers / Sellers Development Manufacturers Foundries Integrated Device Manufacturers (IDM) Fabless Vertically Integrated Firms Supporting Ecosystem Semiconductor Equipment Manufacturers Electronic Design Automation Tools 6
Slide 7: Accelerating time to license
Accelerating time to license Customer Wafer Manufacturing Atomera MST® Deposition Customer MST® Deposition Phase 1 Phase 2 Phase3 Phase4 Phase 5 Phase 6 Planning Setup Integration Installation Qualification Production 1 TCAD 2 R&D Fab 3 Leased Epi Tool availability allows Reduces time and Simulation
Slide 8: Customer Engagement Pipeline
Customer Engagement Pipeline Number of Customer Engagements 18 15 12 9 6 3 0 IPO 3Q 16 4Q 16 1Q 17 2Q 17 3Q 17 4Q 17 1Q 18 2Q 18 Phase 1 Phase 2 Phase 3 • 14 customers, 18 engagements • Now engaged with 50% of the world’s top semiconductor makers* • * 10 of the top 20 (IC Insights, McClean Report 20
Slide 9: Early Installation Advantages
Early Installation Advantages Customer Wafer Manufacturing Atomera MST® Deposition Customer MST® Deposition Phase 1 Phase 2 Phase 3 Phase 4 Phase 5 Planning Setup Integration Qualification Production Phase 3+ Installation Significantly lowers cost of processing test wafers Speeds throughput by a
Slide 10: Largest Companies with fabs
Largest Companies with fabs Market Total Capacity - Total industry capacity 17.8M Company Type Segment Wf/mon. (200mm equ) 1 Samsung Semiconductor IDM Memory 2,598,750 2 TSMC Micron Technology Foundry IDM Logic Memory 2,012,317 1,540,500 wafers/month 3 Top 25 wafer capacity leaders 4 SK Hynix Fo
Slide 11: Atomera Business Opportunity
Atomera Business Opportunity License Fees Engineering Service Fees Royalties Example 1. Worldwide Average Fab1 Example 2. Leading Foundry, 40nm Fab Monthly Fab Capacity Monthly Fab Capacity 40,000 80,000 (wafers/month) (wafers/month) Wafer ASP $1,637 Wafer ASP $3,000 Annual Revenue Potential2 $7.9M
Slide 12: Technology and Market Segment
Technology and Market Segment Advanced 3D Planar Extension Leading Mainstream (12) United States Patent Mears et al. (10) Patent No.: (45) Date of Patent: US 9,941,359 B2 April 2018 Analog (54) SEMICONDUCTOR DEVICES WITH SUPERLATTICE AND PUNCH-THROUGH STOP (PTS) LAYERS AT DIFFERENT DEPTHS AND RELATE
Slide 13: Patent Portfolio
Patent Portfolio 22 New US Patents Applications Filed in 2017 Strong Patent Portfolio 61 Issued US Patents • • Covers core elements of MST • Constantly adding new patents MST CMOS Devices 5 • Discoverable and enforceable 7 • Infringement can be easily discovered MST Core Method and Devices using ele
Slide 14: Financials
Financials 2018 YTD 2017 Q2 2018 Q1 2018 Q4 2017 Q3 2017 Q2 2017 Q1 2017 GAAP Results Revenue $0.1M - $0.1M - - - Gross Profit ($0.02M) - $0.1M - - - Operating Expense ($3.2M) ($3.1M) ($2.7M) ($3.3M) ($3.7M) ($3.6M) Net Loss ($3.2M) ($3.1M) ($2.6M) ($3.3M) ($3.6M) ($3.5M) Loss Per Share ($0.26) ($0.
Slide 15: Summary
Summary High margin, recurring revenue financial model Well funded with strong cash position Solid progress with initial customers in pipeline Strong technology and patent position Experienced management team to execute business plan 15
Slide 16: Technology details
Technology details 16
Slide 17: TCAD Modelling Advantage
TCAD Modelling Advantage TCAD allows customers simulate MST quickly and inexpensively Measured Simulated Results Results Engages customers earlier to understand how to use MST Benefits Without Best integration techniques MST Frequently causes more ownership on customer side Builds early
Slide 18: Maximizing MST Performance
Maximizing MST Performance Technology and market segment Performance MST film Gain 100% End Oxygen Dose 7
Slide 19: Maximizing MST Performance (Next Gen film)
Maximizing MST Performance Technology and market segment Performance MST film Gain MST Next Gen film 100% End Oxygen Dose 8
Slide 20: MST and High-k/Metal gates
MST and High-k/Metal Technology and gates market segment • Tests conducted on MST by the University of Notre Dame • Results showed MST improved performance of High-k products • 23% mobility enhancement • 2.7x gate leakage reduction • High-k/Metal gate widely used in advanced manufacturing nodes 9
Slide 21: Backup
Backup 21
Slide 22: Market Segment Strategy
Market Segment Strategy Leading Analog Mainstream Leading Planar 3D Analog, PMIC, RF IoT, RF, Automotive DRAM; Digital Processors FinFET, Nanowire Big Players: TSMC, TI, NXP, ST Big Players: TSMC, UMC, Big Players: TSMC, GF, Big Players: Intel, TSMC, Micro SMIC, Global Foundries Samsung, Hynix, Micr